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HP BladeSystem c7000 Enclosure -
overview


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» HP Onboard Administrator

Overview

» Specifications

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» Key Benefits

The BladeSystem c7000 enclosure provides all the power, cooling, and I/O infrastructure needed to support modular server, interconnect, and storage components today and throughout the next several years. The enclosure is10U high and holds up to 16 server and/or storage blades plus optional redundant network and storage interconnect modules. It includes a shared, 5 terabit per second high-speed NonStop midplane for wire-once connectivity of server blades to network and shared storage. Power is delivered through a pooled-power backplane that ensures the full capacity of the power supplies is available to all server blades for maximum flexibility and redundancy. Power input flexibility is provided with choices of either single-phase, 3-Phase AC input and -48V DC Input.

Ideal environment

Introducing new fully configured models of the c7000 enclosure and new enclosure options .

Fully configured models
  • All software bundle models now have 10 Fans and 6 Power Supplies as standard
  • Support for a full enclosure of blades right out of the box
  • Less packaging for enclosure and options
New 94% efficient, Platinum level power supplies
  • Increased power supply efficiency to 94% (Platinum level efficiency)
  • 80Plus Platinum Certified
  • HP 2400W 92% efficiency Power Supply standard in all new models, with ability to upgrade to 94%
  • High-Line 200 to 240V support only
Onboard Administrator with KVM
  • New Onboard Administrator with KVM support
  • Up to 1.7x increase in performance
  • Compatible with existing Onboard Administrator
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