Overview

HP Compaq dc5750 Business PC

HP recommends
Windows Vista^® Business


Microtower

1.	(2) 5.25" external bays and (2) 3.5" internal bays	5.	(2) full-height PCI slots, (1) full-height PCIe x1 slot, (1) full-height PCIe x16 slot
2.	(1) 3.5" external bay for optional HP 16-in-1 Media Card Reader, diskette drive, or other 3.5" device	6.	Front I/O: (2) USB 2.0, headphone and microphone
3.	300-watt or 300-watt high efficiency 80 PLUS^® power supply	7.	2-Button Scroll Mouse (PS/2), Optical Scroll Mouse (PS/2 or USB), or USB Laser Mouse
4.	Rear I/O: (6) USB 2.0, (1) standard serial port, (1) optional serial port, (1) parallel port, (2) PS/2, (1) RJ-45, (1) VGA, audio in/out	8.	HP Standard Keyboard (PS/2 or USB) or HP USB Smartcard Keyboard
		9.	Monitor (sold separately)

Small Form Factor

1.	(1) 3.5" external bay for optional HP 16-in-1 Media Card Reader, diskette drive, or other 3.5" device; (1) 3.5" internal bay	6.	Front I/O: (2) USB 2.0, headphone and microphone
2.	(1) 5.25" external bay for optional optical drive, or other 5.25" device (bay tilts up for device removal and insertion)	7.	2-Button Scroll Mouse (PS/2), Optical Scroll Mouse (PS/2 or USB), or USB Laser Mouse
3.	240-watt or 240-watt high efficiency 80 PLUS power supply	8.	HP Standard Keyboard (PS/2 or USB) or HP USB Smartcard Keyboard
4.	Rear I/O: (6) USB 2.0, (1) standard serial port, (1) optional serial port, (1) parallel port, (2) PS/2, (1) RJ-45, (1) VGA, (1) DVI-D, audio in/out	9.	Monitor (sold separately)
5.	(2) low profile PCI slots, (1) low profile PCIe x1 slot, (1) low profile PCIe x16 slot

At A Glance

Designed to meet the needs of customers, across all market segments, looking for a stable solution to cover mainstream business needs.
Created using industry leading Design for Environment standards. Upgradeable, recyclable and energy efficient.
AMD Athlon™ 64 X2 Dual-Core, Athlon 64, and Sempron™ processors with HyperTransport™ technology
Support for AMD Enhanced Virus Protection™ and AMD Cool 'n Quiet™ technologies
ATI Radeon Express 1150 Chipset with integrated X300 graphics
Dual monitor support standard
RAID 0/1 support
Embedded TPM1.2 compliant security module* (Vista Bit-Locker ready)
Support for SMART III 3.0Gb/s Serial ATA hard drives
Value-added software available pre-installed on select models:
- HP ProtectTools Security Software Suite (purchased separately), including Credential Manager, Smart Card Manager, and BIOS Configuration
- HP Software Agent
- Altiris Deployment Solution Agent
- McAfee Anti-Virus with 60 day Live Update Subscription
- HP Backup and Recovery Manager
- Microsoft Office 2007
Value-added software available for free download from the Web (http://www.hp.com/go/easydeploy)
- HP Client Configuration Manager, Basic Edition
- HP Client Manager for Altiris
- Altiris Out-of-Band Management Solution
- HP SoftPaq Download Manager
- HP System Software Manager
- HP Client Catalog for Microsoft SMS
- Verdiem Surveyor remote power management agent
Fully compatible software OS image across all models (Microtower, Small Form Factor)
HP BIOS for security, manageability and software image stability
Standard 3-years parts, 3-years labor and 3-years on-site warranty services
(terms and conditions vary by country; certain restrictions and exclusions apply)
HP Insight Diagnostics software
Selected configurations with global availability easily set up and ordered through HP.com Business to Business portals (http://h10019.www1.hp.com/business-site/index.html)
Tailored HP Factory Express deployment and lifecycle services available
(http://h71028.www7.hp.com/enterprise/cache/97688-0-0-225-121.aspx)

* TPM module disabled where use is restricted by law; for example, Russia.

NOTE: All models and features may not be available in all countries.

Configurable Components - Select Models (localized by Regions)

Model Key and Example

NOTE: This diagram is an example that illustrates how to read the model number. It is not intended to give every available configuration choice specified in the body of this document and may include references to modules that are out of date and no longer available.

Standard Features and Configurable Components

Operating System – One of the following	Preinstalled	Genuine Windows Vista Business 32*
		Genuine Windows Vista Business 64*
		Genuine Windows Vista Home Basic 32*
		Genuine Windows XP Professional SP2
		Genuine Windows XP Home SP2
		FreeDOS^†
	Supported	Genuine Windows 2000
	* Certain Windows Vista product features require advanced or additional hardware. See: http://www.microsoft.com/windowsvista/getready/hardwarereqs.mspx and: http://www.microsoft.com/windowsvista/getready/capable.mspx for details. Windows Vista Upgrade Advisor can help you determine which features of Windows Vista will run on your computer. To download the tool, visit: http://www.windowsvista.com/upgradeadvisor.
	^†The following features are not supported by Linux: 1.2 TPM Embedded Security Chip integrated with Broadcom NIC HP 16-in-1 Media Card Reader HP Wireless A+G PCI Card HP BT450 USB Bluetooth Wireless Printer and PC Adapter Broadcom NetXtreme Gigabit Ethernet PCIe NIC Card 2006 Agere PCI 56K International SoftModem ATI Radeon X1300 (256MB SH) PCIe x16 Graphics Card ATI Radeon X1300 Pro (256MB DH) PCIe x16 Graphics Card ATI Radeon X1600XT (256MB DH FH) PCIe x16 Graphics Card ATI Radeon HD 2400XT (256MB DH) PCIe x16 Graphics Card HP USB Smartcard Keyboard HP 2nd Serial Port adapter HP FireWire / IEEE 1394 PCI Card

Value-added Software (on select models; not included with FreeDOS)	HP Backup and Recovery Manager	Microsoft Office 2007 Basic*
	HP Insight Diagnostics	Microsoft Office 2007 Personal*
	Computer Setup Utility	Microsoft Office 2007 Professional*
	McAfee Anti-Virus with 60 day Live Update Subscription	Microsoft Office 2007 Small Business*
	McAfee Anti-Virus with 60 day Live Update Subscription	Microsoft Works*
	Intervideo WinDVD 5 (select models)	Microsoft Internet Explorer with AOL Toolbar
	Sonic/Roxio DigitalMedia Plus 7.2 (select models) or Easy Media Creator 9 (select models)	PDF Complete*
		HP Software Agent
		Altiris Deployment Solution Agent
	* optional purchase

Value-added Software (available for free download from the Web http://www.hp.com/ go/easydeploy)	HP Client Configuration Manager, Basic Edition	HP Systems Software Manager
	HP Client Manager for Altiris	HP Client Catalog for Microsoft SMS
	Altiris Out-of-Band Management Solution	Verdiem Surveyor agent
	HP SoftPaq Download Manager

Value-added Services and Features	HP Stable Platform Program with Product Change Notification	Factory Express Deployment and Lifecycle Services
	Business-to-Business Portals	TPM 1.2* Vista Bit-Locker Ready
	HP Global Series Services	Tool-less Serviceability
	* TPM module disabled where use is restricted by law; for example, Russia.

Service and Support	On-site Warranty and Service ^{Note 1}: This three-year (3-3-3), limited warranty and service offering delivers three years of parts, labor and on-site repair. Response time is next business-day ^{Note 2} and includes free telephone support ^{Note 3} 24 x 7. Global coverage ^{Note 2} ensures that any product purchased in one country and transferred to another non-restricted country will remain fully covered under the original warranty and service offering. Some countries/regions do not offer one year onsite and labor.
	NOTE 1: Terms and conditions may vary by country. Certain restrictions and exclusions apply.
	NOTE 2: On-site service may be provided pursuant to a service contract between HP and an authorized HP third-party provider, and is not available in certain countries. Global service response times are based on commercially reasonable best effort and may vary by country.
	NOTE 3: Technical telephone support applies only to HP-configured, HP and HP-qualified, third-party hardware and software. Toll-free calling and 24 x 7 support may not be available in some countries.

	Microtower	Small Form Factor
Chassis Dimensions (H x W x D)	14.85 x 6.95 x 16.85 in (377 x 177 x 428 mm)	4.5 x 15.5 x 13.5 in (114 x 394 x 343 mm)
System weight*	23.44 lb (10.63 kg)	17.86 lb (8.10 kg)
System volume	1739 cu in (28,497.1 cu cm)	941.63 cu in (15,430.6 cu cm)
Shipping weight*	32.12 lb (14.57 kg)	26.70 lb (12.11 kg)
Shipping box dimensions (H x W x D)	12.0 x 19.76 x 23.62 in (305 x 502 x 600 mm)	9.72 x 19.68 x 22.67 in (247 x 500 x 576 mm)
* Configured with 1 hard drive, 1 optical drive, no diskette drive, and no PCI card.
Power Supply	300W power supply – passive PFC	240W power supply – passive PFC
80 PLUS Power Supply	300W 80 PLUS* power supply – active PFC	240W 80 PLUS* power supply – active PFC
* This alternate 80% efficient power supply is a requirement for ENERGY STAR compliance in conjunction with a select range of processors and modules.
Ports
USB 2.0	8 (2 front, 6 rear)	8 (2 front, 6 rear)
Serial	1 standard with 2^nd optional	1 standard with 2^nd optional
Parallel	1	1
PS/2	1 keyboard, 1 mouse	1 keyboard, 1 mouse
Video	analog for integrated graphics	analog for integrated graphics
DVI-D output	Integrated DVI-D output	Integrated DVI-D output
Support for Multi-Monitor	yes	yes
Audio	Front – mic and headphone Rear* – line in, line out	Front – mic and headphone Rear* – line in, line out
NIC (RJ-45)	Integrated Broadcom 5755 Gigabit Ethernet	Integrated Broadcom 5755 Gigabit Ethernet
NOTE:* Rear audio ports are re-taskable as Line-in, Line-out, or Microphone-in.

		MT	SFF
Chipset	ATI Express 1150 Chipset	X	X

Processor and Speed One of the following	AMD Sempron Processors with HyperTransport Technology:	MT	SFF
	AMD Sempron 3400+ Processor (1.8-GHz, 256K L2 cache, 1600-MHz FSB)	X	X
	AMD Sempron 3600+ Processor (2.0-GHz, 256K L2 cache, 1600-MHz FSB)	X	X
	AMD Sempron LE-1250 Processor (2.2-GHz, 512K L2 cache, 800-MHz FSB)	X	X
	AMD Athlon 64 Processors with HyperTransport Technology:
	Athlon 64 3500+ Processor (2.2-GHz, 512K L2 cache, 2000-MHz FSB)	X	X
	Athlon 64 3800+ Processor (2.4-GHz, 512K L2 cache, 2000-MHz FSB)	X	X
	AMD Athlon Single-Core Processors with HyperTransport Technology:
	AMD Athlon LE-1640B Processor (2.7-GHz, 512K L2 cache, HT bus 2.0)	X	X
	AMD Athlon X2 Dual-Core Processors with HyperTransport Technology:
	Athlon X2 BE-2350 Processor (2.1-GHz, 2x512K L2 cache, 2000-MHz FSB)	X	X
	AMD Athlon 64 X2 Dual-Core Processors with HyperTransport Technology:
	Athlon 64 X2 Dual-Core 3800+ Processor (2.0-GHz, 2x512K L2 cache, 2000-MHz FSB)	X	X
	Athlon 64 X2 Dual-Core 4000+ Processor (2.1-GHz, 2x512K L2 cache, 2000-MHz FSB)	X	X
	Athlon 64 X2 Dual-Core 4200+ Processor (2.2-GHz, 2x512K L2 cache, 2000-MHz FSB)	X	X
	Athlon 64 X2 Dual-Core 4400+ Processor (2.3-GHz, 2x512K L2 cache, 2000-MHz FSB)	X	X
	AMD Athlon X2 4450B Processor (2.3-GHz, 1MB L2 cache, HT bus 2.0)	X	X
	Athlon 64 X2 Dual-Core 4600+ Processor (2.4-GHz, 2x512K L2 cache, 2000-MHz FSB)	X	X
	Athlon 64 X2 Dual-Core 4800+ Processor (2.5-GHz, 2x512K L2 cache, 2000-MHz FSB)	X	X
	Athlon 64 X2 Dual-Core 5000+ Processor (2.6-GHz, 2x512K L2 cache, 2000-MHz FSB)	X	X
	AMD Athlon X2 5000B Processor (2.6-GHz, 1MB L2 cache, HT bus 2.0)	X	X
	Athlon 64 X2 Dual-Core 5200+ Processor (2.6-GHz, 2x1MB L2 cache, 2000-MHz FSB)	X	X
	AMD Athlon X2 5200B Processor (2.7-GHz, 1MB L2 cache, HT bus 2.0)	X	X
	AMD Athlon X2 5400B Processor (2.8-GHz, 1MB L2 cache, HT bus 2.0)	X	X
	Athlon 64 X2 Dual-Core 5600+ Processor (2.8-GHz, 2x1MB L2 cache, 2000-MHz FSB)	X	X
	Athlon 64 X2 Dual-Core 6000+ Processor (3.0-GHz, 2x1MB L2 cache, 2000-MHz FSB)	X	X

Memory

DDR2 SYNCH DRAM NON-ECC MEMORY
Memory upgrades are accomplished by adding single or multiple DIMMs of the same or varied sizes. This chart does not represent all possible memory configurations. Memory DIMMS must be populated beginning with DIMM slot 4 (Channel B) or DIMM slot 3 (Channel A). Slot 4 must be populated before slot 2, and slot 3 must be populated before slot 1.

HP recommends dual-channel configurations for maximum performance.
For best performance, place matching DIMMs in black memory slots 4 and 3 (and in white memory slots 2 and 1 if used). Matching DIMMs have the same size, speed, and number of memory chips. If the slot pairs are not matched, all the memory is still used, but the system will operate in single-channel mode. If speeds are mixed, speed will default to the slowest DIMM.

Microtower and Small Form Factor

Maximum Memory	Supports up to 8 GB of DDR2 Synch DRAM. Not all memory configurations possible are represented below. NOTE: For systems configured with more than 3 GB of memory and a 32-bit operating system, all memory may not be available due to system resource requirements. Addressing memory above 4 GB requires a 64-bit operating system.

DIMM Size	Slot
	WHITE		BLACK
	1 (Channel A)	2 (Channel B)	3 (Channel A)	4 (Channel B)
256-MB				256-MB
512-MB				512-MB
512-MB (dual-channel)			256-MB	256-MB
1-GB				1-GB
1-GB (dual-channel)			512-MB	512-MB
2-GB (dual-channel)	512-MB	512-MB	512-MB	512-MB
3-GB (dual-channel)	512-MB	512-MB	1-GB	1-GB
4-GB (dual-channel)	1-GB	1-GB	1-GB	1-GB
8-GB (dual-channel)	2-GB	2-GB	2-GB	2-GB

		MT	SFF
Memory Configurations One of the following	512-MB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (1 x 512)	X	X
	1-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (1 x 1GB)	X	X
	1-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (2 x 512)	X	X
	2-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (2 x 1GB)	X	X
	2-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (1 x 2GB)	X	X
	4-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (2 x 2GB)	X	X
	8-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (4 x 2GB)	X	X
	256-MB DDR2 Synch Dram PC2-5300 (667-MHz) Non ECC (1 x 256)	X	X
	512-MB DDR2 Synch Dram PC2-5300 (667-MHz) Non ECC (1 x 512)	X	X
	512-MB DDR2 Synch Dram PC2-5300 (667-MHz) Non ECC (2 x 256)	X	X
	1-GB DDR2 Synch Dram PC2-5300 (667-MHz) Non ECC (2 x 512)	X	X
	1-GB DDR2 Synch Dram PC2-5300 (667-MHz) Non ECC (1 x 1GB)	X	X
	2-GB DDR2 Synch Dram PC2-5300 (667-MHz) Non ECC (4 x 512)	X	X
	2-GB DDR2 Synch Dram PC2-5300 (667-MHz) Non ECC (2 x 1GB)	X	X
	3-GB DDR2 Synch Dram PC2-5300 (667-MHz) Non ECC (2 x 512, 2 x 1GB)	X	X
	4-GB DDR2 Synch Dram PC2-5300 (667-MHz) Non ECC (4 x 1GB)	X	X

Expandability	Microtower	Small Form Factor
PCI slots	2 Full Length 5V 32 bit PCI slots	2 LP 5V 32 bit PCI slots
Max power per slot	25W	25W
PCIe x1 slot	1	1
Max power per slot	10W	10W
PCIe X16 slot	1 Full Height card	1 LP profile card
Max power per slot	75W	25W
External Bays
3.5”	1	1
5.25”	2	1
IDE
Internal 3.5” HDD Bays	2	1
Hard Drive Controller (SATA) Supported	SATA	SATA
Hard Drive Interfaces Supported	SATA 3.0Gb/s	SATA 3.0Gb/s

Microtower	Small Form Factor

Drive Support
	Microtower			Small Form Factor
	Media Card Reader or Diskette Drive (optional)	5.25” Serial ATA Devices	3.5” Serial ATA Devices	Media Card Reader or Diskette Drive (optional)	5.25” Serial ATA Devices	3.5” Serial ATA Devices
Quantity Supported	1	2	2	1	1	2
Position Supported		,	,,			,
Controller	USB/Diskette	SATA	SATA	USB/Diskette	SATA	SATA

		MT	SFF
Hard Drive One or two of the following	80-GB SATA 3.0-Gb/s Hard Drive (7200 rpm)	X	X
	160-GB SATA 3.0-Gb/s Hard Drive (7200 rpm)	X	X
	250-GB SATA 3.0-Gb/s Hard Drive (7200 rpm)	X	X
	Removable 3.5” 80GB SATA 3.0 Gb/s (7200 rpm)	X	X
	80-GB SATA 3.0-Gb/s Hard Drive (10,000 rpm)	X	X
	160-GB SATA 3.0-Gb/s Hard Drive (10,000 rpm)	X	X
	Removable 3.5” 160GB SATA 3.0 Gb/s (7200 rpm)	X	X
	Removable 3.5” 250GB SATA 3.0 Gb/s (7200 rpm)	X	X
	RAID 80-GB SATA 3.0-Gb/s Hard Drive (7200 rpm)	X	X
	RAID 160-GB SATA 3.0-Gb/s Hard Drive (7200 rpm)	X	X
	RAID 250-GB SATA 3.0-Gb/s Hard Drive (7200 rpm)	X	X
	2^nd hard drive, 80-GB SATA 3.0-Gb/s Hard Drive (7200 rpm)	X	X
	2^nd hard drive, 160-GB SATA 3.0-Gb/s Hard Drive (7200 rpm)	X	X
	2^nd hard drive, 250-GB SATA 3.0-Gb/s Hard Drive (7200 rpm)	X	X

Removable Storage One or more of the following depending on form factor (see Storage – Drive Support section above)	Diskette Drives
	1.44-MB Diskette Drive	X	X
	Media Reader
	HP 16-in-1 Media Reader (USB connection on the system board)	X	X
	Optical Drives
	SATA DVD-ROM Drive¹	X	X
	SATA CD-RW/DVD-ROM Combo Drive^1,2	X	X
	SATA DVD+/-RW (DL/DF) LightScribe Drive^1,2,3	X	X
	SATA SuperMulti LightScribe DVD Writer Drive^1,2,3	X	X
	¹ For playing DVDs, InterVideo WinDVD 5 ² For writing CDs, choice of Sonic/Roxio DigitalMedia Plus 7.2 (Windows XP only) or Easy Media Creator 9 (Windows Vista and Windows XP) ³ For writing CDs and DVDs, video editing and authoring DVDs, choice of Sonic/Roxio DigitalMedia Plus 7.2 (Windows XP only) or Easy Media Creator 9 (Windows Vista and Windows XP)

Security	1.2 TPM Embedded Security Chip* integrated with Broadcom NIC	X	X
	HP ProtectTools Security Software Suite with BIOS Configuration (Serial, Parallel, USB Enable/Disable), Credential Manager, Smart Card Manager	X	X
	HP Desktop Security lock kit (lock and cable)	X	X
	Security cable with Kensington lock	X	X
	* TPM module disabled where use is restricted by law; for example, Russia.

NIC	Broadcom 5755 Gigabit Ethernet integrated on system board	X	X

Wireless	Wireless A+G PCI Card (full height bracket)	X
Wireless	Wireless A+G PCI Card (low profile bracket)		X

Modem	2006 Agere PCI 56K International SoftModem (full height)	X
Modem	2006 Agere PCI 56K International SoftModem (low profile)		X

Graphics	Integrated ATI Radeon X300 graphics with VGA and DVI-D	X	X
	ATI Radeon X1300 (256MB SH) PCIe x16 Graphics Card	X	X
	ATI Radeon X1300 Pro (256MB DH) PCIe x16 Graphics Card	X	X
	ATI Radeon X1600XT (256MB DH FH) PCIe x16 Graphics Card	X
	ATI Radeon HD 2400XT (256MB DH) PCIe x16 Graphics Card	X	X
	ATI Radeon HD 3650 (512MB DH) PCIe x16 Graphics Card	X

Audio	Integrated High Definition audio with Realtek 2 channel ALC260 codec (all ports are stereo)	X	X
	Microphone and Headphone front ports	X	X
	Line-out and Line-In rear ports*	X	X
	Aux Input connection on system board	X	X
	Internal Speaker	X	X
	* Rear audio ports are re-taskable as Line-in, Line-out, or Microphone-in. External speakers must be powered externally.

Input Devices	Keyboard – One of the following
	HP PS/2 Standard Keyboard	X	X
	HP USB BG1650 Keyboard	X	X
	HP USB Standard Keyboard	X	X
	HP USB Smartcard Keyboard	X	X
	Mouse – One of the following
	USB 2-Button Laser Mouse	X	X
	HP PS/2 2-Button Scroll Mouse	X	X
	HP PS/2 2-Button Optical Scroll Mouse	X	X
	HP USB 2-Button Optical Scroll Mouse	X	X

Miscellaneous	HP FireWire / IEEE 1394 PCI Card (full height)	X
	HP FireWire / IEEE 1394 PCI Card (low profile)		X
	2nd serial port adapter	X
	2nd serial port adapter (low profile)		X
	Tower stand		X
	1-GB Flash Module for ReadyBoost	X	X

After-Market Options (availability may vary by region)

		MT	SFF	Part Number
Communications	Wireless LAN
	HP Wireless A+G PCI Card (North America only)	X	X	EA118AA
	HP Wireless A+G PCI Card (WW except North America)	X	X	PZ928AA
	HP BT450 USB Bluetooth Wireless Printer and PC Adapter	X	X	IPQ639A
	NICs
	Broadcom NetXtreme Gigabit Ethernet PCIe NIC Card	X	X	EA833AA
	Modem
	Agere 2006 PCI 56K International Modem	X	X	EK694AA

Graphics	Single head solutions
	ATI Radeon X1300 Pro (256MB SH) PCIe Graphics Card	X	X	AG392AA
	Multi head solutions
	ATI Radeon X1300 Pro (256MB DH) PCIe Graphics Card	X	X	AH050AA
	ATI Radeon HD 2400XT (256MB DH) PCIe Graphics Card	X	X	KD060AA
	ATI Radeon HD 3650 (512MB DH) PCIe x16 Graphics Card	X		KS505AA

Hard Drives	HP 80-GB SATA 3.0-Gb/s Hard Drive	X	X	PY276AA
	HP 160-GB SATA 3.0-Gb/s Hard Drive	X	X	PY277AA
	HP 250-GB SATA 3.0-Gb/s Hard Drive	X	X	PY278AA

Input/Output Devices	HP PS/2 Standard Keyboard	X	X	DT527A
	HP USB Standard Keyboard	X	X	DT528A
	HP USB BG1650 Standard Keyboard	X	X	DT529A
	HP USB Smartcard Keyboard	X	X	ED707AA
	HP USB 2-Button Laser Mouse	X	X	GW405AA
	HP PS/2 2-Button Scroll Mouse	X	X	DD440B
	HP USB 2-Button Scroll Mouse (Carbonite)	X	X	DD441B
	HP USB 2-Button Optical Scroll Mouse (Carbonite/Silver)	X	X	DC172

Memory (DIMMs)	PC2-5300 (DDR2, 667 MHz) DIMMs Non-ECC
	HP 2 GB PC2-5300 (DDR2-667) DIMM	X	X	PX977AA
	HP 1 GB PC2-5300 (DDR2-667) DIMM	X	X	PX976AA
	HP 512 MB PC2-5300 (DDR2-667) DIMM	X	X	PX975AA
	HP 256 MB PC2-5300 (DDR2-667) DIMM	X	X	PX974AA

Monitors	TFTs
	HP L1506 15 TFT Flat Panel Monitor – Analog only	X	X	PX848AA#xxx
	HP L1706 17 TFT Flat Panel Monitor – Analog only	X	X	PX849AA#xxx
	HP L1740 17 TFT Flat Panel Display – Analog/Digital	X	X	PL766AA#xxx
	HP L1755 17 TFT Flat Panel Display – Analog/Digital	X	X	PL777AA#xxx
	HP L1906 19 TFT Flat Panel Display – Analog only	X	X	PX850AA#xxx
	HP L1940T 19 TFT Flat Panel Display – Analog/Digital	X	X	EM869AA#xxx
	HP L1955 19 TFT Flat Panel Display – Analog/Digital	X	X	PD974AA#xxx
	HP L2065 20 TFT Flat Panel Display – Analog/Digital	X	X	EF227A4#xxx
	HP LP2465 24 TFT Widescreen Flat Panel Display – Analog/Digital	X	X	EF224A4#xxx
	15-inch Touch Screen Flat Panel Display	X	X	RB146AA#xxx
	CRTs
	HP s7540 17 (16.0 vis) CRT Monitor	X	X	PF997AA#xxx
	HP v7650 17 (16.0 vis) Flat-face CRT Monitor	X	X	PF996AA#xxx

Multimedia	HP Satellite Speakers – Silver	X	X	ZD929AA
Multimedia	HP Thin USB Powered Speakers	X	X	KK912AA

Optical Drives	DVD-ROM Drive
	HP SATA DVD-ROM Drive	X	X	AH047AA
	Combo Drive
	HP SATA CD-RW/DVD-ROM Combo Drive	X	X	AH046AA
	DVD+/-RW Drive
	HP SATA DVD+/-RW (DL/DF) LightScribe Drive	X	X	AH048AA

Removable Storage	Drive Key Options
	HP 512MB USB 2.0 Drive Key	X	X	ED516AA
	HP 1GB USB 2.0 Drive Key	X	X	AG382AA
	Diskette and Digital Drives
	HP 1.44-MB External USB Diskette Drive	X	X	DC141B
	HP 1.44-MB Internal Diskette Drive	X	X	AH053AA
	Multimedia
	HP 16-in-1 Media Card Reader	X	X	EM718AA

Security	Kensington Lock	X	X	PC766A
	HP Business PC Security Lock	X	X	EV265AA
	HP USB Smartcard Keyboard	X	X	ED707AA

Manageability	HP Client Configuration Manager, Premium Edition	X	X	T3488AA (use T3489AA for 1000 licenses)
Manageability	Altiris Client Management Suite Level 1 Includes: Altiris Deployment Solution Altiris Inventory Solution Altiris Application Metering Solution Altiris Carbon Copy Solution Altiris Software Delivery Solution Altiris Application Management Solution Altiris Patch Management Solution	X	X	DR605A (use DR606A for 1000+ licenses)

Miscellaneous Accessories	HP 2nd Serial Port adapter	X	X	PA716A
	Belken USB to Serial Adapter	X	X	EM449AA
	HP FireWire / IEEE 1394 PCI Card	X	X	PA997A

Technical Specifications

Unit Environment and Operating Conditions	Microtower	Small Form Factor
General Unit Operating Guidelines (Need this updated for dc5750) Keep the computer away from excessive moisture, direct moisture and the extremes of heat and cold, to ensure that unit is operated within the specified operating range. Leave a 4 in (10.2 cm) clearance on all vented sides of the computer to permit the required airflow. Never restrict airflow into the computer by blocking any vents or air intakes. Do not stack computers on top of each other or place computers so near each other that they are subject to each other's re-circulated or preheated air. Occasionally clean the air vents on the front, back, and any other vented side of the computer. Lint, dust and other foreign matter can block the vents and limit the airflow. If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must be provided on the enclosure, and the same operating guidelines listed above will still apply.
Temperature Range	Operating: 50° to 95° F (10° to 35° C)* Non-operating: -22° to 140° F(-30° to 60° C)
Relative Humidity	Operating: 10% to 90% (non-condensing at ambient) Non-operating: 5% to 95% (non-condensing at ambient)
Maximum Altitude (unpressurized)	Operating: 10,000 ft (3048 m) Non-operating: 30,000 ft (9144 m)
*NOTE: Operating temperature is de-rated 1.0 deg C per 300 m (1000 ft) to 3000 m (10,000 ft) above sea level, no direct sustained sunlight. Maximum rate of change is 10 deg C/Hr. The upper limit may be limited by the type and number of options installed.

	Microtower		Small Form Factor
Power Supply	300-watt BTX power supply – Passive PFC 115v/230v line switch	300-watt 80 PLUS* BTX power supply – Active PFC	240-watt BTX power supply – Passive PFC 115v/230v line switch	240-watt 80 PLUS* BTX power supply – Active PFC
Operating Voltage Range	90 to 132VAC, or 180 to 264VAC	90 to 264VAC	90 to 132VAC, or 180 to 264VAC	90 to 264VAC
Rated Voltage Range	100 to 127VAC, or 200 to 240VAC	100 to 240VAC	100 to 127VAC, or 200 to 240VAC	100 to 240VAC
Rated Line Frequency	50/60 Hz	50/60 Hz	50/60 Hz	50/60 Hz
Operating Line Frequency Range	47–63 Hz	47–63 Hz	47–63 Hz	47–63 Hz
Rated Input Current	8A/4A	5A/2.5A	6A/3A	3.5A/1.75
Heat Dissipation	Typical 315 btu/hr (79 kg-cal/hr) Maximum 1575 btu/hr (397 kg-cal/hr)	Typical 270 btu/hr (68 kg-cal/hr) Maximum 1280 btu/hr (322 kg-cal/hr)	Typical 315 btu/hr (79 kg-cal/hr) Maximum 1260 btu/hr (317 kg-cal/hr)	Typical 270 btu/hr (68 kg-cal/hr) Maximum 1025 btu/hr (258 kg-cal/hr)
Power Supply Fan	Variable speed fan	Variable speed fan	Variable speed fan	Variable speed fan
ENERGY STAR Compliant		X		X
FEMP Standby Power Compliant (<2W in S5 – Power Off)**	X	X	X	X
Power Consumption in ES Mode – Suspend to RAM (S3) (Instantly Available PC)	<4W	<3W	<4W	<3W
NOTES: * This 80% efficient power supply is a requirement for ENERGY STAR compliance in conjunction with a select range of processors and modules. ** Power consumption in the Off/Apparent Off mode is measured and reported with the network interface controller "Wake on LAN" feature disabled in F10 Setup (default is "enabled").

ROM BIOS Information

Key features of the HP BIOS in the dc5750 include:

Deployment and manageability – HP BIOS provides several technologies that help integrate the HP Business desktop computer into the enterprise, such as PXE, remote configuration, remote control, and F10 Setup support for 12 languages.
Stability – HP BIOS supports the HP stable product roadmap by releasing only critical BIOS changes to the factory and advanced change notification.
Security – HP BIOS offers a robust and flexible set of security features to help the system administrator secure their systems from removal of sensitive data, and help prevent access by unauthorized users, subversion of OS security policies, removal of hardware, flash of rogue BIOS images, and attacks on BIOS settings.
Thermal and power management – The HP BIOS provides and enables thermal and power management technologies to assist in operating the HP Business Desktop computer in any enterprise environment.
Serviceability – HP BIOS provides diagnostic and detailed service information.
Upgrades and recovery – HP BIOS provides numerous ways to upgrade HP Business Desktop computers, including BIOS updates from within DOS (Flashlite), BIOS updates from within Windows (HPQFlash, SSM), HP Client Manager, and fail-safe recovery. In addition, the HP Business Desktop BIOS Utilities tool enables replicated BIOS setup throughout the Enterprise; it is available from within the BIOS software and from the support website.

Additional HP BIOS Features

Administrator password – Also known as the setup password, this helps prevent unauthorized changes to the system configuration. If the administrator password is not known, the BIOS version cannot be changed and changes cannot be made to BIOS settings using F10 setup or under the OS.
Advanced Configuration and Power Interface (ACPI) – Represents a significant innovation in power and configuration management, allowing operating systems and applications to manage power based on activity and usage. HP Compaq dc5750 models use ACPI to provide power conservation features under Windows XP.

Other Features	Description
ACPI-Ready Hardware	Advanced Configuration and Power Management Interface (ACPI). Allows the system to wake from a low power mode. Controls system power consumption, making it possible to place individual cards and peripherals in a low-power or powered-off state without affecting other elements of the system.
SMBIOS Ver. 2.4	System Management BIOS, previously known as DMI BIOS, for system management information
AMD Cool 'n Quiet	A setting in F10 Setup allows the system to automatically adjust the CPU speed, voltage and power combination to match the instantaneous user performance need. The AMD driver for this feature requires Windows XP SP2.
Dual-State Power Button	Power button acts as both an on/off button and suspend-to-sleep button

Serviceability Features of System
Dual Color Power LED on Front of Computer (Indicates Normal Operations and Fault Conditions)
Diagnostic LED Explanation Table	Number of 1-second red LED blinks followed by 2-second pause, then repeats: 2-processor thermal protection activated 3-processor not installed 4-power supply failure 5-memory error 6-video error 7-PCA failure (ROM detected failure prior to video) 8-invalid ROM, bootblock recover mode
System/Emergency ROM	Flash ROM	CMOS Battery Holder for easy Replacement
Flash Recovery with Video	5 Aux Power LED on System PCA	Processor ZIF Socket for easy Upgrade
Over-Temp Warning on Screen (Requires IM Agents)	Clear Password Jumper	DIMM Connectors for easy Upgrade
Restore CD	Clear CMOS Button	NIC LEDs (integrated) (Green & Amber)

Serviceability Features of Chassis
Dual Color Power and HD LED – To Indicate Normal Operations and Fault Conditions	Color coordinated cables and connectors	Tool-less Hood Removal
Front power switch	System memory can be upgraded without removing the system board or any internal components	Tool-less Hard Drive, CD & Diskette Removal

Feature	Description
ASF 2.0 support (Alert Standard Format)	Industry-standard specification for network alerting and remote control in operating system-absent environments
Towerable	Product can be oriented as a tower (in addition to desktop orientation)
Drive Self Tests (DPS)	Drive Protection System A diagnostic hard drive self test. It scans critical physical components and every sector of the hard drive for physical faults and then reports any faults to the user. Running independently of the operating system, it can be accessed through a Windows-based diagnostics utility or through the computer's setup procedure. It produces an evaluation on whether the hard drive is the source of the problem and needs to be replaced. The system expands on the Self-Monitoring, Analysis, and Reporting Technology (SMART), a continuously running systems diagnostic that alerts the user to certain types of failures.
DPS Access through F10 Setup during Boot
SMART Technology* (Self-Monitoring, Analysis and Reporting Technology)	Allows hard drives to monitor their own health and to raise flags if imminent failures were predicted Predicts failures before they occur. Tracks fault prediction and failure indication parameters such as re-allocated sector count, spin retry count, calibration retry count By avoiding actual hard drive failures, SMART hard drives act as "insurance" against unplanned user downtime and potential data loss from hard drive failure
SMART I – Drive Failure Prediction
SMART II – Off-Line Data Collection
SMART III – Off-Line Read Scanning with Defect Reallocation
* This feature is inoperable when a RAID (Redundant Array of Independent Disks) configuration is enabled.

Technical Specifications - Audio

High Definition Audio	Type	Integrated
	High Definition Stereo Codec	Yes – Realtek ALC260
	Audio Jacks	Microphone-In (64-K ohm Input Impedance)
		Line-In (64-K ohm Input Impedance)
		Line-Out * (200 ohms Output Impedance, expects at least a 10-K ohm load)
		Headphone-Out (1 Ohm Output Impedance, expects at least a 32 ohm load)
	NOTE: *Internal Speaker Amplifier is for Internal Speaker only. External Speakers need to be powered externally. Rear audio ports are re-taskable as Line-in, Line-out, or Microphone-in.
	Sampling	8 kHz – 192 kHz
	Wavetable Syntheses (software)	Yes – Uses OS soft wavetable
	Analog Audio	Yes
	Number of Channels on Line-Out (mono/stereo)	Stereo (Left & Right channels)
	Internal Audio Speaker Power Rating	1.5 W
	Internal Speaker	Yes; ability to mute internal speaker through F10 Setup
	External Speaker Jack (Line-Out)	Yes

HP Thin USB Powered Speakers	On/Off/Volume Controls	Right side of right speaker
	Power LED	Front of right speaker (green)
	Frequency response	FO to 20kHz
	Watts	2/3 watt (normal/maximum)
	Dimensions (H x W x D)	Speakers: 5.72 x 3.74 x 0.96 in (14.52 x 9.50 x 2.45 cm) per speaker
	Net weight	0.68 lbs (0.31kg)
	Environmental (all conditions non-condensing)	Temperature (operating)	14° to 104° F (-10° to 40° C)
		Relative Humidity (operating)	40% to 90%
	Speaker cable length	Input cord: 5.91 ft (1800mm±35mm)
		L-channel cord: 3.28 ft (1000mm±35mm)
		USB cord: 5.91 ft (1800mm±35mm)
	Color	HP Carbonite

Technical Specifications - Communications

Integrated Broadcom 5755 Gigabit Ethernet	Connector	RJ-45
	Controller	Broadcom 5755 PCI-Express LAN Controller
	Memory	Integrated 96Kb on chip buffer memory
	Data rates supported	10/100/1000 Mbps
	Compliance	IEEE 802.1P, 802.1Q, 802.2, 802.3, 802.3AB and 802.3u compliant, 802.3x flow control
	Bus architecture	PCI-E
	Data path width	Single channel, PCI-E
	Data transfer mode	Bus-master DMA
	Hardware certifications	FCC, B, CE, TUV- cTUVus Mark Canada and United States, TUV- GS Mark for European Union
	Power requirement	1.33 watts @ +3.3V AUX supply with 5V tolerance
	Boot ROM support	Yes
	Network transfer mode	Full-duplex
		Half-duplex (not available for the 1000BASE-T transceiver)
	Network transfer rate	10BASE-T (half-duplex) 10 Mbps
		10BASE-T (full-duplex) 20 Mbps
		100BASE-TX (half-duplex) 100 Mbps
		100BASE-TX (full-duplex) 200 Mbps
		1000BASE-T (full-duplex) 2000 Mbps
	Environmental	Operating temperature	32° to 131°F (0° to 55° C)
		Operating humidity	85% at 131° F (55° C)
	Management capabilities	ASF 2.0, ACPI, WOL and DMI 2.0, PXE 2.0, WfM 2.0, Broadcom mgmt utility
	Alerting	ASF 2.0

HP Wireless A+G PCI	Dimensions	4.99 x 2.54 x 0.71 in (126.8 x 64.4 x 18.0 mm)
	Weight	0.268 lb (65 g)
	Controller system interface	Atheros AR5414X chipset PCI Spec 2.2
	Network standard	IEEE 802.11a/b/g
	Frequency band	5.1500 to 5.8500 GHz
		2.4000 to 2.4835 GHz
		2.4465 to 2.4835 GHz (Europe, Middle East, Asia and Asia Pacific - excluding Japan)
		2.4000 to 2.4697 GHz (Japan)
	Operating temperature	32° to 140° F (0° to 60° C), operating
	Storage temperature	-4° to 176° F (-20° to 80° C), non-operating
	Humidity	10% to 85% non-condensing
	Operating voltage	5V ± 5%
	Power consumption	Tx/Rx peak 560/250mA @ 3.3V (max.)
	Output power (approximately)	15 dBM ±2dB
	Receive sensitivity	-90dBm at 11 Mbps (typical)
	Data transfer rate	Standard rates of 1, 2, 5.5, 11, 6, 9, 12, 18, 24, 48, 54 and Super AG Mode108-Mbps
	Spreading	DSSS (Direct Sequence Spread Spectrum)
	Security	64(40h) bit, 128(104h) bit, WPA, IEEE802.1X, AES-OCB, AES-CCM, Microsoft PEAP,TKIP, WEP.
	Antenna	External 5dBi antenna
	Throughput	108 Mbps (only with Belkin 54G or above router that supports 108 Mbps speed)	200 ft (60.96 m) – Indoor
		54 Mbps	200 ft (60.96 m) – Indoor
		11 Mbps	200 ft (60.96 m) – Indoor
	Certifications	Wi-Fi certified
	Certifications for use by country	North America: United States, Canada
		Europe: Austria, Belgium, Cyprus, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Liechtenstein, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland, United Kingdom Australia
		New Zealand

2006 Agere PCI 56K International SoftModem	Data Transmission	Technology speeds: 56,000 Kbps maximum downstream data, controllerless
	NOTE: 56 Kbps technology refers to download speeds only and requires compatible modems at server sites. Other conditions may limit modem speed. FCC limitations allow a maximum of 53 Kbps during download transmissions.
	Data Speeds	(Upload only) 33,600/31,200/28,800/26,400/21,600/19,200/16,800/14,400/12,000/ 9,600/7,200/4,800/2,400/1,200/300
	Data Standards	ITU-T V.90, ITU-T, ITU-T V.34, V.44, V.42, V.42bis21, V.32bis, Bell 212A, and Bell 103
	Fax Speeds	14,400/12,000/9,600/7,200/4,800/2,400/1,200/300 b/s
	Fax Mode Capabilities	ITU-T T.31 class 1 FAX, V. 17, V.29, V.27ter, and V.21 Channel 2
	Error Correction and Data Compression	V.44, 42bis, V.42 and MNP2-5
	Power Management	ACPI; PPMI 1.1 and wake support with PME and Vaux; meets PCI 2.3 requirements and PC 2001 requirements
	Upgradeability	Driver upgradeable for future enhancements
	Video	ITU-T V.80 video ready interface
	Other	TIA/EIA 602 standard AT command set
		Integrated DTE interface with speeds of up to 115.2 Kbps, parallel 16550a UART-compatible interface
		Optional ring wakeup signal
	Operating Temperature	32° to 158° F (0° to 70° C)
	Operating Humidity	20% to 90%, non-condensing
	Power	Requires a 3.3-V auxiliary power rail on PCI bus
	Power	Uses only one PCI load (i.e., one grant/request pair), one shared IRQ, one electrical load
	Chipset	Agere Systems SV92PL – Integrated PCI interface with 5-V tolerant buffers and CardBus support
	Dimensions (L X H)	Complies with PCI low profile specifications–6.7 x 2.3 in (17.0 x 5.8 cm) and supports high- and low-profile brackets
	Connection	Single RJ-11 connector
	Other Features	Digital line protection, call progress monitoring via on-board piezo device, support for high profile and low profile brackets, PnP ID support
	Safety	UL recognized to UL 1950, 3rd edition (U.S. and Canada); IEC 950 (TUV, NEMKO, DEMKO, SEMKO); CE Mark, EC 950 (TUV, NEMKO, DEMKO, SEMKO, CE mark
	EMC	FCC Part 15, IC ES003, EN 55022, 3rd edition, EN 55024, annex A, EN 61000-4-6, EN 61000-4-8
	Telecom	FCC Part 68, IC-CS-03 (Canada); Worldwide PTT approvals Not available in Korea or the Republic of South Africa.
	Health	Bare PCB material compliant to 94V-0 or better (marked as such)
	Other	PC 2001 compliant, PCI version 2.3, WHQL approved; ACPI compliant

Technical Specifications - Graphics

Integrated ATI Radeon X300 graphics	3D/2D Controller	Full Microsoft DirectX® 9 based with Shader 2.0 support, full precision floating point pixel pipeline, 2x, 4x, or 6x Anti-Aliasing, hidden surface removal using 16, 24, or 32-bit Z-Buffering, and support for 12-bit per pixel formats. Support for Microsoft's DirectDraw, Double Buffering, Virtual Sprites, Transparent Blit, and Masked Blit.
	VGA/DVI Controller	Integrated
	Bus Type	PCI Express™ x16 for optional graphics upgrade.
	RAMDAC	Integrated
	Memory	HYPERMEMORY™ technology offers optional dedicated Local Frame Buffer configuration for a 32-bit or 64-bit interface and up to 128MB of memory. UMA mode operation uses from 32MB up to 256MB of shared system memory.
	Controller Clock Speed	400 MHz
	Overlay Planes	Back end overlay supporting Motion Adaptive De-Interlacing
	Maximum Color Depth	32 bits/pixel
	Maximum Vertical Refresh Rate	Supports resolutions up to 2045x1536 @ 32bpp.
	Multi-display Support	SURROUNDVIEW™ support for up to four monitors with an ATI discrete graphics card. Up to 2 displays can be supported via the motherboard's VGA and DVI-D connectors. An additional 2 displays can be supported via the ATI discrete graphics card. Dual independent display modes are supported.
	Graphics/Video API Support	Microsoft DirectX 9, DirectXVA®, VMR7, VMR9, GDI/GDI+; OpenGL® 1.4.

Integrated DVI-D support

DVI-D Connector

Compliant with DDWG (Digital Display Working Group) and VESA specifications for a single-link digital DVI (DVI-D) connector.

Dual Head Support

Yes, when used with the integrated VGA connector

Display Devices Supported

HP L1530
HP L1740
HP L1755
HP L1940
HP L1955
HP L2035
HP L2335

Color Depth

All modes support 8-bpp, 16-bpp, and 24-bpp color depths

Host Interface Connector

Mechanically compliant with PCI-E standard

Dot Clock

165 MHz maximum

Display Modes

Supports display modes that require up to 165-MHz bandwidth on the link, as shown in the following table.

Resolution		60-Hz LCD	60-Hz	75-Hz	85-Hz
Blanking		5% reduced	GTF	GTF	GTF
640 x 480	VGA	Yes	Yes	Yes	Yes
800 x 600	SVGA	Yes	Yes	Yes	Yes
1024 x 768	XGA	Yes	Yes	Yes	Yes
1280 x 1024	SXGA	Yes	Yes	No	No
1600 x 1200	UXGA	Yes	Yes	No	No

ATI RADEON X1300 PCIe Graphics Card (256 MB)	Bus Type	PCI Express (x16 lanes)
	Maximum Vertical Refresh Rate	85 Hz
	Display Support	Integrated 400 MHz RAMDAC
	Display Max Resolution	2048 x 1536
	Board Display Options	DVI-I + TV DVI-I supports analog CRT or flat panel or digital flat panel (using DVI-A, DVI-D or DVI-I connector) DVI-I supports analog CRT or flat panel (with VGA connector and DVI-I to VGA dongle) TV connector is a 4-pin mini-DIN S-video connector
	Board Configuration 128 MB Frame Buffer	Specification	Description
		Graphics Chip	RV515
		Core clock	450 MHz
		Memory clock	250 MHz
		Frame buffer	256 MB DDR2
	Languages supported	24 languages: English, Arabic, Chinese Simplified, Chinese Traditional, Czechoslovakian, Danish, Dutch, Finnish, French, German, Greek, Hebrew, Hungarian, Italian, Japanese, Korean, Norwegian, Polish, Portuguese, Russian, Spanish, Swedish, Thai, Turkish
	Core Power	25 W (Max board power)
	Option kit contents	ATI RADEON X1300 PCIe graphics card with full height bracket attached Low profile bracket DVI-to-VGA Adapter Software CD with graphics drivers Warranty documentation
	Compliance standards	EMC Emissions: a) FCC Part 15, Subpart B – Unintentional Radiators, Class B Computing Devices for Home & Office Use b) CISPR22: 1997/EN 55022:1998 – Class B – Limits and methods of measurement of radio disturbance characteristics of Information Technology Equipment c) Canadian Standard ICES-003 is equivalent to CISPR22 d) Taiwanese Standard BSMI e) Japanese VCCI f) Australian C-Tick EMC Immunity: CISPR 24:1997/EN 55024:1998 – Information Technology Equipment - Immunity Characteristics – Limits and Methods of Measurement. Safety: UL 60950 (USA) & EN 60950 (EU): Safety of Information Technology Equipment, Including Electrical Business Equipment. All boards meet UL PCB flammability requirements.

ATI RADEON X1600XT (256 MB DH) FH PCIe Graphics Card	Bus Type	PCI Express (x16 lanes)
	Maximum Vertical Refresh Rate	85 Hz
	Display Support	Integrated 400 MHz RAMDAC
	Display Max Resolution	2560 x 1600 digital, 2048 x 1536 analog
	Board Display Options	2 DVI-I ports (one port supports dual link DVI). DVI-I supports an analog CRT or flat panel with a VGA connector via the provided DVI-I to VGA adapter
		4-pin mini-DIN S-video connector for TV output
	Board Configuration	Specification	Description
		Graphics chip	RV530
		Core clock	590 MHz
		Memory clock	690 MHz
		Frame buffer	256 MB GDDR3, 128 bit wide
	Operating Systems Support	Windows 2000, Windows XP
	Core Power	56 W (Max board power)

ATI Radeon HD 2400XT (256MB DH) PCIe Graphics Card	Bus Type	PCI Express (x16 lanes)
	Maximum Vertical Refresh Rate	85 Hz
	Display Support	Integrated 400 MHz RAMDAC
	Display Max Resolution	2560 x 1600 digital, 2048 x 1536 analog
	Board Display Options	Supports two displays via included DMS-59 to dual VGA cable or 2 DVI monitors via optional DMS-59 to dual DVI cable kit part number: DL139A.
		4-pin mini-DIN S-video connector for TV output
	Board Configuration	Specification	Description
		Graphics chip	RV610
		Core clock	650 MHz
		Memory clock	500 MHz
		Frame buffer	256 MB GDDR3, 128 bit wide
	Languages supported	24 languages: English, Arabic, Chinese Simplified, Chinese Traditional, Czechoslovakian, Danish, Dutch, Finnish, French, German, Greek, Hebrew, Hungarian, Italian, Japanese, Korean, Norwegian, Polish, Portuguese, Russian, Spanish, Swedish, Thai, Turkish
	Core Power	21 W
	Compliance standards	EMC Emissions: a) FCC Part 15, Subpart B – Unintentional Radiators, Class B Computing Devices for Home & Office Use b) CISPR22: 1997/EN 55022:1998 – Class B – Limits and methods of measurement of radio disturbance characteristics of Information Technology Equipment c) Canadian Standard ICES-003 is equivalent to CISPR22 d) Taiwanese Standard BSMI e) Japanese VCCI f) Australian C-Tick g) Korean (MIC) EMC Immunity: CISPR 24:1997/EN 55024:1998 – Information Technology Equipment - Immunity Characteristics – Limits and Methods of Measurement.
ATI Radeon HD 2400XT (256MB DH) PCIe Graphics Card display resolutions and refresh rates NOTE: Other resolutions may be available but are not recommended as the may not have been tested and qualified by HP.
Analog Resolution 640 x 480 800 x 600 1024 x 768 1280 x 768 1280 x 1024 1600 x 1024 1600 x 1200 1920 x 1080 1920 x 1200 1920 x 1440 2048 x 1536 Digital Resolution 640 x 480 800 x 600 1024 x 768 1280 x 768 1280 x 1024 1600 x 1024 1600 x 1200 1920 x 1200		Maximum Refresh Rate 85 Hz 85 Hz 85 Hz 85 Hz 85 Hz 85 Hz 85 Hz 85 Hz 75 Hz 85 Hz 75 Hz Maximum Refresh Rate 60 Hz 60 Hz 60 Hz 60 Hz 60 Hz 60 Hz 60 Hz 60 Hz

ATI Radeon HD 3650 (512MB DH) PCIe x16 Graphics Card	Bus type	PCI Express (x16 lanes)
	Maximum vertical refresh rate	85 Hz
	Display support	Integrated 400 MHz RAMDAC
	Display max resolution	2560 x 1600 digital, 1920 x 1440 analog
	Board display options	Supports two displays via included two DisplayPort and one Dual Link DVII connectors.
	Board configuration	Specification	Description
		Graphics Chip	RV635
		Core clock	600 MHz
		Memory clock	500 MHz
		Frame buffer	512 MB DDR2, 128 bit wide
	Languages supported	24 languages: English, Arabic, Chinese Simplified, Chinese Traditional, Czechoslovakian, Danish, Dutch, Finnish, French, German, Greek, Hebrew, Hungarian, Italian, Japanese, Korean, Norwegian, Polish, Portuguese, Russian, Spanish, Swedish, Thai, Turkish
	Core power	56 W
	Compliance standards	EMC Emissions: FCC Part 15, Subpart B - Unintentional Radiators, Class B Computing Devices for Home & Office Use CISPR22: 1997/EN 55022:1998 - Class B - Limits and methods of measurement of radio disturbance characteristics of Information Technology Equipment Canadian Standard ICES-003 is equivalent to CISPR22 Taiwanese Standard BSMI Japanese VCCI Australian C-Tick Korean (MIC) EMC Immunity: CISPR 24:1997/EN 55024:1998 - Information Technology Equipment - Immunity Characteristics - Limits and Methods of Measurement.
ATI Radeon HD 3650 (512MB DH) PCIe x16 Graphics Card display resolutions and refresh rates NOTE: Other resolutions may be available but are not recommended as the may not have been tested and qualified by HP

Resolution	Maximum Refresh Rate (Hz)
Resolution	Analog Connection	Digital Connection
640x480	85	60
800x600	85	60
1024x768	85	60
1280x720	85	60
1280x1024	85	60
1440x900	75	60
1600x1200	85	60
1680x1050	75	60
1920x1080	85	60-R
1920x1200	85	60-R
1920x1440	85	N/A
2048x1536	75	N/A
2560x1600	N/A	60*
* Only supported when using a dual-link DVI or DP connection NOTE: 60-R denotes reduced blanking timings are used on single-link DVI connections and may be used with other digital connections

Technical Specifications - Hard Drives

7200 rpm Serial ATA Hard Drives	250-GB	Capacity	250,059,350,016 bytes
		Height	1 in (2.54 cm)
		Width	Media diameter: 3.5 in (8.89 cm) Physical size: 4 in (10.2 cm)
		Interface	Serial ATA (3.0 Gb/s)
		Synchronous Transfer Rate (Maximum)	Up to 3 Gb/s
		Buffer	8 MB
		Seek Time (typical reads, includes controller overhead, including settling)	Single Track	1.0 ms
			Average	8.5 ms
			Full-Stroke	18 ms
		Rotational Speed	7,200 rpm
		Logical Blocks	488,397,168
		Operating Temperature	41° to 131° F (5° to 55° C)

160-GB	Capacity	163,928,604,672 bytes
	Height	1 in (2.54 cm)
	Width	Media diameter: 3.5 in (8.89 cm) Physical size: 4 in (10.2 cm)
	Interface	Serial ATA (3.0 Gb/s)
	Synchronous Transfer Rate (Maximum)	Up to 3 Gb/s
	Buffer	8 MB
	Seek Time (typical reads, includes controller overhead, including settling)	Single Track	0.9 ms
		Average	9.3 ms
		Full-Stroke	18 ms
	Rotational Speed	7,200 rpm
	Logical Blocks	320,173,056
	Operating Temperature	41° to 131° F (5° to 55° C)

80-GB	Capacity	80,026,361,856 bytes
	Height	1 in (2.54 cm)
	Width	Media diameter: 3.5 in (8.89 cm) Physical size: 4 in (10.2 cm)
	Interface	Serial ATA (3.0 Gb/s)
	Synchronous Transfer Rate (Maximum)	Up to 3 Gb/s
	Buffer	8 MB
	Seek Time (typical reads, includes controller overhead, including settling)	Single Track	2.0 ms
		Average	9.3 ms
		Full-Stroke	21 ms
	Rotational Speed	7,200 rpm
	Logical Blocks	156,301,488
	Operating Temperature	41° to 131° F (5° to 55° C)

10,000 RPM Serial ATA Hard Drives	160-GB	Capacity	160,041,885,696 bytes
		Height	1 in (2.54 cm)
		Width	Media diameter: 3.0 in (7.62 cm) Physical size: 4 in (10.2 cm)
		Interface	Serial ATA (1.5 Gb/s), Native Command Queuing enabled
		Synchronous Transfer Rate (Maximum)	Up to 1.5 Gb/s
		Cache	16 Mbytes
		Seek Time (typical reads, includes controller overhead, including settling)	Single Track	0.3 ms
			Average	4.6 ms
			Full-Stroke	10.2 ms
		Rotational Speed	10,000 rpm
		Logical Blocks	312,581,808
		Operating Temperature	41° to 131° F (5° to 55° C)

80 GB	Capacity	80,026,361,856 bytes
	Height	1 in (2.54 cm)
	Width	Media diameter: 3.0 in (7.62 cm) Physical size: 4 in (10.2 cm)
	Interface	Serial ATA (1.5 Gb/s), Native Command Queuing enabled
	Synchronous Transfer Rate (Maximum)	Up to 1.5 Gb/s
	Cache	16 Mbytes
	Seek Time (typical reads, includes controller overhead, including settling)	Single Track	0.3 ms
		Average	4.6 ms
		Full-Stroke	10.2 ms
	Rotational Speed	10,000 rpm
	Logical Blocks	156,301,488
	Operating Temperature	41° to 131° F (5° to 55° C)

Technical Specifications - Input/Output Devices

USB Standard Keyboard	Physical characteristics	Keys	104, 105, 106, 107, 109 layout (depending upon country)
		Dimensions (L x W x H)	18.0 x 6.4 x 0.98 in (45.8 x 16.3 x 2.5 cm)
		Weight	2 lb (0.9 kg) minimum
	Electrical	Operating voltage	+ 5VDC ± 5%
		Power consumption	50-mA maximum (with three LEDs ON)
		System interface	USB Type A plug connector
		ESD	CE level 4, 15-kV air discharge
		EMI – RFI	Conforms to FCC rules for a Class B computing device
		Microsoft PC 99 – 2001	Functionally compliant
	Mechanical	Languages	38 available
		Keycaps	Low-profile design
		Switch actuation	55-g nominal peak force with tactile feedback
		Switch life	20 million keystrokes (using Hasco modified tester)
		Switch type	Contamination-resistant switch membrane
		Key-leveling mechanisms	For all double-wide and greater-length keys
		Cable length	6 ft (1.8 m)
		Microsoft PC 99 – 2001	Mechanically compliant
		Acoustics	43-dBA maximum sound pressure level
	Environmental	Operating temperature	50° to 122° F (10° to 50° C)
		Non-operating temperature	-22° to 140° F (-30° to 60° C)
		Operating humidity	10% to 90% (non-condensing at ambient)
		Non-operating humidity	20% to 80% (non-condensing at ambient)
		Operating shock	40 g, six surfaces
		Non-operating shock	80 g, six surfaces
		Operating vibration	2-g peak acceleration
		Non-operating vibration	4-g peak acceleration
		Drop (out of box)	26 in (66 cm) on carpet, six-drop sequence
		Drop (in box)	42 in (107 cm) on concrete, 16-drop sequence
	Approvals	UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC
	Ergonomic compliance	ANSI HFS 100, ISO 9241-4, and TUVGS
	Kit contents	Keyboard, installation guide, warranty card, safety and comfort guide

PS/2 Standard Keyboard	Physical characteristics	Keys	104, 105, 106, 107, 109 layout (depending upon country)
		Dimensions (L x W x H)	18.0 x 6.4 x 0.98 in (45.8 x 16.3 x 2.5 cm)
		Weight	2 lb (0.9 kg) minimum
	Electrical	Operating voltage	+ 5VDC ± 5%
		Power consumption	50-mA maximum (with three LEDs ON)
		System interface	PS/2 6-pin mini din connector
		ESD	CE level 4, 15-kV air discharge
		EMI – RFI	Conforms to FCC rules for a Class B computing device
		Microsoft PC 99 – 2001	Functionally compliant
	Mechanical	Languages	38 available
		Keycaps	Low-profile design
		Switch actuation	55-g nominal peak force with tactile feedback
		Switch life	20 million keystrokes (using Hasco modified tester)
		Switch type	Contamination-resistant switch membrane
		Key-leveling mechanisms	For all double-wide and greater-length keys
		Cable length	6 ft (1.8 m)
		Microsoft PC 99 – 2001	Mechanically compliant
		Acoustics	43-dBA maximum sound pressure level
	Environmental	Operating temperature	50° to 122° F (10° to 50° C)
		Non-operating temperature	-22° to 140° F (-30° to 60° C)
		Operating humidity	10% to 90% (non-condensing at ambient)
		Non-operating humidity	20% to 80% (non-condensing at ambient)
		Operating shock	40 g, six surfaces
		Non-operating shock	80 g, six surfaces
		Operating vibration	2-g peak acceleration
		Non-operating vibration	4-g peak acceleration
		Drop (out of box)	26 in (66 cm) on carpet, six-drop sequence
		Drop (in box)	42 in (107 cm) on concrete, 16-drop sequence
	Approvals	UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC
	Ergonomic compliance	ANSI HFS 100, ISO 9241-4, and TUVGS
	Kit contents	Keyboard, keyboard software media, installation guide, warranty card, safety and comfort guide

HP USB Smartcard Keyboard	Physical characteristics	Keys	104, 105, 106, 107, 109 layout (depending upon country)
		Form factor	USB basic Smart Card keyboard
		Colors	Carbonite/Silver
		Dimensions (H x W x D)	18.2 x 6.3 x 1.3 in (46.3 x 16.1 x 3.3 cm)
		Weight	2 lb (0.9 kg) minimum
	Electrical	Operating voltage	+ 5VDC ± 5%
		Power consumption	100-mA maximum (with four LEDs ON)
		System interface	USB Type A plug connector
		ESD	CE level 4, 15-kV air discharge
		EMI – RFI	Conforms to FCC rules for a Class B computing device
		Microsoft PC 99 – 2001	Functionally compliant
	Mechanical	Languages	30+ available
		Keycaps	Low-profile design
		Switch actuation	55 g nominal peak force with tactile feedback
		Switch life	20 million keystrokes (using Hasco modified tester)
		Switch type	Contamination-resistant membrane
		Key-leveling mechanisms	For all double-wide and greater-length keys
		Cable length	6 ft (1.8 m)
		Microsoft PC 99 - 2001	Mechanically compliant
		Acoustics	43-dBA maximum sound pressure level
	Environmental	Operating temperature	50° to 122° F (10° to 50° C)
		Non-operating temperature	-22° to 140° F (-30° to 60° C)
		Operating humidity	10% to 90% (non-condensing at ambient)
		Non-operating humidity	20% to 80% (non-condensing at ambient)
		Operating shock	40 g, six surfaces
		Non-operating shock	80 g, six surfaces
		Operating vibration	2-g peak acceleration
		Non-operating vibration	4-g peak acceleration
		Drop (out of box)	26 in (66 cm) on carpet, six-drop sequence
		Drop (in box)	42 in (107 cm) on concrete, 16-drop sequence
	SMARTCARD function	Support	All ISO 7816 smart cards
		Interface	Reads from and writes to all ISO7816-1, 2, 3, 4 memory and microprocessor smart cards (T=0, T=1)
		Chipset	SCM STCII
		Standard APIs supported	PC/SC, EMV2000, SET
		Power	USB Port Short circuit detection (protects smart card and reader) Power supply compliant with ISO7816 and EMV (5V, 60 mA) Supports 3-V and 5-V cards
		Power consumption	250-mA maximum draw (50 mA for the keyboard with three LEDs ON and 200-mA maximum startup current using a high-current, 60-mA smart card)
		Communication	From card	Programmable from 9,600 baud to 115,200 baud
			From computer	Up to 38,400 baud
		Landing mechanism	Contact device	Friction contact
			Card insertions rating	Up to 100,000 insertion cycles
		Interface modes	USB communications through USB port SCM protocol Automatic card insertion/removal detection
		Reader performance interface	USB connection
		Electro-magnetic standards	Europe	89/336/CEE guideline
			USA	USAFCC part 15

USB Standard BG1650 Keyboard (gray)	Physical characteristics	Keys	104, 105, 106, 107, 109 layout (depending upon country)
		Dimensions (L x W x H)	18.0 x 6.4 x 0.98 in (45.8 x 16.3 x 2. 5 cm)
		Weight	2 lb (0.9 kg) minimum
	Electrical	Operating voltage	+ 5VDC ± 5%
		Power consumption	50-mA maximum (with three LEDs ON)
		System interface	USB Type A plug connector
		ESD	CE level 4, 15-kV air discharge
		EMI – RFI	Conforms to FCC rules for a Class B computing device
		Microsoft PC 99 – 2001	Functionally compliant
	Mechanical	Languages	38 available
		Keycaps	Low-profile design
		Switch actuation	55-g nominal peak force with tactile feedback
		Switch life	20 million keystrokes (using Hasco modified tester)
		Switch type	Contamination-resistant switch membrane
		Key-leveling mechanisms	For all double-wide and greater-length keys
		Cable length	6 ft (1.8 m)
		Microsoft PC 99 – 2001	Mechanically compliant
		Acoustics	43-dBA maximum sound pressure level
	Environmental	Operating temperature	50° to 122° F (10° to 50° C)
		Non-operating temperature	-22° to 140° F (-30° to 60° C)
		Operating humidity	10% to 90% (non-condensing at ambient)
		Non-operating humidity	20% to 80% (non-condensing at ambient)
		Operating shock	40 g, six surfaces
		Non-operating shock	80 g, six surfaces
		Operating vibration	2-g peak acceleration
		Non-operating vibration	4-g peak acceleration
		Drop (out of box)	26 in (66 cm) on carpet, six-drop sequence
		Drop (in box)	42 in (107 cm) on concrete, 16-drop sequence
	Approvals	UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC, BG Prufzert Mark
	Ergonomic compliance	ANSI HFS 100, ISO 9241-4, and TUVGS
	Kit contents	Keyboard, installation guide, warranty card, safety and comfort guide

HP PS/2 Scroll Mouse	Dimensions	3.8 x 6.3 x 11.6 cm (1.5 x 2.5 x 4.6 in)
	Weight	4.44 oz (126 g)
	Environmental	Operating temperature	50° to 122° F (10° to 50° C)
		Non-operating temperature	22° to 140° F (-30° to 60° C)
		Operating humidity	10% to 90% (non condensing at ambient)
		Non-operating humidity	20% to 80% (non condensing at ambient)
		Operating shock	40 g, 6 surfaces
		Non-operating shock	80 g, 6 surfaces
		Operating vibration	2 g peak acceleration
		Non-operating vibration	4 g peak acceleration
		Drop (out of box)	26 in (66 cm) on carpet, 6-drop sequence
		Drop (out of box)	1 m on asphalt tile over concrete, 6-drop sequence
	Electrical	Operating voltage	5 VDC ± 10%
		Power consumption	15 mA
		System consumption	PS/2 mini-din connector
		ESD	CE level 4, 15 kV air discharge
		EMI-RFI	Conforms to FCC rules for a Class B computing device
		Microsoft PC99 – 2001	Functionally compliant
	Mechanical	Resolution	400 ± 20% DPI
		Tracking speed	10 in/s (25.4 cm/s) maximum
		Acceleration	100 in/s/s (2.54 m/s/s)
		Switch actuation	65 g nominal peak force
		Switch life	1,000,000 operations (using Hasco modified tester)
		Switch type	Low force micro-switches
		Tracking mechanism life	155 mi (250 km) at average speed of 10 in/s
		Cable length	6 ft (1.8 m)
		Microsoft PC99 – 2001	Mechanically compliant
	Scroll wheel	Width	8 mm
		Diameter	.99 in (25.2 mm)
		Maximum rotation speed	30 mm/s
		Switch type	Light force micro-switch
		Switch life	1 million operations
		Mechanical life	Minimum 200,000 revolutions
	Regulatory approvals	Compliant	UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC

HP USB Scroll Mouse	Environmental	Operating temperature	50° to 122° F (10° to 50° C)
		Non-operating temperature	-22° to 140° F (-30° to 60° C)
		Operating humidity	10% to 90% (non condensing at ambient)
		Non-operating humidity	20% to 80% (non condensing at ambient)
		Operating shock	40 g, 6 surfaces
		Non-operating shock	80 g, 6 surfaces
		Operating vibration	2 g peak acceleration
		Non-operating vibration	4 g peak acceleration
		Drop (out of box)	26 in (66 cm) on carpet, 6-drop sequence 1 m on asphalt tile over concrete, 6-drop sequence
	Electrical	Operating voltage	5 VDC ± 10%
		Power consumption	15 mA
		System consumption	USB Type-A plug connector
		ESD	CE level 4, 15 kV air discharge
		EMI-RFI	Conforms to FCC rules for a Class B computing device
		Microsoft PC99 – 2001	Functionally compliant
	Mechanical	Resolution	400 ± 20% DPI
		Tracking speed	10 in/s (25.4 cm/s) maximum
		Acceleration	100 in/s/s (2.54 m/s/s)
		Switch actuation	65 g nominal peak force
		Switch life	1,000,000 operations (using Hasco modified tester)
		Switch type	Low force micro-switches
		Tracking mechanism life	155 mi (250 km) at average speed of 10 in/s
		Cable length	6 ft (1.8 m)
		Microsoft PC99 – 2001	Mechanically compliant
	Scroll wheel	Width	8 mm
		Maximum rotation speed	30 mm/s
		Switch type	Light force micro-switch
		Switch life	1 million operations
		Mechanical life	Minimum 200,000 revolutions
	Regulatory approvals	Compliant	UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC

HP USB Optical Scroll Mouse	Dimensions (H x L x W)	1.5 x 4.5 x 2.5 in (3.8 x 11.6 x 6.3 cm)
	Weight	0.27 lb (0.12 kg)
	Cable length	72.8 in (185 cm)
	System requirements	Microsoft Windows 2000 (Service Pack 4 or greater), Windows XP Home, Windows XP Professional Available USB port

Technical Specifications - Optical Storage

SATA SuperMulti LightScribe DVD Writer Drive	Height	5.25-inch, half-height, tray-load
	Orientation	Either horizontal or vertical
	Interface type	SATA/ATAPI
	Disc capacity	8.5 GB DL or 4.7 GB standard
	Dimensions (W x H x D)	5.9 x 1.7 x 8.0 in (15.0 x 4.4 x 20.3 cm)
	Weight (max)	2.6 lb (1.2 kg)
	Write speeds	DVD-RAM	Up to 12X
		DVD+R	Up to 16X
		DVD+RW	Up to 8X
		DVD+R DL	Up to 8X
		DVD-R DL	Up to 8X
		DVD-R	Up to 16X
		DVD-RW	Up to 6X
		CD-R	Up to 48X
		CD-RW	Up to 32X
	Read speeds	DVD-RAM	Up to 12X
		DVD+RW, DVD-RW, DVD+R DL, DVD-R DL	Up to 8X
		DVD-ROM DL	Up to 8X
		DVD-ROM, DVD+R, DVD-R	Up to 16X
		CD-ROM, CD-R	Up to 48X
		CD-RW	Up to 32X
	Access time (typical reads, including settling)	Random	DVD: < 140 ms (typical), CD: < 125 ms (typical)
	Access time (typical reads, including settling)	Full Stroke	DVD: < 250 ms (seek), CD: < 210 ms (seek)
	Power	Source	SATA DC power receptacle
		DC Power Requirement	5 VDC ± 5%-100 mV ripple p-p
		DC Power Requirement	12 VDC ± 5%-200 mV ripple p-p
		DC Current	5 VDC (< 1000 mA typical, 1600 mA maximum)
			12 VDC (< 600 mA typical, 1400 mA maximum)
	Environmental conditions (operating – non-condensing)	Temperature	41° to 122° F (5° to 50° C)
		Relative Humidity	10% to 90%
		Maximum Wet Bulb Temperature	86° F (30° C)

SATA DVD+/-RW (DL/DF) LightScribe Drive	Height	5.25-inch, half-height, tray-load
	Orientation	Either horizontal or vertical
	Interface type	SATA/ATAPI
	Disc capacity	8.5 GB DL or 4.7 GB standard
	Dimensions (W x H x D)	5.9 x 1.7 x 8.0 in (15.0 x 4.4 x 20.3 cm)
	Weight (max)	2.6 lb (1.2 kg)
	Write speeds	DVD+R	Up to 16X
		DVD+RW	Up to 8X
		DVD+R DL	Up to 8X
		DVD-R DL	Up to 4X
		DVD-R	Up to 16X
		DVD-RW	Up to 6X
		CD-R	Up to 48X
		CD-RW	Up to 32X
	Read speeds	DVD-RAM	Up to 4X
		DVD+RW, DVD-RW, DVD+R DL, DVD-R DL	Up to 8X
		DVD-ROM, DVD+R, DVD-R	Up to 16X
		CD-ROM, CD-R	Up to 48X
		CD-RW	Up to 32X
	Access time (typical reads, including settling)	Random	DVD: < 130 ms (typical), CD: < 120 ms (typical)
	Access time (typical reads, including settling)	Full Stroke	DVD: < 240 ms (seek), CD: < 200 ms (seek)
	Power	Source	SATA DC power receptacle
		DC Power Requirement	5 VDC ± 5%-100 mV ripple p-p
		DC Power Requirement	12 VDC ± 5%-200 mV ripple p-p
		DC Current	5 VDC (< 1000 mA typical, 1600 mA maximum)
			12 VDC (< 600 mA typical, 1400 mA maximum)
	Environmental conditions (operating – non-condensing)	Temperature	41° to 122° F (5° to 50° C)
		Relative Humidity	10% to 90%
		Maximum Wet Bulb Temperature	86° F (30° C)

SATA CD-RW/DVD-ROM Combo Drive	Height	5.25-inch, half-height, tray-load
	Orientation	Either horizontal or vertical
	Interface type	SATA/ATAPI
	Disc capacity	Single layer: Up to 4.7 GB (6 times capacity of CD-ROM) Double layer: Up to 8.5 GB (12 times capacity of CD-ROM)
	Dimensions (W x H x D)	5.9 x 1.7 x 8.0 in (15.0 x 4.4 x 20.3 cm)
	Weight (max)	2.6 lb (1.2 kg)
	Write speeds	CD-R	Up to 48X
	Write speeds	CD-RW	Up to 32X
	Read speeds	DVD+R/-R/+RW/ -RW/+R DL /-R DL	Up to 8X
		DVD-ROM	Up to 16X
		CD-ROM, CD-R	Up to 48X
		CD-RW	Up to 32X
	Access time (typical reads, including settling)	Random	DVD: < 140 ms (typical), CD: < 125 ms (typical)
	Access time (typical reads, including settling)	Full Stroke	DVD: < 250 ms (typical), CD: < 210 ms (typical)
	Power	Source	SATA DC power receptacle
		DC Power Requirement	5 VDC ± 5%-100 mV ripple p-p
			12 VDC ± 5%-200 mV ripple p-p
		DC Current	5 VDC (< 1000 mA typical, < 1600 mA maximum)
			12 VDC (< 600 mA typical, < 1400 mA maximum)
	Environmental (all conditions non-condensing)	Temperature	41° to 122° F (5° to 50° C)
		Relative Humidity	10% to 90%
		Maximum Wet Bulb Temperature	86° F (30° C)

SATA DVD-ROM Drive	Height	5.25-inch, half-height, tray-load
	Orientation	Either horizontal or vertical
	Interface type	SATA/ATAPI
	Disc capacity	Single layer: Up to 4.7 GB (6 times capacity of CD-ROM) Double layer: Up to 8.5 GB (12 times capacity of CD-ROM)
	Dimensions (W x H x D)	5.9 x 1.7 x 8.0 in (15.0 x 4.4 x 20.3 cm)
	Weight (max)	2.6 lb (1.2 kg)
	Read speeds	DVD+R/-R/+RW/ -RW/+R DL /-R DL	Up to 8X
		DVD-ROM	Up to 16X
		DVD-RAM	Up to 4X
		CD-ROM, CD-R	Up to 48X
		CD-RW	Up to 32X
	Removable Storage – Media Compatibility – DVD-ROM	Media	Read	Write
		CD-ROM	Yes	No
		CD-R	Yes	No
		CD-RW	Yes	No
		DVD-ROM	Yes	No
		DVD-ROM DL	Yes	No
		DVD-RAM	Yes	No
		DVD+R	Yes	No
		DVD+R DL	Yes	No
		DVD+RW	Yes	No
		DVD-R	Yes	No
		DVD-RW	Yes	No
		DVD-R DL	Yes	No
	Access times (typical reads, including setting)	Random	DVD: < 140 ms (typical), CD: < 125 ms (typical)
		Full Stroke	DVD: < 250 ms (seek), CD: < 210 ms (seek)
		Cache Buffer	2 MB (minimum)
		Data Transfer Modes	ATA PIO mode 4 (16.7 MB/s); ATA Multi-word DMA mode 2 (16.7 MB/s); ATA UltraDMA Mode 3 (44.4 MB/s -default)
	Power	Source	SATA DC power receptacle
		DC Power Requirement	5 VDC ± 5%-100 mV ripple p-p 12 VDC ± 5%-200 mV ripple p-p
		DC Current	5 VDC – <1000 mA typical, < 1600 mA maximum 12 VDC –< 600 mA typical, < 1400 mA maximum
	Environmental (all conditions non-condensing)	Temperature	41° to 122° F (5° to 50° C)
		Relative Humidity	10% to 90%
		Maximum Wet Bulb Temperature	86° F (30° C)

Technical Specifications - Removable Storage

HP 16-in-1 Media Card Reader	USB Interface	USB 2.0 High-speed device
	Advance protocol support	Supports hardware ECC (Error Correction Code) function Supports hardware CRC (Cyclic Redundancy Check) function Supports MS 4-bit parallel transfer mode Supports MS-PRO 4-bit parallel transfer mode Supports SD 4-bit parallel transfer mode Supports high-speed 50-MHz SD 4-bit card (version 1.1) Support high-speed 52-MHz MMC 8-bit card
	Supported media type with card adapter	MicroSD (T-Flash) Memory Stick Micro
	Mechanical
	Environmental	Operational Environmental Extremes	Test Parameters/Conditions – Power applied, unit operating on system ±5% nominal supply voltage. 10°C 10% R.H. ≥ 24 hours 10°C 90% R.H. ≥ 24 hours 20°C 90% R.H. ≥ 24 hours 30°C 90% R.H. ≥ 24 hours 40°C 90% R.H. ≥ 24 hours 50°C 90% R.H. ≥ 24 hours 50°C 10% R.H. ≥ 24 hours
		Storage Environmental Extremes	Test Parameters/Conditions 60°C @ 80% R.H. for 96 hours -30°C @ 20% R.H. for 48 hours No power applied Delta °C < 1.0°C/min Delta % R.H. < 1.5% R.H./min
	Approvals	USB-IF, WHQL, Compliant with USB Mass Storage Class Bulk only Transport Specification Rev. 1.0, Compliant Intel Front Panel I/O Connectivity Design Guide V. 1.2 FCC, CE, BSMI, C-Tick, VCCI, MIC, cUL, TUV-T

Technical Specifications - Environmental Data

Eco-Label Certifications and declarations

This product has received or is in the process of being certified to the following approvals and may be labeled with one or more of these marks:

ENERGY STAR
US Federal Energy Management Program (FEMP)
Taiwan Green Mark
China Energy Conservation Program
IT ECO declaration
EPEAT Rated – SILVER
Korea Eco-label
Japan PC Green label*

* This product conforms to the examination standards (2003 version) under JEITA's 'PC Green Label System.'


Small Form Factor

System Configuration		The configuration used for the Energy Consumption and Declared Noise Emissions data for the Small Form Factor Desktop model is based on a typically configured product.
Energy Consumption
		115 VAC	230 VAC	100 VAC
	Normal Operation	58.3 W	57.2 W	58.5 W
	Sleep (ENERGY STAR low power mode)	2.73 W	2.70 W	2.72 W
	Off	1.82 W	1.80 W	1.80 W
Heat Dissipation*		115 VAC	230 VAC	100 VAC
	Normal Operation	198.9 BTU/hr	195.2 BTU/hr	199.6 BTU/hr
	Sleep	9.3 BTU/hr	9.2 BTU/hr	9.3 BTU/hr
	Off	6.2 BTU/hr	6.1 BTU/hr	6.1 BTU/hr
		* Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour. This product is in compliance with US executive order 13221, WOL (wake on LAN) disabled.

Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296)
System Fan Off		Sound Power (LWAd, bels)	Sound Pressure (LpAm, decibels)
	Idle	4.0	30
	Fixed Disk (random writes)	4.0	30
	Optical Drive (sequential reads)	5.1	42

Longevity and Upgrading	This product is designed to be upgraded, possibly extending its useful life by several years. Spare parts are available throughout the warranty period and for up to 5 years after the end of production. Upgradeability features contained in the product include: AMD socket AM2 8 USB ports 2 empty low profile PCI slots 1 empty low profile PCIe x1 slot 1 empty low profile PCIe x16 slot 3.5-inch internal drive bay 1 3.5-inch external drive bay 1 5.25-inch external drive bay 4 memory slots 1 second Serial port (optional)
Batteries	This product complies with ISO standards: EU Directive 91/ 157/ EEC EU Directive 93/ 86/ EEC EU Directive 98/ 101/ EEC Batteries used in the product do not contain: Mercury greater the 5ppm by weight Cadmium greater than 10ppm by weight Lead greater than 4000ppm by weight. Battery size: CR2032 (coin cell) Battery type: Lithium
Additional Information	This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive – 2002/95/EC. This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water and Toxic Enforcement Act of 1986 This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive – 2002/96/EC. This product is in compliance with the IEEE 1680 (EPEAT) standard at the Silver level (see http://www.epeat.net) Plastics parts weighing over 25 grams used in the product are marked per ISO 11469 and ISO1043. This product contains 0% recycled materials (by wt.) This product is 92% recyclable when properly disposed of at end of life.
	Packaging Materials	Corrugated Paper	1400 g
		EPE Foam	240 g
		LDPE Bag	10 g
	The EPE foam packaging material is made from 30 to 60% recycled content. The corrugated paper packaging materials contains at least 80% recycled content.


Microtower

System Configuration

The configuration used for the Energy Consumption and Declared Noise Emissions data for the Microtower Desktop model is based on a typically configured product.

Energy Consumption
		115 VAC	230 VAC	100 VAC
	Normal Operation	63.2 W	63.5 W	62.2 W
	Sleep (ENERGY STAR low power mode)	2.75 W	2.81 W	2.81 W
	Off	2.46 W	2.63 W	2.10 W
Heat Dissipation*		115 VAC	230 VAC	100 VAC
	Normal Operation	215.5 BTU/hr	216.5 BTU/hr	212.3 BTU/hr
	Sleep	9.4 BTU/hr	9.6 BTU/hr	9.6 BTU/hr
	Off	8.4 BTU/hr	9.0 BTU/hr	7.2 BTU/hr
		* Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour. This product is in compliance with US executive order 13221, WOL (wake on LAN) disabled.

Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296)
System Fan Off		Sound Power (LWAd, bels)	Sound Pressure (LpAm, decibels)
	Idle	4.0	30
	Fixed Disk (random writes)	4.1	31

Longevity and Upgrading	This product is designed to be upgraded, possibly extending its useful life by several years. Spare parts are available throughout the warranty period and for up to 5 years after the end of production. Upgradeability features contained in the product include: AMD socket AM2 8 USB ports 2 empty full-height PCI slots 1 empty full-height PCIe x1 slot 1 empty full-height PCIe x16 slot 2 internal 3.5-inch drive bays 1 external 3.5-inch drive bay 2 internal 5.25-inch drive bays 4 memory slots 1 second Serial port (optional)
Batteries	This product complies with ISO standards: EU Directive 91/ 157/ EEC EU Directive 93/ 86/ EEC EU Directive 98/ 101/ EEC Batteries used in the product do not contain: Mercury greater the 5ppm by weight Cadmium greater than 10ppm by weight Lead greater than 4000ppm by weight. Battery size: CR2032 (coin cell) Battery type: Lithium
Additional Information	This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive – 2002/95/EC. This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water and Toxic Enforcement Act of 1986). This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive – 2002/96/EC. This product is in compliance with the IEEE 1680 (EPEAT) standard at the Silver level (see http://www.epeat.net) Plastics parts weighing over 25 grams used in the product are marked per ISO 11469 and ISO1043. This product contains 0% recycled materials (by wt.) This product is 97% recyclable when properly disposed of at end of life.
	Packaging Materials	Corrugated Paper	19410 g
		EPE Foam	254 g
		LDPE Bag	63 g
	The EPE foam packaging material is made from 30 to 60% recycled content. The corrugated paper packaging materials contains at least 80% recycled content.


Microtower and Small Form Factor

RoHS Compliance	Hewlett-Packard is committed to compliance with all applicable environmental laws and regulations, including the European Union Restriction of Hazardous Substances (RoHS) Directive. HP's goal is to exceed compliance obligations by meeting the requirements of the RoHS Directive on a worldwide basis. From July 1, 2006, RoHS substances will be virtually eliminated (virtually = to levels below legal limits) for all HP electronic products subject to the RoHS Directive, except where it is widely recognized that there is no technically feasible alternative (as indicated by an exemption under the EU RoHS Directive).
Material Usage	This product does not contain any of the following substances in excess of regulatory limits (refer to the HP General Specification for the Environment at http://www.hp.com/hpinfo/globalcitizenship/environment/ supplychain/gen_specifications.html): Asbestos Certain Azo Colorants Certain Brominated Flame Retardants – may not be used as flame retardants in plastics Cadmium Chlorinated Hydrocarbons Chlorinated Paraffins Formaldehyde Halogenated Diphenyl Methanes Lead carbonates and sulfates Lead and Lead compounds Mercuric Oxide Batteries Nickel – finishes must not be used on the external surface designed to be frequently handled or carried by the user. Ozone Depleting Substances Polybrominated Biphenyls (PBBs) Polybrominated Biphenyl Ethers (PBBEs) Polybrominated Biphenyl Oxides (PBBOs) Polychlorinated Biphenyl (PCB) Polychlorinated Terphenyls (PCT) Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been voluntarily removed from most applications. Radioactive Substances Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Packaging	HP follows these guidelines to decrease the environmental impact of product packaging: Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging materials. Eliminate the use of ozone-depleting substances (ODS) in packaging materials. Design packaging materials for ease of disassembly. Maximize the use of post-consumer recycled content materials in packaging materials. Use readily recyclable packaging materials such as paper and corrugated materials. Reduce size and weight of packages to improve transportation fuel efficiency. Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.
End-of-life Management and Recycling	Hewlett-Packard offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner. The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for each product type for use by treatment facilities. This information (product disassembly instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM customers who integrate and re-sell HP equipment.

Hewlett-Packard Corporate Environmental Information

For more information about HP's commitment to the environment:
[link to new HP white paper now in progress]
Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www.hp.com/hpinfo/globalcitizenship/environment/productdesign/ecolabels.html
ISO 14001 certificates:
http://www.hp.com/hpinfo/globalcitizenship/environment/operations/envmanagement.html

Athlon and Sempron are registered trademarks or trademarks of AMD Corporation in the U.S. and/or other countries.. Microsoft and Windows are U.S. registered trademarks of Microsoft Corporation. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.

DA-12546 38 - Version 38 - October 29, 2008