contents
 Overview      Configurable Components - Select Models (localized by Regions)      Standard Features and Configurable Components      After-Market Options      Technical Specifications      Technical Specifications - Audio      Technical Specifications - Communications      Technical Specifications - Graphics      Technical Specifications - Hard Drives      Technical Specifications - Input/Output Devices      Technical Specifications - Optical Storage      Technical Specifications - Removable Storage      Technical Specifications - Environmental Data line.gif (50 bytes)

Overview

HP Compaq dc5750 Business PC

HP recommends
Windows Vista® Business
 
Microtower
1.(2) 5.25" external bays and (2) 3.5" internal bays for optional removable hard drives5.(2) full-height PCI slots, (1) full-height PCIe x1 slot, (1) full-height PCIe x16 slot
2.(1) 3.5" external bay for optional HP 16-in-1 Media Card Reader, diskette drive, or other 3.5" device 6.Front I/O: (2) USB 2.0, headphone and microphone
3.300-watt or 300-watt high efficiency 80 PLUS® power supply 7.2-Button Scroll Mouse (PS/2), Optical Scroll Mouse (PS/2 or USB), or USB Laser Mouse
4.Rear I/O: (6) USB 2.0, (1) standard serial port, (1) optional serial port, (1) parallel port, (2) PS/2, (1) RJ-45, (1) VGA, (1) DVI-D, audio in/out 8. HP Standard Keyboard (PS/2 or USB) or HP USB Smartcard Keyboard
   9. Monitor (sold separately)
    
Small Form Factor
1.(1) 3.5" external bay for optional HP 16-in-1 Media Card Reader, diskette drive, or other 3.5" device;
(1) 3.5" internal bay

6.

Front I/O: (2) USB 2.0, headphone and microphone
2.(1) 5.25" external bay for optional optical drive, or other 5.25" device (bay tilts up for device removal and insertion)7.2-Button Scroll Mouse (PS/2), Optical Scroll Mouse (PS/2 or USB), or USB Laser Mouse
3.240-watt or 240-watt high efficiency 80 PLUS power supply 8.HP Standard Keyboard (PS/2 or USB) or HP USB Smartcard Keyboard
4.Rear I/O: (6) USB 2.0, (1) standard serial port, (1) optional serial port, (1) parallel port, (2) PS/2, (1) RJ-45, (1) VGA, (1) DVI-D, audio in/out 9.Monitor (sold separately)
5.(2) low profile PCI slots, (1) low profile PCIe x1 slot,
(1) low profile PCIe x16 slot
  
    
 
At A Glance
  • Designed to meet the needs of customers, across all market segments, looking for a stable solution to cover mainstream business needs.
  • Created using industry leading Design for Environment standards. Upgradeable, recyclable and energy efficient.
  • AMD Athlon™ 64 X2 Dual-Core, Athlon 64, and Sempron™ processors with HyperTransport™ technology
  • Support for AMD Enhanced Virus Protection™ and AMD Cool 'n Quiet™ technologies
  • ATI Radeon Express 1150 Chipset with integrated X300 graphics
  • Dual monitor support standard
  • RAID 0/1 support
  • Embedded TPM1.2 compliant security module* (Vista Bit-Locker ready)
  • Support for SMART III 3.0Gb/s Serial ATA hard drives
  • Value-added software available pre-installed on select models:
    • HP ProtectTools Security Software Suite (purchased separately), including Credential Manager, Smart Card Manager, and BIOS Configuration
    • HP Software Agent
    • Altiris Deployment Solution Agent
    • McAfee Anti-Virus with 60 day Live Update Subscription
    • HP Backup and Recovery Manager
    • Microsoft Office 2007
  • Value-added software available for free download from the Web (http://www.hp.com/go/easydeploy)
    • HP Client Configuration Manager, Basic Edition
    • HP Client Manager for Altiris
    • Altiris Out-of-Band Management Solution
    • HP SoftPaq Download Manager
    • HP System Software Manager
    • HP Client Catalog for Microsoft SMS
    • Verdiem Surveyor remote power management agent
  • Fully compatible software OS image across all models (Microtower, Small Form Factor)
  • HP BIOS for security, manageability and software image stability
  • Standard 3-years parts, 3-years labor and 3-years on-site warranty services
    (terms and conditions vary by country; certain restrictions and exclusions apply)
  • HP Insight Diagnostics software
  • Selected configurations with global availability easily set up and ordered through HP.com Business to Business portals (http://h10019.www1.hp.com/business-site/index.html)
  • Tailored HP Factory Express deployment and lifecycle services available
    (http://h71028.www7.hp.com/enterprise/cache/97688-0-0-225-121.aspx)

* TPM module disabled where use is restricted by law; for example, Russia.

contents
 Overview      Configurable Components - Select Models (localized by Regions)      Standard Features and Configurable Components      After-Market Options      Technical Specifications      Technical Specifications - Audio      Technical Specifications - Communications      Technical Specifications - Graphics      Technical Specifications - Hard Drives      Technical Specifications - Input/Output Devices      Technical Specifications - Optical Storage      Technical Specifications - Removable Storage      Technical Specifications - Environmental Data line.gif (50 bytes)

Configurable Components - Select Models (localized by Regions)

Model Key and Example
NOTE: This diagram is an example that illustrates how to read the model number. It is not intended to give every available configuration choice specified in the body of this document and may include references to modules that are out of date and no longer available.
contents
 Overview      Configurable Components - Select Models (localized by Regions)      Standard Features and Configurable Components      After-Market Options      Technical Specifications      Technical Specifications - Audio      Technical Specifications - Communications      Technical Specifications - Graphics      Technical Specifications - Hard Drives      Technical Specifications - Input/Output Devices      Technical Specifications - Optical Storage      Technical Specifications - Removable Storage      Technical Specifications - Environmental Data line.gif (50 bytes)

Standard Features and Configurable Components

Operating System
One of the following
Preinstalled Genuine Windows Vista Business 32*
Genuine Windows Vista Business 64*
Genuine Windows XP Professional SP2
FreeDOS
Supported Genuine Windows 2000
* Certain Windows Vista product features require advanced or additional hardware. See http://www.microsoft.com/windowsvista/getready/hardwarereqs.mspx and http://www.microsoft.com/windowsvista/getready/capable.mspx for details. Windows Vista Upgrade Advisor can help you determine which features of Windows Vista will run on your computer. To download the tool, visit http://www.windowsvista.com/upgradeadvisor.

The following features are not supported by Linux:

  • 1.2 TPM Embedded Security Chip integrated with Broadcom NIC
  • HP 16-in-1 Media Card Reader
  • HP Wireless A+G PCI Card
  • HP BT450 USB Bluetooth Wireless Printer and PC Adapter
  • Broadcom NetXtreme Gigabit Ethernet PCIe NIC Card
  • 2006 Agere PCI 56K International SoftModem
  • ATI Radeon X1300 (256MB SH) PCIe x16 Graphics Card
  • ATI Radeon X1300 Pro (256MB DH) PCIe x16 Graphics Card
  • ATI Radeon X1600XT (256MB DH FH) PCIe x16 Graphics Card
  • ATI Radeon HD 2400XT (256MB DH) PCIe x16 Graphics Card
  • HP USB Smartcard Keyboard
  • HP 2nd Serial Port adapter
  • HP FireWire / IEEE 1394 PCI Card

Value-added Software (on select models; not included with FreeDOS)HP Backup and Recovery ManagerMicrosoft Office 2007 Small Business*
HP Insight DiagnosticsMicrosoft Office Ready 2007*
Computer Setup UtilityMicrosoft Works*
McAfee Anti-Virus with 60 day Live Update SubscriptionMicrosoft Internet Explorer with AOL Toolbar
PDF Complete*
Intervideo WinDVD (supplied with DVD-ROM drive)HP Software Agent
Microsoft Office 2007 Basic*Altiris Deployment Solution Agent
Microsoft Office 2007 Professional*Smart Desktop Management Service (SDMS) Trial (XP Professional only)
NOTE:* optional purchase  

Value-added Software
(available for free download from the Web http://www.hp.com/
go/easydeploy
)
HP Client Configuration Manager, Basic Edition HP Systems Software Manager
HP Client Manager for Altiris HP Client Catalog for Microsoft SMS
Altiris Out-of-Band Management Solution Verdiem Surveyor agent
HP SoftPaq Download Manager  

Value-added Services and Features HP Stable Platform Program with Product Change Notification Factory Express Deployment and Lifecycle Services
Business-to-Business Portals TPM 1.2* Vista Bit-Locker Ready
HP Global Series Services Tool-less Serviceability
* TPM module disabled where use is restricted by law; for example, Russia.

Service and Support On-site Warranty and Service Note 1: This three-year (3-3-3), limited warranty and service offering delivers three years of parts, labor and on-site repair. Response time is next business-day Note 2 and includes free telephone support Note 3 24 x 7. Global coverage Note 2 ensures that any product purchased in one country and transferred to another non-restricted country will remain fully covered under the original warranty and service offering. Some countries/regions do not offer one year onsite and labor.
NOTE 1: Terms and conditions may vary by country. Certain restrictions and exclusions apply.
NOTE 2: On-site service may be provided pursuant to a service contract between HP and an authorized HP third-party provider, and is not available in certain countries. Global service response times are based on commercially reasonable best effort and may vary by country.
NOTE 3: Technical telephone support applies only to HP-configured, HP and HP-qualified, third-party hardware and software. Toll-free calling and 24 x 7 support may not be available in some countries.

 
Microtower
Small Form Factor
Chassis Dimensions
(H x W x D)
14.85 x 6.95 x 16.85 in
(377 x 177 x 428 mm)
4.5 x 15.5 x 13.5 in
(114 x 394 x 343 mm)
System weight*
23.44 lb (10.63 kg)
17.86 lb (8.10 kg)
System volume
1739 cu in (28,497.1 cu cm)
941.63 cu in (15,430.6 cu cm)
Shipping weight*
32.12 lb (14.57 kg)
26.70 lb (12.11 kg)
Shipping box dimensions
(H x W x D)
12.0 x 19.76 x 23.62 in
(305 x 502 x 600 mm)
9.72 x 19.68 x 22.67 in
(247 x 500 x 576 mm)
* Configured with 1 hard drive, 1 optical drive, no diskette drive, and no PCI card.
Power Supply
300W power supply –
passive PFC
240W power supply –
passive PFC
80 PLUS Power Supply
300W 80 PLUS* power supply – active PFC
240W 80 PLUS* power supply – active PFC
* This alternate 80% efficient power supply is a requirement for ENERGY STAR compliance in conjunction with a select range of processors and modules.
Ports    
USB 2.0
8 (2 front, 6 rear)
8 (2 front, 6 rear)
Serial
1 standard with 2nd optional
1 standard with 2nd optional
Parallel
1
1
PS/2
1 keyboard, 1 mouse
1 keyboard, 1 mouse
Video
analog for integrated graphics
analog for integrated graphics
DVI-D output
Integrated DVI-D output
Integrated DVI-D output
Support for Multi-Monitor
yes
yes
Audio
Front – mic and headphone
Rear* – line in, line out
Front – mic and headphone
Rear* – line in, line out
NIC (RJ-45)
Integrated Broadcom 5755 Gigabit Ethernet
Integrated Broadcom 5755 Gigabit Ethernet
NOTE:* Rear audio ports are re-taskable as Line-in, Line-out, or Microphone-in.

   
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Chipset ATI Express 1150 Chipset
X
X

Processor and Speed
One of the following
AMD Sempron Processors with HyperTransport Technology:  
AMD Sempron 3400+ Processor (1.8-GHz, 256K L2 cache, 1600-MHz FSB)
X
X
AMD Sempron 3600+ Processor (2.0-GHz, 256K L2 cache, 1600-MHz FSB)
X
X
AMD Sempron LE-1250 Processor (2.2-GHz, 512K L2 cache, 800-MHz FSB)
X
X
AMD Athlon 64 Processors with HyperTransport Technology:  
Athlon 64 3500+ Processor (2.2-GHz, 512K L2 cache, 2000-MHz FSB)
X
X
Athlon 64 3800+ Processor (2.4-GHz, 512K L2 cache, 2000-MHz FSB)
X
X
AMD Athlon Single-Core Processors with HyperTransport Technology:  
AMD Athlon LE-1640B Processor (2.7-GHz, 512K L2 cache, HT bus 2.0)
X
X
AMD Athlon X2 Dual-Core Processors with HyperTransport Technology:  
Athlon X2 BE-2350 Processor (2.1-GHz, 2x512K L2 cache, 2000-MHz FSB)
X
X
AMD Athlon 64 X2 Dual-Core Processors with HyperTransport Technology:  
Athlon 64 X2 Dual-Core 3800+ Processor (2.0-GHz, 2x512K L2 cache, 2000-MHz FSB)
X
X
Athlon 64 X2 Dual-Core 3800+ Processor 35-Watt (2.0-GHz, 2x512K L2 cache, 2000-MHz FSB)
X
X
Athlon 64 X2 Dual-Core 4000+ Processor (2.1-GHz, 2x512K L2 cache, 2000-MHz FSB)
X
X
Athlon 64 X2 Dual-Core 4200+ Processor (2.2-GHz, 2x512K L2 cache, 2000-MHz FSB)
X
X
Athlon 64 X2 Dual-Core 4400+ Processor (2.3-GHz, 2x512K L2 cache, 2000-MHz FSB)
X
X
AMD Athlon X2 4450B Processor (2.3-GHz, 1MB L2 cache, HT bus 2.0)
X
X
Athlon 64 X2 Dual-Core 4600+ Processor (2.4-GHz, 2x512K L2 cache, 2000-MHz FSB)
X
X
Athlon 64 X2 Dual-Core 4800+ Processor (2.5-GHz, 2x512K L2 cache, 2000-MHz FSB)
X
X
Athlon 64 X2 Dual-Core 5000+ Processor (2.6-GHz, 2x512K L2 cache, 2000-MHz FSB)
X
X
AMD Athlon X2 5000B Processor (2.6-GHz, 1MB L2 cache, HT bus 2.0)
X
X
Athlon 64 X2 Dual-Core 5200+ Processor (2.6-GHz, 2x1MB L2 cache, 2000-MHz FSB)
X
X
AMD Athlon X2 5200B Processor (2.7-GHz, 1MB L2 cache, HT bus 2.0)
X
X
AMD Athlon X2 5400B Processor (2.8-GHz, 1MB L2 cache, HT bus 2.0)
X
X
Athlon 64 X2 Dual-Core 5600+ Processor (2.8-GHz, 2x1MB L2 cache, 2000 MHz FSB)
X
X
Athlon 64 X2 Dual-Core 6000+ Processor (3.0-GHz, 2x1MB L2 cache, 2000 MHz FSB)
X
X

Memory

DDR2 SYNCH DRAM NON-ECC MEMORY
Memory upgrades are accomplished by adding single or multiple DIMMs of the same or varied sizes. This chart does not represent all possible memory configurations. Memory DIMMS must be populated beginning with DIMM slot 4 (Channel B) or DIMM slot 3 (Channel A). Slot 4 must be populated before slot 2, and slot 3 must be populated before slot 1.

HP recommends dual-channel configurations for maximum performance.
For best performance, place matching DIMMs in black memory slots 4 and 3 (and in white memory slots 2 and 1 if used). Matching DIMMs have the same size, speed, and number of memory chips. If the slot pairs are not matched, all the memory is still used, but the system will operate in single-channel mode. If speeds are mixed, speed will default to the slowest DIMM.


Microtower and Small Form Factor
   
Maximum Memory

Supports up to 8 GB of DDR2 Synch DRAM. Not all memory configurations possible are represented below.
NOTE: For systems configured with more than 3 GB of memory and a 32-bit operating system, all memory may not be available due to system resource requirements. Addressing memory above 4 GB requires a 64-bit operating system.

 
DIMM Size
Slot
 
WHITE
BLACK
 
1 (Channel A)
2 (Channel B)
3 (Channel A)
4 (Channel B)
512-MB
 
 
 
512-MB
512-MB
(dual-channel)
 
 
256-MB
256-MB
1-GB
 
 
1-GB
1-GB
(dual-channel)
 
 
512-MB
512-MB
2-GB
(dual-channel)
512-MB
512-MB
512-MB
512-MB
4-GB
(dual-channel)
1-GB
1-GB
1-GB
1-GB
8-GB
(dual-channel)
2-GB
2-GB
2-GB
2-GB

   
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Memory Configurations One of the following 512-MB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (1 x 512)
X
X
1-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (1 x 1GB)
X
X
1-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (2 x 512)
X
X
2-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (2 x 1GB)
X
X
2-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (1 x 2GB)
X
X
4-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (2 x 2GB)
X
X
8-GB DDR2 Synch Dram PC2-6400 (800-MHz) Non ECC (4 x 2GB)
X
X
512-MB DDR2 Synch Dram PC2-5300 (667-MHz) Non ECC (1 x 512)
X
X
512-MB DDR2 Synch Dram PC2-5300 (667-MHz) Non ECC (2 x 256)
X
X
1-GB DDR2 Synch Dram PC2-5300 (667-MHz) Non ECC (2 x 512)
X
X
1-GB DDR2 Synch Dram PC2-5300 (667-MHz) Non ECC (1 x 1GB)
X
X
2-GB DDR2 Synch Dram PC2-5300 (667-MHz) Non ECC (4 x 512)
X
X
2-GB DDR2 Synch Dram PC2-5300 (667-MHz) Non ECC (2 x 1GB)
X
X
4-GB DDR2 Synch Dram PC2-5300 (667-MHz) Non ECC (4 x 1GB)
X
X

Expandability
Microtower
Small Form Factor
PCI slots
2 Full Length 5V 32 bit PCI slots
2 LP 5V 32 bit PCI slots
Max power per slot
25W
25W
PCIe x1 slot
1
1
Max power per slot
10W
10W
PCIe X16 slot
1 Full Height card
1 LP profile card
Max power per slot
75W
25W
External Bays
  3.5”
1
1
  5.25”
2
1
IDE
  Internal 3.5” HDD Bays
2
1
Hard Drive Controller (SATA) Supported
SATA
SATA
Hard Drive Interfaces Supported
SATA 3.0Gb/s
SATA 3.0Gb/s

Microtower
Small Form Factor
Drive Support
 
Microtower
Small Form Factor
 
Media Card Reader or Diskette Drive (optional)
5.25” Serial ATA Devices
3.5” Serial ATA Devices
Media Card Reader or Diskette Drive
(optional)
5.25” Serial ATA Devices
3.5” Serial ATA Devices
Quantity Supported
1
2
2
1
1
2
Position Supported
,
,,
,
Controller
USB/Diskette
SATA
SATA
USB/Diskette
SATA
SATA

   
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Hard Drive
One or two of the following
80-GB SATA 3.0-Gb/s Hard Drive (7200 rpm)
X
X
160-GB SATA 3.0-Gb/s Hard Drive (7200 rpm)
X
X
250-GB SATA 3.0-Gb/s Hard Drive (7200 rpm)
X
X
80-GB SATA 3.0-Gb/s NCQ Hard Drive (10,000 rpm)
X
 
160-GB SATA 3.0-Gb/s NCQ Hard Drive (10,000 rpm)
X
 
RAID 80-GB SATA 3.0-Gb/s Hard Drive (7200 rpm)
X
X
RAID 160-GB SATA 3.0-Gb/s Hard Drive (7200 rpm)
X
X
RAID 250-GB SATA 3.0-Gb/s Hard Drive (7200 rpm)
X
X
2nd hard drive, 80-GB SATA 3.0-Gb/s Hard Drive (7200 rpm)
X
X
2nd hard drive, 160-GB SATA 3.0-Gb/s Hard Drive (7200 rpm)
X
X
2nd hard drive, 250-GB SATA 3.0-Gb/s Hard Drive (7200 rpm)
X
X
  SATA HDD2 Cable – Microtower
X
  SATA HDD2 Cable – Small Form Factor
X

Removable Storage
One or more of the following depending on form factor (see Storage – Drive Support section above)
Diskette Drives    
1.44-MB Diskette Drive
X
X
Media Reader    
HP 16-in-1 Media Reader (USB connection on the system board)
X
X
Optical Drives    
SATA CD-ROM Drive 1st Drive
X
X
SATA DVD-ROM Drive 1st Drive
X
X
SATA CD-RW/DVD-ROM Combo Drive 1st Drive
X
X
SATA DVD+/-RW (DL/DF) LightScribe Drive 1st Drive
X
X
  SATA 16X DVD+/-RW LightScribe 1st Drive*
X
X
  SATA 48X/32X Combo 1st Drive*
X
X
  SATA CD-ROM Drive 2nd Drive
X
X
  SATA DVD-ROM Drive 2nd Drive
X
X
  SATA CD-RW/DVD-ROM Combo Drive 2nd Drive
X
X
  SATA DVD+/-RW (DL/DF) LightScribe Drive 2nd Drive
X
X
  SATA 16X DVD+/-RW LightScribe 2nd Drive*
X
X
  SATA 48X/32X Combo 2nd Drive*
X
X
  *Work with Windows Vista.    
  Removable Hard Drives*    
  Removable 3.5" 80GB SATA 3.0 Gb/s (7200 rpm)
X
X
  Removable 3.5" 160GB SATA 3.0 Gb/s (7200 rpm)
X
X
  Removable 3.5" 250GB SATA 3.0 Gb/s (7200 rpm)
X
X
  *Removable Hard Drive replaces Optical Drive in Bay 1.    
  Flash Module    
  1GB Flash Module for ReadyBoost™
X
X

Security 1.2 TPM Embedded Security Chip* integrated with Broadcom NIC
X
X
HP ProtectTools Security Software Suite with BIOS Configuration (Serial, Parallel, USB Enable/Disable), Credential Manager, Smart Card Manager
X
X
HP Desktop Security lock kit (lock and cable)
X
X
Security cable with Kensington lock
X
X
* TPM module disabled where use is restricted by law; for example, Russia.    

NIC Broadcom 5755 Gigabit Ethernet integrated on system board
X
X

Wireless Wireless A+G PCI Card (full height bracket)
X
Wireless A+G PCI Card (low profile bracket)
X

Modem 2006 Agere PCI 56K International SoftModem (full height)
X
2006 Agere PCI 56K International SoftModem (low profile)
X

GraphicsIntegrated ATI Radeon X300 graphics with VGA and DVI-D
X
X
ATI Radeon X1300 (256MB SH) PCIe x16 Graphics Card
X
X
ATI Radeon X1300 Pro (256MB DH) PCIe x16 Graphics Card
X
X
ATI Radeon X1600XT (256MB DH FH) PCIe x16 Graphics Card
X
ATI Radeon HD 2400XT (256MB DH) PCIe x16 Graphics Card
X
X
ATI Radeon HD 3650 (512MB DH) PCIe x16 Graphics Card
X
X

Audio Integrated High Definition audio with Realtek 2 channel ALC260 codec (all ports are stereo)
X
X
Microphone and Headphone front ports
X
X
Line-out and Line-In rear ports*
X
X
Aux Input connection on system board
X
X
Internal Speaker
X
X
* Rear audio ports are re-taskable as Line-in, Line-out, or Microphone-in. External speakers must be powered externally.

Input DevicesKeyboard – One of the following  
HP PS/2 Standard Keyboard
X
X
HP USB Standard Keyboard
X
X
HP USB Smartcard Keyboard
X
X
Mouse – One of the following  
USB 2-Button Laser Mouse
X
X
HP PS/2 2-Button Scroll Mouse
X
X
HP PS/2 2-Button Optical Scroll Mouse
X
X
HP USB 2-Button Optical Scroll Mouse
X
X

Miscellaneous HP FireWire / IEEE 1394 PCI Card (full height)
X
HP FireWire / IEEE 1394 PCI Card (low profile)
X
2nd serial port adapter
X
2nd serial port adapter (low profile)
X
Thermal Kit – Microtower
X
Thermal Kit – Small Form Factor
X
Tower stand
X
  XP Pro System Recovery CD US
X
X
  Vista Business System Recovery DVD Kit
X
X
  1-GB Flash Module for ReadyBoost
X
X
contents
 Overview      Configurable Components - Select Models (localized by Regions)      Standard Features and Configurable Components      After-Market Options      Technical Specifications      Technical Specifications - Audio      Technical Specifications - Communications      Technical Specifications - Graphics      Technical Specifications - Hard Drives      Technical Specifications - Input/Output Devices      Technical Specifications - Optical Storage      Technical Specifications - Removable Storage      Technical Specifications - Environmental Data line.gif (50 bytes)

After-Market Options

   
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Part Number
Communications Wireless LAN
HP Wireless A+G PCI Card (North America only)
X
X
EA118AA
bt450 Bluetooth Wireless Printer and PC Adapter (IPG)
X
X
Q6398A#ABA
NICs
Intel Pro 1000 PT Gb Ethernet PCIe NIC
X
X
EH352AA
Broadcom NetXtreme Gigabit Ethernet PCIe NIC Card
X
X
EA833AA
Modem
Agere 2006 PCI 56K International Modem
X
X
EK694AA
Connectivty
Bundle Connectivity Starter Kit – Surge Protector/LAN cable/Printer cable
X
X
RT174AA

Office 2007 Media-less License Kits (MLKs) MS Office Basic Edition 2007 – Media-less License Kit
X
X
RZ361A#ABA
MS Office Small Business Edition 2007 – Media-less License Kit
X
X
RZ365A#ABA
MS Office Professional Edition 2007 – Media-less License Kit
X
X
RZ363A#ABA

Graphics Single head solutions
NVIDIA GeForce 256MB Single Head PCIe x16, low profile Graphics Card
X
X
GJ119AA
Multi head solutions
ATI RADEON X1300 Pro (256MB DH) PCIe Graphics Card
X
X
AH050AA
ATI HD 2400 XT 256MB Dual Head PCIe x16, low profile Graphics Card
X
X
KD060AA
HP DMS59 DVI Dual-head Connector Cable
X
X
DL139A
ATI Radeon HD 3650, 512MB Dual Head PCIe x16, full height Graphics Card
X
  KS505AA

Hard Drives HP 80-GB SATA 3.0-Gb/s Hard Drive
X
X
PY276AA
HP 160-GB SATA 3.0-Gb/s Hard Drive
X
X
PY277AA
HP 250-GB SATA 3.0-Gb/s Hard Drive
X
X
PY278AA

Input/Output DevicesHP PS/2 Standard Keyboard
X
X
DT527A#ABA
HP USB Standard Keyboard
X
X
DT528A#ABA
HP USB BG1650 Standard Keyboard
X
X
DT529A#ABA
HP USB Smartcard Keyboard
X
X
ED707AA#ABA
HP USB 2-Button Laser Mouse
X
X
GW405AA
HP USB 2-Button Optical Scroll Mouse (Carbonite/Silver)
X
X
DC172B
PS/2 2-Button Optical Scroll Mouse  
EY703AA

Memory (DIMMs) PC2-6400 (DDR2 800 MHz) DIMMs   
HP 2-GB PC2-6400 (DDR2 800 MHz) DIMM
X
X
AH060AA
HP 1-GB PC2-6400 (DDR2 800 MHz) DIMM
X
X
AH058AA
HP 512-MB PC2-6400 (DDR2 800 MHz) DIMM
X
X
AH056AA

MonitorsCRTs3PO Offering
Business LCD Monitors 
HP L1506 15-inch LCD Monitor PX848AA#ABA
HP w17e 17-inch LCD Monitor (offering 1/1/1 warranty)GV537AA#ABA
HP L1710 17-inch LCD Monitor GS917AA#ABA
HP L1750 17-inch LCD Monitor GF904AA#ABA
HP L1745 17-inch LCD Monitor GE178AA#ABA
HP L1910 19-inch LCD Monitor GS918AA#ABA
HP L1950 19-inch LCD Monitor (disco 8.31.08 - transition to L1950g)GG458AA#ABA
HP L1950g 19-inch LCD Monitor (launching 8.4.08)KR145AA#ABA
HP LP1965 19-inch LCD Monitor RA373AA#ABA
HP LP2065 20-inch LCD Monitor EF227A4#ABA
Business Widescreen LCD MonitorsGX007AA#ABA
HP L1908w 19-inch Widescreen LCD Monitor GP536AA#ABA
HP L1945w 19-inch Widescreen LCD Monitor KD286AA#ABA
HP L2045w 20-inch Widescreen LCD Monitor RD125AA#ABA
HP L2208w 22-inch Widescreen LCD Monitor GX007AA#ABA
HP L2245w 22-inch Widescreen LCD Monitor (disco 8.31.08 - transition to L2245wg)GX008AA#ABA
HP L2245wg 22-inch Widescreen LCD Monitor (launching 8.4.08)FL472AA#ABA
HP LP2275w 22-inch Widescreen LCD Monitor (launching 8.4.08)KE289A4#ABA
HP L2445w 24-inch Widescreen LCD Monitor (launching 9.2.08)KT931AA#ABA
HP LP2465 24-inch Widescreen LCD Monitor (disco 10.31.08 - transition to LP2475wEF224A4#ABA
HP LP2465 24-inch Widescreen LCD Monitor (launching 9.2.08)KD911A4#ABA
HP LP3065 30-inch Widescreen LCD MonitorEZ320A4#ABA
Business Widescreen LCD Monitor with Integrated Speakers 
HP L1908wm 19-inch Widescreen LCD Monitor with Built in Integrated Speakers KA214AA#ABA
Business GSA Monitors 
HP L1750 17-inch TAA LCD Monitor GF904A2#ABA
HP L1950 19-inch TAA LCD Monitor (disco 8.31.08 - transition to L1950g)GG458A2#ABA
HP L1950g 19-inch TAA LCD Monitor (launching 8.4.08)KR145A2#ABA
Business Touchscreen LCD Monitor 
HP L5006tm 15-inch Touch Screen LCD MonitorRB146AA#ABA
Business LCD Monitor with Integrated Work Stand 
HP L1908wi 19-inch Widescreen LCD Monitor plus Integrated Work StandGP537AA#ABA
HP L1910i 19-inch LCD Monitor plus Integrated Work StandGS581AA#ABA
Options 
HP Flat Panel Speaker BarEE418AA
HP Quick Release KitEM870AA
HP Integrated Work Stand (stand alone)GN783AA
HP DreamColor Advanced Profiling Solution (aka Puck)KZ300AA
HP LCD Hood KitKZ301AA
3M 17-in Privacy Screen Filter KM218AA
3M 19-in Privacy Screen Filter KZ310AA

Multimedia Thin USB Powered Speakers
X
X
KK912AA
Flat Panel Speaker Bar
X
X
EE418AA

Optical Drives DVD-ROM Drive    
HP SATA DVD-ROM Drive
X
X
AH047AA
Combo Drive    
HP SATA CD-RW/DVD-ROM Combo Drive
X
X
AH046AA
DVD+/-RW Drive    
HP SATA DVD+/-RW (DL/DF) SuperMulti LightScribe Drive
X
X
GF343AA

Removable Storage Diskette and Digital Drives      
HP 1.44-MB Internal Diskette Drive
X
X
AH053AA
HP 1.44 USB Floppy Drive – External
X
X
DC141B
Removable Hard Drive      
HP Removable SATA Hard Drive Enclosure (Frame & Carrier)
X
X
RY102AA
HP Removable SATA Hard Drive Enclosure (Carrier Only)
X
X
RY103AA
Multimedia    
HP 16-in-1 Media Card Reader
X
X
EM718AA

Security Kensington lock
X
X
PC766A
HP Business PC Security Lock
X
X
PV606AA
HP USB Smartcard Keyboard
X
X
ED707AA#ABA
Protect Tools (version3.0)
X
X
KN780AA
HP Smart Data Protection Service
X
X
BB731UT

Manageability HP Client Configuration Manager, Premium Edition
X
X
T3488AA
(use T3489AA for 1000 licenses)
Altiris Client Management Suite Level 1
  Includes:
  Altiris Deployment Solution
  Altiris Inventory Solution
  Altiris Application Metering Solution
  Altiris Carbon Copy Solution
  Altiris Software Delivery Solution
  Altiris Application Management Solution
  Altiris Patch Management Solution
X
X
DR605A
(use DR606A for 1000+ licenses)

Miscellaneous Accessories HP 2nd Serial Port adapter
X
X
PA716A
Belken USB to Serial Adapter
X
X
EM449AA
HP FireWire / IEEE 1394 PCI Card
X
X
PA997A
Tower Stand-Carbonite  
X
RG048AA
5.25" Blank Bezel Kit (Carbonite 50/Bulk Pack)
X
X
DC177B
DVI to DVI Cable
X
X
DC198A
Local Area Network (LAN) cable
X
X
AH122AA
Firewire (1394) Cable
X
X
AH123AA
7-outlet Surge Protector
X
X
AG290AA#ABA
HP 1TB Media Vault Pro MV5140
X
X
GX667AA#ABA
HP 1.5TB Media Vault Pro MV5150
X
X
GX668AA#ABA
contents
 Overview      Configurable Components - Select Models (localized by Regions)      Standard Features and Configurable Components      After-Market Options      Technical Specifications      Technical Specifications - Audio      Technical Specifications - Communications      Technical Specifications - Graphics      Technical Specifications - Hard Drives      Technical Specifications - Input/Output Devices      Technical Specifications - Optical Storage      Technical Specifications - Removable Storage      Technical Specifications - Environmental Data line.gif (50 bytes)

Technical Specifications

Unit Environment and Operating Conditions
Microtower
Small Form Factor

General Unit Operating Guidelines (Need this updated for dc5750)

  • Keep the computer away from excessive moisture, direct moisture and the extremes of heat and cold, to ensure that unit is operated within the specified operating range.
  • Leave a 4 in (10.2 cm) clearance on all vented sides of the computer to permit the required airflow.
  • Never restrict airflow into the computer by blocking any vents or air intakes.
  • Do not stack computers on top of each other or place computers so near each other that they are subject to each other's re-circulated or preheated air.
  • Occasionally clean the air vents on the front, back, and any other vented side of the computer. Lint, dust and other foreign matter can block the vents and limit the airflow.
  • If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must be provided on the enclosure, and the same operating guidelines listed above will still apply.
Temperature Range
Operating: 50° to 95° F (10° to 35° C)*
Non-operating: -22° to 140° F(-30° to 60° C)
Relative Humidity
Operating: 10% to 90% (non-condensing at ambient)
Non-operating: 5% to 95% (non-condensing at ambient)
Maximum Altitude (unpressurized)
Operating: 10,000 ft (3048 m)
Non-operating: 30,000 ft (9144 m)
*NOTE: Operating temperature is de-rated 1.0 deg C per 300 m (1000 ft) to 3000 m (10,000 ft) above sea level, no direct sustained sunlight. Maximum rate of change is 10 deg C/Hr. The upper limit may be limited by the type and number of options installed.
 
 
Microtower
Small Form Factor
Power Supply
300-watt BTX power supply – Passive PFC
115v/230v line switch
300-watt 80 PLUS* BTX power supply – Active PFC
240-watt BTX power supply – Passive PFC
115v/230v line switch
240-watt 80 PLUS* BTX power supply – Active PFC
Operating Voltage Range
90 to 132VAC, or 180 to 264VAC
90 to 264VAC
90 to 132VAC, or 180 to 264VAC
90 to 264VAC
Rated Voltage Range
100 to 127VAC, or 200 to 240VAC
100 to 240VAC
100 to 127VAC, or 200 to 240VAC
100 to 240VAC
Rated Line Frequency
50/60 Hz
50/60 Hz
50/60 Hz
50/60 Hz
Operating Line Frequency Range
47–63 Hz
47–63 Hz
47–63 Hz
47–63 Hz
Rated Input Current
8A/4A
5A/2.5A
6A/3A
3.5A/1.75
Heat Dissipation
Typical 315 btu/hr
(79 kg-cal/hr)
Maximum 1575 btu/hr
(397 kg-cal/hr)
Typical 270 btu/hr
(68 kg-cal/hr)
Maximum 1280 btu/hr
(322 kg-cal/hr)
Typical 315 btu/hr
(79 kg-cal/hr)
Maximum
1260 btu/hr
(317 kg-cal/hr)
Typical 270 btu/hr
(68 kg-cal/hr)
Maximum 1025 btu/hr
(258 kg-cal/hr)
Power Supply Fan
Variable speed fan
Variable speed fan
Variable speed fan
Variable speed fan
ENERGY STAR Compliant
X
X
FEMP Standby Power Compliant
(<2W in S5 – Power Off)**
X
X
X
X
Power Consumption in ES Mode – Suspend to RAM (S3)
(Instantly Available PC)
<4W
<3W
<4W
<3W
NOTES:
* This 80% efficient power supply is a requirement for ENERGY STAR compliance in conjunction with a select range of processors and modules.
** Power consumption in the Off/Apparent Off mode is measured and reported with the network interface controller "Wake on LAN" feature disabled in F10 Setup (default is "enabled").
 
ROM BIOS Information

Key features of the HP BIOS in the dc5750 include:

  • Deployment and manageability – HP BIOS provides several technologies that help integrate the HP Business desktop computer into the enterprise, such as PXE, remote configuration, remote control, and F10 Setup support for 12 languages.
  • Stability – HP BIOS supports the HP stable product roadmap by releasing only critical BIOS changes to the factory and advanced change notification.
  • Security – HP BIOS offers a robust and flexible set of security features to help the system administrator secure their systems from removal of sensitive data, and help prevent access by unauthorized users, subversion of OS security policies, removal of hardware, flash of rogue BIOS images, and attacks on BIOS settings.
  • Thermal and power management – The HP BIOS provides and enables thermal and power management technologies to assist in operating the HP Business Desktop computer in any enterprise environment.
  • Serviceability – HP BIOS provides diagnostic and detailed service information.
  • Upgrades and recovery – HP BIOS provides numerous ways to upgrade HP Business Desktop computers, including BIOS updates from within DOS (Flashlite), BIOS updates from within Windows (HPQFlash, SSM), HP Client Manager, and fail-safe recovery. In addition, the HP Business Desktop BIOS Utilities tool enables replicated BIOS setup throughout the Enterprise; it is available from within the BIOS software and from the support website.

Additional HP BIOS Features

  • Administrator password – Also known as the setup password, this helps prevent unauthorized changes to the system configuration. If the administrator password is not known, the BIOS version cannot be changed and changes cannot be made to BIOS settings using F10 setup or under the OS.
  • Advanced Configuration and Power Interface (ACPI) – Represents a significant innovation in power and configuration management, allowing operating systems and applications to manage power based on activity and usage. HP Compaq dc5750 models use ACPI to provide power conservation features under Windows XP.
 
Other Features Description
ACPI-Ready Hardware

Advanced Configuration and Power Management Interface (ACPI).

  • Allows the system to wake from a low power mode.
  • Controls system power consumption, making it possible to place individual cards and peripherals in a low-power or powered-off state without affecting other elements of the system.
SMBIOS Ver. 2.4 System Management BIOS, previously known as DMI BIOS, for system management information
AMD Cool 'n Quiet A setting in F10 Setup allows the system to automatically adjust the CPU speed, voltage and power combination to match the instantaneous user performance need. The AMD driver for this feature requires Windows XP SP2.
Dual-State Power Button Power button acts as both an on/off button and suspend-to-sleep button
 
Serviceability Features of System
Dual Color Power LED on Front of Computer (Indicates Normal Operations and Fault Conditions)
Diagnostic LED Explanation Table Number of 1-second red LED blinks followed by 2-second pause, then repeats:
2-processor thermal protection activated
3-processor not installed
4-power supply failure
5-memory error
6-video error
7-PCA failure (ROM detected failure prior to video)
8-invalid ROM, bootblock recover mode
  • System/Emergency ROM
  • Flash ROM
  • CMOS Battery Holder for easy Replacement
  • Flash Recovery with Video
  • 5 Aux Power LED on System PCA
  • Processor ZIF Socket for easy Upgrade
  • Over-Temp Warning on Screen (Requires IM Agents)
  • Clear Password Jumper
  • DIMM Connectors for easy Upgrade
  • Restore CD
  • Clear CMOS Button
  • NIC LEDs (integrated) (Green & Amber)
 
Serviceability Features of Chassis
  • Dual Color Power and HD LED – To Indicate Normal Operations and Fault Conditions
  • Color coordinated cables and connectors
  • Tool-less Hood Removal
  • Front power switch
  • System memory can be upgraded without removing the system board or any internal components
  • Tool-less Hard Drive, CD & Diskette Removal
   
Feature Description
ASF 2.0 support (Alert Standard Format) Industry-standard specification for network alerting and remote control in operating system-absent environments
Towerable Product can be oriented as a tower (in addition to desktop orientation)
Drive Self Tests (DPS)
  • Drive Protection System
  • A diagnostic hard drive self test. It scans critical physical components and every sector of the hard drive for physical faults and then reports any faults to the user.
  • Running independently of the operating system, it can be accessed through a Windows-based diagnostics utility or through the computer's setup procedure. It produces an evaluation on whether the hard drive is the source of the problem and needs to be replaced.
  • The system expands on the Self-Monitoring, Analysis, and Reporting Technology (SMART), a continuously running systems diagnostic that alerts the user to certain types of failures.
DPS Access through F10 Setup during Boot
SMART Technology*
(Self-Monitoring, Analysis and Reporting Technology)

Allows hard drives to monitor their own health and to raise flags if imminent failures were predicted

  • Predicts failures before they occur. Tracks fault prediction and failure indication parameters such as re-allocated sector count, spin retry count, calibration retry count
  • By avoiding actual hard drive failures, SMART hard drives act as "insurance" against unplanned user downtime and potential data loss from hard drive failure
SMART I – Drive Failure Prediction
SMART II – Off-Line Data Collection
SMART III – Off-Line Read Scanning with Defect Reallocation
* This feature is inoperable when a RAID (Redundant Array of Independent Disks) configuration is enabled.
contents
 Overview      Configurable Components - Select Models (localized by Regions)      Standard Features and Configurable Components      After-Market Options      Technical Specifications      Technical Specifications - Audio      Technical Specifications - Communications      Technical Specifications - Graphics      Technical Specifications - Hard Drives      Technical Specifications - Input/Output Devices      Technical Specifications - Optical Storage      Technical Specifications - Removable Storage      Technical Specifications - Environmental Data line.gif (50 bytes)

Technical Specifications - Audio

High Definition Audio Type Integrated
High Definition Stereo Codec Yes – Realtek ALC260
Audio Jacks Microphone-In (64-K ohm Input Impedance)
Line-In (64-K ohm Input Impedance)
Line-Out * (200 ohms Output Impedance, expects at least a 10-K ohm load)
Headphone-Out (1 Ohm Output Impedance, expects at least a 32 ohm load)
NOTE: *Internal Speaker Amplifier is for Internal Speaker only. External Speakers need to be powered externally. Rear audio ports are re-taskable as Line-in, Line-out, or Microphone-in.
Sampling 8 kHz – 192 kHz
Wavetable Syntheses (software) Yes – Uses OS soft wavetable
Analog Audio Yes
Number of Channels on Line-Out
(mono/stereo)
Stereo (Left & Right channels)
Internal Audio Speaker Power Rating 1.5 W
Internal Speaker Yes; ability to mute internal speaker through F10 Setup
External Speaker Jack
(Line-Out)
Yes

HP Thin USB Powered Speakers On/Off/Volume Controls Right side of right speaker
Power LED Front of right speaker (green)
Frequency response FO to 20kHz
Watts 2/3 watt (normal/maximum)
Dimensions (H x W x D) Speakers: 5.72 x 3.74 x 0.96 in (14.52 x 9.50 x 2.45 cm) per speaker
Net weight 0.68 lbs (0.31kg)
Environmental
(all conditions
non-condensing)
Temperature (operating) 14° to 104° F (-10° to 40° C)
Relative Humidity (operating) 40% to 90%
Speaker cable length Input cord: 5.91 ft (1800mm±35mm)
L-channel cord: 3.28 ft (1000mm±35mm)
USB cord: 5.91 ft (1800mm±35mm)
Color HP Carbonite
contents
 Overview      Configurable Components - Select Models (localized by Regions)      Standard Features and Configurable Components      After-Market Options      Technical Specifications      Technical Specifications - Audio      Technical Specifications - Communications      Technical Specifications - Graphics      Technical Specifications - Hard Drives      Technical Specifications - Input/Output Devices      Technical Specifications - Optical Storage      Technical Specifications - Removable Storage      Technical Specifications - Environmental Data line.gif (50 bytes)

Technical Specifications - Communications

Integrated Broadcom 5755 Gigabit Ethernet Connector RJ-45
Controller Broadcom 5755 PCI-Express LAN Controller
Memory Integrated 96Kb on chip buffer memory
Data rates supported 10/100/1000 Mbps
Compliance IEEE 802.1P, 802.1Q, 802.2, 802.3, 802.3AB and 802.3u compliant, 802.3x flow control
Bus architecture PCI-E
Data path width Single channel, PCI-E
Data transfer mode Bus-master DMA
Hardware certifications FCC, B, CE, TUV- cTUVus Mark Canada and United States
Power requirement 1.33 watts @ +3.3V AUX supply with 5V tolerance
Boot ROM support Yes
Network transfer mode Full-duplex
  Half-duplex (not available for the 1000BASE-T transceiver)
Network transfer rate 10BASE-T (half-duplex) 10 Mbps
10BASE-T (full-duplex) 20 Mbps
100BASE-TX (half-duplex) 100 Mbps
100BASE-TX (full-duplex) 200 Mbps
1000BASE-T (full-duplex) 2000 Mbps
Environmental Operating temperature 32° to 131°F (0° to 55° C)
Operating humidity 85% at 131° F (55° C)
Management capabilities ASF 2.0, ACPI, WOL and DMI 2.0, PXE 2.0, WfM 2.0, Broadcom mgmt utility
Alerting ASF 2.0

HP Wireless A+G PCI Dimensions 4.99 x 2.54 x 0.71 in (126.8 x 64.4 x 18.0 mm)
Weight 0.268 lb (65 g)
Controller
system interface
Atheros AR5414X chipset
PCI Spec 2.2
Network standard IEEE 802.11a/b/g
Frequency band 5.1500 to 5.8500 GHz
  2.4000 to 2.4835 GHz
Operating temperature 32° to 140° F (0° to 60° C), operating
Storage temperature -4° to 176° F (-20° to 80° C), non-operating
Humidity 10% to 85% non-condensing
Operating voltage 5V ± 5%
Power consumption Tx/Rx peak 560/250mA @ 3.3V (max.)
Output power (approximately) 15 dBM ±2dB
Receive sensitivity -90dBm at 11 Mbps (typical)
Data transfer rate Standard rates of 1, 2, 5.5, 11, 6, 9, 12, 18, 24, 48, 54 and Super AG Mode108-Mbps
Spreading DSSS (Direct Sequence Spread Spectrum)
Security 64(40h) bit, 128(104h) bit, WPA, IEEE802.1X, AES-OCB, AES-CCM, Microsoft PEAP,TKIP, WEP.
Antenna External 5dBi antenna
Throughput 108 Mbps (only with Belkin 54G or above router that supports 108 Mbps speed) 200 ft (60.96 m) – Indoor
54 Mbps 200 ft (60.96 m) – Indoor
  11 Mbps 200 ft (60.96 m) – Indoor
Certifications Wi-Fi certified
Certifications for use by country North America: United States, Canada

2006 Agere PCI 56K International SoftModem Data Transmission Technology speeds: 56,000 Kbps maximum downstream data, controllerless
NOTE: 56 Kbps technology refers to download speeds only and requires compatible modems at server sites. Other conditions may limit modem speed. FCC limitations allow a maximum of 53 Kbps during download transmissions.
Data Speeds (Upload only) 33,600/31,200/28,800/26,400/21,600/19,200/16,800/14,400/12,000/
9,600/7,200/4,800/2,400/1,200/300
Data Standards ITU-T V.90, ITU-T, ITU-T V.34, V.44, V.42, V.42bis21, V.32bis, Bell 212A, and Bell 103
Fax Speeds 14,400/12,000/9,600/7,200/4,800/2,400/1,200/300 b/s
Fax Mode Capabilities ITU-T T.31 class 1 FAX, V. 17, V.29, V.27ter, and V.21 Channel 2
Error Correction and Data Compression V.44, 42bis, V.42 and MNP2-5
Power Management ACPI; PPMI 1.1 and wake support with PME and Vaux; meets PCI 2.3 requirements and PC 2001 requirements
Upgradeability Driver upgradeable for future enhancements
Video ITU-T V.80 video ready interface
Other TIA/EIA 602 standard AT command set
Integrated DTE interface with speeds of up to 115.2 Kbps, parallel 16550a UART-compatible interface
Optional ring wakeup signal
Operating Temperature 32° to 158° F (0° to 70° C)
Operating Humidity 20% to 90%, non-condensing
Power Requires a 3.3-V auxiliary power rail on PCI bus
Uses only one PCI load (i.e., one grant/request pair), one shared IRQ, one electrical load
Chipset Agere Systems SV92PL – Integrated PCI interface with 5-V tolerant buffers and CardBus support
Dimensions (L X H) Complies with PCI low profile specifications–6.7 x 2.3 in (17.0 x 5.8 cm) and supports high- and low-profile brackets
Connection Single RJ-11 connector
Other Features Digital line protection, call progress monitoring via on-board piezo device, support for high profile and low profile brackets, PnP ID support
Safety UL recognized to UL 1950, 3rd edition (U.S. and Canada); IEC 950 (TUV, NEMKO, DEMKO, SEMKO); CE Mark, EC 950 (TUV, NEMKO, DEMKO, SEMKO, CE mark
EMC FCC Part 15, IC ES003, EN 55022, 3rd edition, EN 55024, annex A, EN 61000-4-6, EN 61000-4-8
Telecom FCC Part 68, IC-CS-03 (Canada); Worldwide PTT approvals
Health Bare PCB material compliant to 94V-0 or better (marked as such)
Other PC 2001 compliant, PCI version 2.3, WHQL approved; ACPI compliant
contents
 Overview      Configurable Components - Select Models (localized by Regions)      Standard Features and Configurable Components      After-Market Options      Technical Specifications      Technical Specifications - Audio      Technical Specifications - Communications      Technical Specifications - Graphics      Technical Specifications - Hard Drives      Technical Specifications - Input/Output Devices      Technical Specifications - Optical Storage      Technical Specifications - Removable Storage      Technical Specifications - Environmental Data line.gif (50 bytes)

Technical Specifications - Graphics

Integrated ATI RADEON X300 Graphics 3D/2D Controller Full Microsoft DirectX® 9 based with Shader 2.0 support, full precision floating point pixel pipeline, 2x, 4x, or 6x Anti-Aliasing, hidden surface removal using 16, 24, or 32-bit Z-Buffering, and support for 12-bit per pixel formats. Support for Microsoft's DirectDraw, Double Buffering, Virtual Sprites, Transparent Blit, and Masked Blit.
VGA/DVI Controller Integrated
Bus Type PCI Express™ x16 for optional graphics upgrade.
RAMDAC Integrated
Memory UMA mode operation uses from 32MB up to 256MB of shared system memory.
Controller Clock Speed 400 MHz
Overlay Planes Back end overlay supporting Motion Adaptive De-Interlacing
Maximum Color Depth 32 bits/pixel
Maximum Vertical Refresh Rate Supports resolutions up to 2045x1536 @ 32bpp.
Multi-display Support SURROUNDVIEW™ support for up to four monitors with an ATI discrete graphics card. Up to 2 displays can be supported via the motherboard's VGA and DVI-D connectors. An additional 2 displays can be supported via the ATI discrete graphics card. Dual independent display modes are supported.
Graphics/Video API Support Microsoft DirectX 9, DirectXVA®, VMR7, VMR9, GDI/GDI+; OpenGL® 1.4.

Integrated DVI-D support DVI-D Connector Compliant with DDWG (Digital Display Working Group) and VESA specifications for a single-link digital DVI (DVI-D) connector.
Dual Head Support Yes, when used with the integrated VGA connector
Display Devices Supported HP L1530
HP L1740
HP L1755
HP L1940
HP L1955
HP L2035
HP L2335
Color Depth All modes support 8-bpp, 16-bpp, and 24-bpp color depths
Host Interface Connector Mechanically compliant with PCI-E standard
Dot Clock 165 MHz maximum
Display Modes Supports display modes that require up to 165-MHz bandwidth on the link, as shown in the following table.
Resolution
60-Hz LCD
60-Hz
75-Hz
85-Hz
Blanking
5% reduced
GTF
GTF
GTF
640 x 480 VGA
Yes
Yes
Yes
Yes
800 x 600 SVGA
Yes
Yes
Yes
Yes
1024 x 768 XGA
Yes
Yes
Yes
Yes
1280 x 1024 SXGA
Yes
Yes
No
No
1600 x 1200 UXGA
Yes
Yes
No
No
 
ATI RADEON X1300 Pro PCIe Graphics Card
(256 MB)
Bus Type PCI Express (x16 lanes)
Maximum Vertical Refresh Rate 85 Hz
Display Support Integrated 400 MHz RAMDAC
Display Max Resolution 2048 x 1536
Board Display Options DVI-I + TV
DVI-I supports analog CRT or flat panel or digital flat panel (using DVI-A, DVI-D or DVI-I connector)
DVI-I supports analog CRT or flat panel (with VGA connector and DVI-I to VGA dongle)
TV connector is a 4-pin mini-DIN S-video connector
Board Configuration
128 MB Frame Buffer
Specification Description
Graphics Chip RV515
Core clock 450 MHz
Memory clock 250 MHz
Frame buffer 256 MB DDR2
Languages supported 24 languages: English, Arabic, Chinese Simplified, Chinese Traditional, Czechoslovakian, Danish, Dutch, Finnish, French, German, Greek, Hebrew, Hungarian, Italian, Japanese, Korean, Norwegian, Polish, Portuguese, Russian, Spanish, Swedish, Thai, Turkish
Core Power 25 W (Max board power)
Option kit contents
  • ATI RADEON X1300 Pro (256MB) PCIe Graphics card with full height bracket attached
  • Low profile bracket
  • DVI-to-VGA Adapter
  • Software CD with graphics drivers
  • Warranty documentation
Compliance standards EMC Emissions:
a) FCC Part 15, Subpart B – Unintentional Radiators, Class B Computing Devices for Home & Office Use
b) CISPR22: 1997/EN 55022:1998 – Class B – Limits and methods of measurement of radio disturbance characteristics of Information Technology Equipment

EMC Immunity:
CISPR 24:1997/EN 55024:1998 – Information Technology Equipment - Immunity Characteristics – Limits and Methods of Measurement.

Safety:
UL 60950 (USA)


ATI RADEON X1600XT (256 MB DH) FH PCIe Graphics Card Bus Type PCI Express (x16 lanes)
Maximum Vertical Refresh Rate 85 Hz
Display Support Integrated 400 MHz RAMDAC
Display Max Resolution 2560 x 1600 digital, 2048 x 1536 analog
Board Display Options 2 DVI-I ports (one port supports dual link DVI). DVI-I supports an analog CRT or flat panel with a VGA connector via the provided DVI-I to VGA adapter
4-pin mini-DIN S-video connector for TV output
Board Configuration Specification Description
Graphics chip RV530
Core clock 590 MHz
Memory clock 690 MHz
Frame buffer 256 MB GDDR3, 128 bit wide
Operating Systems Support Windows 2000, Windows XP
Core Power 56 W (Max board power)

ATI Radeon HD 2400XT (256MB DH) PCIe Graphics Card Bus Type PCI Express (x16 lanes)
Maximum Vertical Refresh Rate 85 Hz
Display Support Integrated 400 MHz RAMDAC
Display Max Resolution 2560 x 1600 digital, 2048 x 1536 analog
Board Display Options Supports two displays via included DMS-59 to dual VGA cable or 2 DVI monitors via optional DMS-59 to dual DVI cable kit part number: DL139A.
4-pin mini-DIN S-video connector for TV output
Board Configuration Specification Description
Graphics chip RV610
Core clock 650 MHz
Memory clock 500 MHz
Frame buffer 256 MB GDDR3, 128 bit wide
Languages supported 24 languages: English, Arabic, Chinese Simplified, Chinese Traditional, Czechoslovakian, Danish, Dutch, Finnish, French, German, Greek, Hebrew, Hungarian, Italian, Japanese, Korean, Norwegian, Polish, Portuguese, Russian, Spanish, Swedish, Thai, Turkish
Core Power 21 W
Compliance standards EMC Emissions:
a) FCC Part 15, Subpart B – Unintentional Radiators, Class B Computing Devices for Home & Office Use
b) CISPR22: 1997/EN 55022:1998 – Class B – Limits and methods of measurement of radio disturbance characteristics of Information Technology Equipment
c) Canadian Standard ICES-003 is equivalent to CISPR22
d) Taiwanese Standard BSMI
e) Japanese VCCI
f) Australian C-Tick
g) Korean (MIC)
EMC Immunity:
CISPR 24:1997/EN 55024:1998 – Information Technology Equipment - Immunity Characteristics – Limits and Methods of Measurement.
ATI Radeon HD 2400XT (256MB DH) PCIe Graphics Card display resolutions and refresh rates
NOTE: Other resolutions may be available but are not recommended as the may not have been tested and qualified by HP.
Analog Resolution
640 x 480
800 x 600
1024 x 768
1280 x 768
1280 x 1024
1600 x 1024
1600 x 1200
1920 x 1080
1920 x 1200
1920 x 1440
2048 x 1536
Digital Resolution
640 x 480
800 x 600
1024 x 768
1280 x 768
1280 x 1024
1600 x 1024
1600 x 1200
1920 x 1200
Maximum Refresh Rate
85 Hz
85 Hz
85 Hz
85 Hz
85 Hz
85 Hz
85 Hz
85 Hz
75 Hz
85 Hz
75 Hz
Maximum Refresh Rate
60 Hz
60 Hz
60 Hz
60 Hz
60 Hz
60 Hz
60 Hz
60 Hz

ATI Radeon HD 3650 (512MB DH) PCIe x16 Graphics Card Bus type PCI Express (x16 lanes)
Maximum vertical refresh rate 85 Hz
Display support Integrated 400 MHz RAMDAC
Display max resolution 2560 x 1600 digital, 1920 x 1440 analog
Board display options Supports two displays via included two DisplayPort and one Dual Link DVII connectors.
Board configuration Specification Description
Graphics Chip RV635
Core clock 600 MHz
Memory clock 500 MHz
Frame buffer 512 MB DDR2, 128 bit wide
Languages supported 24 languages: English, Arabic, Chinese Simplified, Chinese Traditional, Czechoslovakian, Danish, Dutch, Finnish, French, German, Greek, Hebrew, Hungarian, Italian, Japanese, Korean, Norwegian, Polish, Portuguese, Russian, Spanish, Swedish, Thai, Turkish
Core power 56 W
Compliance standards EMC Emissions:
  1. FCC Part 15, Subpart B - Unintentional Radiators, Class B Computing Devices for Home & Office Use
  2. CISPR22: 1997/EN 55022:1998 - Class B - Limits and methods of measurement of radio disturbance characteristics of Information Technology Equipment
  3. Canadian Standard ICES-003 is equivalent to CISPR22
  4. Taiwanese Standard BSMI
  5. Japanese VCCI
  6. Australian C-Tick
  7. Korean (MIC)

EMC Immunity:
CISPR 24:1997/EN 55024:1998 - Information Technology Equipment - Immunity Characteristics - Limits and Methods of Measurement.

ATI Radeon HD 3650 (512MB DH) PCIe x16 Graphics Card display resolutions and refresh rates
NOTE: Other resolutions may be available but are not recommended as the may not have been tested and qualified by HP
Resolution Maximum Refresh Rate (Hz)
Analog Connection Digital Connection

640x480

85 60
800x600 85 60
1024x768 85 60
1280x720 85 60
1280x1024 85 60
1440x900 75 60
1600x1200 85 60
1680x1050 75 60
1920x1080 85 60-R
1920x1200 85 60-R
1920x1440 85 N/A
2048x1536 75 N/A
2560x1600 N/A 60*
* Only supported when using a dual-link DVI or DP connection
NOTE: 60-R denotes reduced blanking timings are used on single-link DVI connections and may be used with other digital connections

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Technical Specifications - Hard Drives

7200 rpm Serial ATA Hard Drives 250-GB Capacity 250,059,350,016 bytes
Height 1 in (2.54 cm)
Width Media diameter: 3.5 in (8.89 cm)
Physical size: 4 in (10.2 cm)
Interface Serial ATA (3.0 Gb/s)
Synchronous Transfer Rate (Maximum) Up to 3 Gb/s
Buffer 8 MB
Seek Time (typical reads, includes controller overhead, including settling) Single Track 1.0 ms
Average 8.5 ms
Full-Stroke 18 ms
Rotational Speed 7,200 rpm
Logical Blocks 488,397,168
Operating Temperature 41° to 131° F (5° to 55° C)
       
  160-GB Capacity 163,928,604,672 bytes
Height 1 in (2.54 cm)
Width Media diameter: 3.5 in (8.89 cm)
Physical size: 4 in (10.2 cm)
Interface Serial ATA (3.0 Gb/s)
Synchronous Transfer Rate (Maximum) Up to 3 Gb/s
Buffer 8 MB
Seek Time (typical reads, includes controller overhead, including settling) Single Track 0.9 ms
Average 9.3 ms
Full-Stroke 18 ms
Rotational Speed 7,200 rpm
Logical Blocks 320,173,056
Operating Temperature 41° to 131° F (5° to 55° C)
       
  80-GB Capacity 80,026,361,856 bytes
Height 1 in (2.54 cm)
Width Media diameter: 3.5 in (8.89 cm)
Physical size: 4 in (10.2 cm)
Interface Serial ATA (3.0 Gb/s)
Synchronous Transfer Rate (Maximum) Up to 3 Gb/s
Buffer 8 MB
Seek Time (typical reads, includes controller overhead, including settling) Single Track 2.0 ms
Average 9.3 ms
Full-Stroke 21 ms
Rotational Speed 7,200 rpm
Logical Blocks 156,301,488
Operating Temperature 41° to 131° F (5° to 55° C)
       
10,000 RPM Serial ATA Hard Drives 160-GB Capacity 160,041,885,696 bytes
Height 1 in (2.54 cm)
Width Media diameter: 3.0 in (7.62 cm)
Physical size: 4 in (10.2 cm)
Interface Serial ATA (1.5 Gb/s), Native Command Queuing enabled
Synchronous Transfer Rate (Maximum) Up to 1.5 Gb/s
Cache 16 Mbytes
Seek Time (typical reads, includes controller overhead, including settling) Single Track 0.3 ms
Average 4.6 ms
Full-Stroke 10.2 ms
Rotational Speed 10,000 rpm
Logical Blocks 312,581,808
Operating Temperature 41° to 131° F (5° to 55° C)
       
  80 GB Capacity 80,026,361,856 bytes
Height 1 in (2.54 cm)
Width Media diameter: 3.0 in (7.62 cm)
Physical size: 4 in (10.2 cm)
Interface Serial ATA (1.5 Gb/s), Native Command Queuing enabled
Synchronous Transfer Rate (Maximum) Up to 1.5 Gb/s
Cache 16 Mbytes
Seek Time (typical reads, includes controller overhead, including settling) Single Track 0.3 ms
Average 4.6 ms
Full-Stroke 10.2 ms
Rotational Speed 10,000 rpm
Logical Blocks 156,301,488
Operating Temperature 41° to 131° F (5° to 55° C)
contents
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Technical Specifications - Input/Output Devices

USB Standard Keyboard Physical
characteristics
Keys 104, 105, 106, 107, 109 layout (depending upon country)
Dimensions (L x W x H) 18.0 x 6.4 x 0.98 in (45.8 x 16.3 x 2.5 cm)
Weight 2 lb (0.9 kg) minimum
Electrical Operating voltage + 5VDC ± 5%
Power consumption 50-mA maximum (with three LEDs ON)
System interface USB Type A plug connector
ESD CE level 4, 15-kV air discharge
EMI – RFI Conforms to FCC rules for a Class B computing device
Microsoft PC 99 – 2001 Functionally compliant
Mechanical Languages 38 available
Keycaps Low-profile design
Switch actuation 55-g nominal peak force with tactile feedback
Switch life 20 million keystrokes (using Hasco modified tester)
Switch type Contamination-resistant switch membrane
Key-leveling mechanisms For all double-wide and greater-length keys
Cable length 6 ft (1.8 m)
Microsoft PC 99 – 2001 Mechanically compliant
Acoustics 43-dBA maximum sound pressure level
Environmental Operating temperature 50° to 122° F (10° to 50° C)
Non-operating temperature -22° to 140° F (-30° to 60° C)
Operating humidity 10% to 90% (non-condensing at ambient)
Non-operating humidity 20% to 80% (non-condensing at ambient)
Operating shock 40 g, six surfaces
Non-operating shock 80 g, six surfaces
Operating vibration 2-g peak acceleration
Non-operating vibration 4-g peak acceleration
Drop (out of box) 26 in (66 cm) on carpet, six-drop sequence
Drop (in box) 42 in (107 cm) on concrete, 16-drop sequence
Approvals UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC
Ergonomic compliance ANSI HFS 100, ISO 9241-4, and TUVGS
Kit contents Keyboard, installation guide, warranty card, safety and comfort guide

PS/2 Standard Keyboard Physical
characteristics
Keys 104, 105, 106, 107, 109 layout (depending upon country)
Dimensions (L x W x H) 18.0 x 6.4 x 0.98 in (45.8 x 16.3 x 2.5 cm)
Weight 2 lb (0.9 kg) minimum
Electrical Operating voltage + 5VDC ± 5%
Power consumption 50-mA maximum (with three LEDs ON)
System interface PS/2 6-pin mini din connector
ESD CE level 4, 15-kV air discharge
EMI – RFI Conforms to FCC rules for a Class B computing device
Microsoft PC 99 – 2001 Functionally compliant
Mechanical Languages 38 available
Keycaps Low-profile design
Switch actuation 55-g nominal peak force with tactile feedback
Switch life 20 million keystrokes (using Hasco modified tester)
Switch type Contamination-resistant switch membrane
Key-leveling mechanisms For all double-wide and greater-length keys
Cable length 6 ft (1.8 m)
Microsoft PC 99 – 2001 Mechanically compliant
Acoustics 43-dBA maximum sound pressure level
Environmental Operating temperature 50° to 122° F (10° to 50° C)
Non-operating temperature -22° to 140° F (-30° to 60° C)
Operating humidity 10% to 90% (non-condensing at ambient)
Non-operating humidity 20% to 80% (non-condensing at ambient)
Operating shock 40 g, six surfaces
Non-operating shock 80 g, six surfaces
Operating vibration 2-g peak acceleration
Non-operating vibration 4-g peak acceleration
Drop (out of box) 26 in (66 cm) on carpet, six-drop sequence
Drop (in box) 42 in (107 cm) on concrete, 16-drop sequence
Approvals UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC
Ergonomic compliance ANSI HFS 100, ISO 9241-4, and TUVGS
Kit contents Keyboard, keyboard software media, installation guide, warranty card, safety and comfort guide

HP USB Smartcard Keyboard
Physical
characteristics
Keys 104
Form factor USB basic Smart Card keyboard
Colors Carbonite/Silver
Dimensions (H x W x D) 18.2 x 6.3 x 1.3 in (46.3 x 16.1 x 3.3 cm)
Weight 2 lb (0.9 kg) minimum
Electrical Operating voltage + 5VDC ± 5%
Power consumption 100-mA maximum (with four LEDs ON)
System interface USB Type A plug connector
ESD CE level 4, 15-kV air discharge
EMI – RFI Conforms to FCC rules for a Class B computing device
Microsoft PC 99 – 2001 Functionally compliant
Mechanical Languages 30+ available
Keycaps Low-profile design
Switch actuation 55 g nominal peak force with tactile feedback
Switch life 20 million keystrokes (using Hasco modified tester)
Switch type Contamination-resistant membrane
Key-leveling mechanisms For all double-wide and greater-length keys
Cable length 6 ft (1.8 m)
Microsoft PC 99 - 2001 Mechanically compliant
Acoustics 43-dBA maximum sound pressure level
Environmental Operating temperature 50° to 122° F (10° to 50° C)
Non-operating temperature -22° to 140° F (-30° to 60° C)
Operating humidity 10% to 90% (non-condensing at ambient)
Non-operating humidity 20% to 80% (non-condensing at ambient)
Operating shock 40 g, six surfaces
Non-operating shock 80 g, six surfaces
Operating vibration 2-g peak acceleration
Non-operating vibration 4-g peak acceleration
Drop (out of box) 26 in (66 cm) on carpet, six-drop sequence
Drop (in box) 42 in (107 cm) on concrete, 16-drop sequence
SMARTCARD function Support All ISO 7816 smart cards
Interface Reads from and writes to all ISO7816-1, 2, 3, 4 memory and microprocessor smart cards (T=0, T=1)
Chipset SCM STCII
Standard APIs supported PC/SC, EMV2000, SET
Power USB Port
Short circuit detection (protects smart card and reader)
Power supply compliant with ISO7816 and EMV (5V, 60 mA)
Supports 3-V and 5-V cards
Power consumption 250-mA maximum draw (50 mA for the keyboard with three LEDs ON and 200-mA maximum startup current using a high-current, 60-mA smart card)
Communication From card Programmable from 9,600 baud to 115,200 baud
From computer Up to 38,400 baud
Landing mechanism Contact device Friction contact
Card insertions rating Up to 100,000 insertion cycles
Interface modes USB communications through USB port
SCM protocol
Automatic card insertion/removal detection
Reader performance interface USB connection
Electro-magnetic standards USA USAFCC part 15

USB Standard BG1650 Keyboard (gray) Physical
characteristics
Keys 104, 105, 106, 107, 109 layout (depending upon country)
Dimensions (L x W x H) 18.0 x 6.4 x 0.98 in (45.8 x 16.3 x 2. 5 cm)
Weight 2 lb (0.9 kg) minimum
Electrical Operating voltage + 5VDC ± 5%
Power consumption 50-mA maximum (with three LEDs ON)
System interface USB Type A plug connector
ESD CE level 4, 15-kV air discharge
EMI – RFI Conforms to FCC rules for a Class B computing device
Microsoft PC 99 – 2001 Functionally compliant
Mechanical Languages 38 available
Keycaps Low-profile design
Switch actuation 55-g nominal peak force with tactile feedback
Switch life 20 million keystrokes (using Hasco modified tester)
Switch type Contamination-resistant switch membrane
Key-leveling mechanisms For all double-wide and greater-length keys
Cable length 6 ft (1.8 m)
Microsoft PC 99 – 2001 Mechanically compliant
Acoustics 43-dBA maximum sound pressure level
Environmental Operating temperature 50° to 122° F (10° to 50° C)
Non-operating temperature -22° to 140° F (-30° to 60° C)
Operating humidity 10% to 90% (non-condensing at ambient)
Non-operating humidity 20% to 80% (non-condensing at ambient)
Operating shock 40 g, six surfaces
Non-operating shock 80 g, six surfaces
Operating vibration 2-g peak acceleration
Non-operating vibration 4-g peak acceleration
Drop (out of box) 26 in (66 cm) on carpet, six-drop sequence
Drop (in box) 42 in (107 cm) on concrete, 16-drop sequence
Approvals UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC, BG Prufzert Mark
Ergonomic compliance ANSI HFS 100, ISO 9241-4, and TUVGS
Kit contents Keyboard, installation guide, warranty card, safety and comfort guide

HP PS/2 Scroll Mouse Dimensions 3.8 x 6.3 x 11.6 cm (1.5 x 2.5 x 4.6 in)
Weight 4.44 oz (126 g)
Environmental Operating temperature 50° to 122° F (10° to 50° C)
Non-operating temperature 22° to 140° F (-30° to 60° C)
Operating humidity 10% to 90% (non condensing at ambient)
Non-operating humidity 20% to 80% (non condensing at ambient)
Operating shock 40 g, 6 surfaces
Non-operating shock 80 g, 6 surfaces
Operating vibration 2 g peak acceleration
Non-operating vibration 4 g peak acceleration
Drop (out of box) 26 in (66 cm) on carpet, 6-drop sequence
Drop (out of box) 1 m on asphalt tile over concrete, 6-drop sequence
Electrical Operating voltage 5 VDC ± 10%
Power consumption 15 mA
System consumption PS/2 mini-din connector
ESD CE level 4, 15 kV air discharge
EMI-RFI Conforms to FCC rules for a Class B computing device
Microsoft
PC99 – 2001
Functionally compliant
Mechanical Resolution 400 ± 20% DPI
Tracking speed 10 in/s (25.4 cm/s) maximum
Acceleration 100 in/s/s (2.54 m/s/s)
Switch actuation 65 g nominal peak force
Switch life 1,000,000 operations (using Hasco modified tester)
Switch type Low force micro-switches
Tracking mechanism life 155 mi (250 km) at average speed of 10 in/s
Cable length 6 ft (1.8 m)
Microsoft PC99 – 2001 Mechanically compliant
Scroll wheel Width 8 mm
Diameter .99 in (25.2 mm)
Maximum rotation speed 30 mm/s
Switch type Light force micro-switch
Switch life 1 million operations
Mechanical life Minimum 200,000 revolutions
Regulatory approvals Compliant UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC

HP USB Scroll Mouse Environmental Operating temperature 50° to 122° F (10° to 50° C)
Non-operating temperature -22° to 140° F (-30° to 60° C)
Operating humidity 10% to 90% (non condensing at ambient)
Non-operating humidity 20% to 80% (non condensing at ambient)
Operating shock 40 g, 6 surfaces
Non-operating shock 80 g, 6 surfaces
Operating vibration 2 g peak acceleration
Non-operating vibration 4 g peak acceleration
Drop (out of box) 26 in (66 cm) on carpet, 6-drop sequence
1 m on asphalt tile over concrete, 6-drop sequence
Electrical Operating voltage 5 VDC ± 10%
Power consumption 15 mA
System consumption USB Type-A plug connector
ESD CE level 4, 15 kV air discharge
EMI-RFI Conforms to FCC rules for a Class B computing device
Microsoft PC99 – 2001 Functionally compliant
Mechanical Resolution 400 ± 20% DPI
Tracking speed 10 in/s (25.4 cm/s) maximum
Acceleration 100 in/s/s (2.54 m/s/s)
Switch actuation 65 g nominal peak force
Switch life 1,000,000 operations (using Hasco modified tester)
Switch type Low force micro-switches
Tracking mechanism life 155 mi (250 km) at average speed of 10 in/s
Cable length 6 ft (1.8 m)
Microsoft PC99 – 2001 Mechanically compliant
Scroll wheel Width 8 mm
Maximum rotation speed 30 mm/s
Switch type Light force micro-switch
Switch life 1 million operations
Mechanical life Minimum 200,000 revolutions
Regulatory approvals Compliant UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC

HP USB Optical Scroll Mouse

Dimensions (H x L x W) 1.5 x 4.5 x 2.5 in (3.8 x 11.6 x 6.3 cm)
Weight 0.27 lb (0.12 kg)
Cable length 72.8 in (185 cm)
System requirements Microsoft Windows 2000 (Service Pack 4 or greater), Windows XP Home, Windows XP Professional
Available USB port
contents
 Overview      Configurable Components - Select Models (localized by Regions)      Standard Features and Configurable Components      After-Market Options      Technical Specifications      Technical Specifications - Audio      Technical Specifications - Communications      Technical Specifications - Graphics      Technical Specifications - Hard Drives      Technical Specifications - Input/Output Devices      Technical Specifications - Optical Storage      Technical Specifications - Removable Storage      Technical Specifications - Environmental Data line.gif (50 bytes)

Technical Specifications - Optical Storage

SATA SuperMulti LightScribe DVD Writer Drive Height 5.25-inch, half-height, tray-load
Orientation Either horizontal or vertical
Interface type SATA/ATAPI
Disc capacity 8.5 GB DL or 4.7 GB standard
Dimensions (W x H x D) 5.9 x 1.7 x 8.0 in (15.0 x 4.4 x 20.3 cm)
Weight (max) 2.6 lb (1.2 kg)  
Write speeds
DVD-RAM Up to 12X
DVD+R Up to 16X
DVD+RW Up to 8X
DVD+R DL Up to 8X
DVD-R DL Up to 8X
DVD-R Up to 16X
DVD-RW Up to 6X
CD-R Up to 48X
CD-RW Up to 32X
Read speeds DVD-RAM Up to 12X
DVD+RW, DVD-RW, DVD+R DL, DVD-R DL Up to 8X
DVD-ROM DL Up to 8X
DVD-ROM, DVD+R,
DVD-R
Up to 16X
CD-ROM, CD-R Up to 48X
CD-RW Up to 32X
Access time
(typical reads, including settling)
Random
DVD: < 140 ms (typical), CD: < 125 ms (typical)
Full Stroke DVD: < 250 ms (seek), CD: < 210 ms (seek)
Power Source SATA DC power receptacle
DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p
12 VDC ± 5%-200 mV ripple p-p
DC Current 5 VDC (< 1000 mA typical, 1600 mA maximum)
  12 VDC (< 600 mA typical, 1400 mA maximum)
Environmental conditions (operating – non-condensing)
Temperature 41° to 122° F (5° to 50° C)
Relative Humidity 10% to 90%
Maximum Wet Bulb Temperature 86° F (30° C)

SATA DVD+/-RW (DL/DF) LightScribe Drive Height 5.25-inch, half-height, tray-load
Orientation Either horizontal or vertical
Interface type SATA/ATAPI
Disc capacity 8.5 GB DL or 4.7 GB standard
Dimensions (W x H x D) 5.9 x 1.7 x 8.0 in (15.0 x 4.4 x 20.3 cm)
Weight (max) 2.6 lb (1.2 kg)  
Write speeds
DVD+R Up to 16X
DVD+RW Up to 8X
DVD+R DL Up to 8X
DVD-R DL Up to 4X
DVD-R Up to 16X
DVD-RW Up to 6X
CD-R Up to 48X
CD-RW Up to 32X
Read speeds DVD-RAM Up to 4X
DVD+RW, DVD-RW, DVD+R DL, DVD-R DL Up to 8X
DVD-ROM, DVD+R,
DVD-R
Up to 16X
CD-ROM, CD-R Up to 48X
CD-RW Up to 32X
Access time
(typical reads, including settling)
Random
DVD: < 130 ms (typical), CD: < 120 ms (typical)
Full Stroke DVD: < 240 ms (seek), CD: < 200 ms (seek)
Power Source SATA DC power receptacle
DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p
12 VDC ± 5%-200 mV ripple p-p
DC Current 5 VDC (< 1000 mA typical, 1600 mA maximum)
  12 VDC (< 600 mA typical, 1400 mA maximum)
Environmental conditions (operating – non-condensing)
Temperature 41° to 122° F (5° to 50° C)
Relative Humidity 10% to 90%
Maximum Wet Bulb Temperature 86° F (30° C)

SATA CD-RW/DVD-ROM Combo Drive Height 5.25-inch, half-height, tray-load
Orientation Either horizontal or vertical
Interface type SATA/ATAPI
Disc capacity Single layer: Up to 4.7 GB (6 times capacity of CD-ROM)
Double layer: Up to 8.5 GB (12 times capacity of CD-ROM)
Dimensions (W x H x D) 5.9 x 1.7 x 8.0 in (15.0 x 4.4 x 20.3 cm)
Weight (max) 2.6 lb (1.2 kg)  
Write speeds
CD-R Up to 48X
CD-RW Up to 32X
Read speeds DVD+R/-R/+RW/
-RW/+R DL /-R DL
Up to 8X
DVD-ROM Up to 16X
CD-ROM, CD-R Up to 48X
CD-RW Up to 32X
Access time
(typical reads, including settling)
Random
DVD: < 140 ms (typical), CD: < 125 ms (typical)
Full Stroke DVD: < 250 ms (typical), CD: < 210 ms (typical)
Power Source SATA DC power receptacle
DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p
12 VDC ± 5%-200 mV ripple p-p
DC Current 5 VDC (< 1000 mA typical, < 1600 mA maximum)
  12 VDC (< 600 mA typical, < 1400 mA maximum)
Environmental (all conditions non-condensing)
Temperature 41° to 122° F (5° to 50° C)
Relative Humidity 10% to 90%
Maximum Wet Bulb Temperature 86° F (30° C)

SATA DVD-ROM Drive Height 5.25-inch, half-height, tray-load
Orientation Either horizontal or vertical
Interface type SATA/ATAPI
Disc capacity Single layer: Up to 4.7 GB (6 times capacity of CD-ROM)
Double layer: Up to 8.5 GB (12 times capacity of CD-ROM)
Dimensions (W x H x D) 5.9 x 1.7 x 8.0 in (15.0 x 4.4 x 20.3 cm)
Weight (max) 2.6 lb (1.2 kg)  
Read speeds DVD+R/-R/+RW/
-RW/+R DL /-R DL
Up to 8X
DVD-ROM Up to 16X
DVD-RAM Up to 4X
CD-ROM, CD-R Up to 48X
  CD-RW Up to 32X
Removable Storage – Media Compatibility – DVD-ROM Media Read Write
CD-ROM Yes No
CD-R Yes No
CD-RW Yes No
DVD-ROM Yes No
DVD-ROM DL Yes No
DVD-RAM Yes No
DVD+R Yes No
DVD+R DL Yes No
  DVD+RW Yes No
  DVD-R Yes No
  DVD-RW Yes No
  DVD-R DL Yes No
Access times
(typical reads, including setting)
Random
DVD: < 140 ms (typical), CD: < 125 ms (typical)
Full Stroke DVD: < 250 ms (seek), CD: < 210 ms (seek)
Cache Buffer 2 MB (minimum)
Data Transfer Modes ATA PIO mode 4 (16.7 MB/s); ATA Multi-word DMA mode 2 (16.7 MB/s); ATA UltraDMA Mode 3 (44.4 MB/s -default)
Power Source SATA DC power receptacle
DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p
12 VDC ± 5%-200 mV ripple p-p
DC Current 5 VDC – <1000 mA typical, < 1600 mA maximum
12 VDC –< 600 mA typical, < 1400 mA maximum
Environmental
(all conditions
non-condensing)

Temperature 41° to 122° F (5° to 50° C)
Relative Humidity 10% to 90%
Maximum Wet Bulb Temperature 86° F (30° C)
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Technical Specifications - Removable Storage

HP 16-in-1 Media Card Reader USB Interface USB 2.0 High-speed device
Advance protocol support

Supports hardware ECC (Error Correction Code) function

  • Supports hardware CRC (Cyclic Redundancy Check) function
  • Supports MS 4-bit parallel transfer mode
  • Supports MS-PRO 4-bit parallel transfer mode
  • Supports SD 4-bit parallel transfer mode
  • Supports high-speed 50-MHz SD 4-bit card (version 1.1)
  • Support high-speed 52-MHz MMC 8-bit card
Supported media type with card adapter
  • MicroSD (T-Flash)
  • Memory Stick Micro
Mechanical  
Environmental Operational Environmental Extremes Test Parameters/Conditions – Power applied, unit operating on system ±5% nominal supply voltage.
10°C 10% R.H. ≥ 24 hours
10°C 90% R.H. ≥ 24 hours
20°C 90% R.H. ≥ 24 hours
30°C 90% R.H. ≥ 24 hours
40°C 90% R.H. ≥ 24 hours
50°C 90% R.H. ≥ 24 hours
50°C 10% R.H. ≥ 24 hours
Storage Environmental Extremes Test Parameters/Conditions
60°C @ 80% R.H. for 96 hours
-30°C @ 20% R.H. for 48 hours
No power applied
Delta °C < 1.0°C/min
Delta % R.H. < 1.5% R.H./min
Approvals USB-IF, WHQL, Compliant with USB Mass Storage Class Bulk only Transport Specification Rev. 1.0, Compliant Intel Front Panel I/O Connectivity Design Guide V. 1.2
FCC, CE, BSMI, C-Tick, VCCI, MIC, cUL, TUV-T
contents
 Overview      Configurable Components - Select Models (localized by Regions)      Standard Features and Configurable Components      After-Market Options      Technical Specifications      Technical Specifications - Audio      Technical Specifications - Communications      Technical Specifications - Graphics      Technical Specifications - Hard Drives      Technical Specifications - Input/Output Devices      Technical Specifications - Optical Storage      Technical Specifications - Removable Storage      Technical Specifications - Environmental Data line.gif (50 bytes)

Technical Specifications - Environmental Data

Eco-Label Certifications and declarations

This product has received or is in the process of being certified to the following approvals and may be labeled with one or more of these marks:

  • ENERGY STAR
  • US Federal Energy Management Program (FEMP)
  • Taiwan Green Mark
  • China Energy Conservation Program
  • IT ECO declaration
  • EPEAT Rated – SILVER
  • Korea Eco-label
  • Japan PC Green label*

* This product conforms to the examination standards (2003 version) under JEITA's 'PC Green Label System.'

 
Small Form Factor
 
System Configuration The configuration used for the Energy Consumption and Declared Noise Emissions data for the Small Form Factor Desktop model is based on a typically configured product.
Energy Consumption      
 
115 VAC
230 VAC
100 VAC
  Normal Operation
58.3 W
57.2 W
58.5 W
  Sleep (ENERGY STAR low power mode)
2.73 W
2.70 W
2.72 W
  Off
1.82 W
1.80 W
1.80 W
Heat Dissipation*
115 VAC
230 VAC
100 VAC
  Normal Operation
198.9 BTU/hr
195.2 BTU/hr
199.6 BTU/hr
  Sleep
9.3 BTU/hr
9.2 BTU/hr
9.3 BTU/hr
  Off
6.2 BTU/hr
6.1 BTU/hr
6.1 BTU/hr
  * Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour.

This product is in compliance with US executive order 13221, WOL (wake on LAN) disabled.

Declared Noise Emissions
(in accordance with
ISO 7779 and ISO 9296)
     

System Fan Off
Sound Power
(LWAd, bels)
Sound Pressure
(LpAm, decibels)
 
  Idle
4.0
30
 
  Fixed Disk (random writes)
4.0
30
 
  Optical Drive (sequential reads)
5.1
42
 
Longevity and Upgrading

This product is designed to be upgraded, possibly extending its useful life by several years. Spare parts are available throughout the warranty period and for up to 5 years after the end of production. Upgradeability features contained in the product include:

  • AMD socket AM2
  • 8 USB ports
  • 2 empty low profile PCI slots
  • 1 empty low profile PCIe x1 slot
  • 1 empty low profile PCIe x16 slot
  • 3.5-inch internal drive bay
  • 1 3.5-inch external drive bay
  • 1 5.25-inch external drive bay
  • 4 memory slots
  • 1 second Serial port (optional)
Batteries

This product complies with ISO standards:

  • EU Directive 91/ 157/ EEC
  • EU Directive 93/ 86/ EEC
  • EU Directive 98/ 101/ EEC

Batteries used in the product do not contain:

  • Mercury greater the 5ppm by weight
  • Cadmium greater than 10ppm by weight
  • Lead greater than 4000ppm by weight.

Battery size: CR2032 (coin cell)
Battery type: Lithium

Additional Information
  • This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive – 2002/95/EC.
  • This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water and Toxic Enforcement Act of 1986
  • This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive – 2002/96/EC.
  • This product is in compliance with the IEEE 1680 (EPEAT) standard at the Silver level (see http://www.epeat.net)
  • Plastics parts weighing over 25 grams used in the product are marked per ISO 11469 and ISO1043.
  • This product contains 0% recycled materials (by wt.)
  • This product is 92% recyclable when properly disposed of at end of life.
  Packaging Materials Corrugated Paper 1400 g
    EPE Foam 240 g
    LDPE Bag 10 g
 
  • The EPE foam packaging material is made from 30 to 60% recycled content.
  • The corrugated paper packaging materials contains at least 80% recycled content.
 
Microtower
 
System Configuration The configuration used for the Energy Consumption and Declared Noise Emissions data for the Microtower Desktop model is based on a typically configured product.
Energy Consumption      
 
115 VAC
230 VAC
100 VAC
  Normal Operation
63.2 W
63.5 W
62.2 W
  Sleep (ENERGY STAR low power mode)
2.75 W
2.81 W
2.81 W
  Off
2.46 W
2.63 W
2.10 W
Heat Dissipation*
115 VAC
230 VAC
100 VAC
  Normal Operation
215.5 BTU/hr
216.5 BTU/hr
212.3 BTU/hr
  Sleep
9.4 BTU/hr
9.6 BTU/hr
9.6 BTU/hr
  Off
8.4 BTU/hr
9.0 BTU/hr
7.2 BTU/hr
  * Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour.

This product is in compliance with US executive order 13221, WOL (wake on LAN) disabled.

Declared Noise Emissions
(in accordance with
ISO 7779 and ISO 9296)
     

System Fan Off
Sound Power
(LWAd, bels)
Sound Pressure
(LpAm, decibels)
 
  Idle
4.0
30
 
  Fixed Disk (random writes)
4.1
31
 
Longevity and Upgrading

This product is designed to be upgraded, possibly extending its useful life by several years. Spare parts are available throughout the warranty period and for up to 5 years after the end of production. Upgradeability features contained in the product include:

  • AMD socket AM2
  • 8 USB ports
  • 2 empty full-height PCI slots
  • 1 empty full-height PCIe x1 slot
  • 1 empty full-height PCIe x16 slot
  • 2 internal 3.5-inch drive bays
  • 1 external 3.5-inch drive bay
  • 2 internal 5.25-inch drive bays
  • 4 memory slots
  • 1 second Serial port (optional)
Batteries

This product complies with ISO standards:

  • EU Directive 91/ 157/ EEC
  • EU Directive 93/ 86/ EEC
  • EU Directive 98/ 101/ EEC

Batteries used in the product do not contain:

  • Mercury greater the 5ppm by weight
  • Cadmium greater than 10ppm by weight
  • Lead greater than 4000ppm by weight.

Battery size: CR2032 (coin cell)
Battery type: Lithium

Additional Information
  • This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive – 2002/95/EC.
  • This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water and Toxic Enforcement Act of 1986).
  • This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive – 2002/96/EC.
  • This product is in compliance with the IEEE 1680 (EPEAT) standard at the Silver level (see http://www.epeat.net)
  • Plastics parts weighing over 25 grams used in the product are marked per ISO 11469 and ISO1043.
  • This product contains 0% recycled materials (by wt.)
  • This product is 97% recyclable when properly disposed of at end of life.
  Packaging Materials Corrugated Paper 19410 g
    EPE Foam 254 g
    LDPE Bag 63 g
 
  • The EPE foam packaging material is made from 30 to 60% recycled content.
  • The corrugated paper packaging materials contains at least 80% recycled content.
   
Microtower and Small Form Factor
RoHS Compliance Hewlett-Packard is committed to compliance with all applicable environmental laws and regulations, including the European Union Restriction of Hazardous Substances (RoHS) Directive. HP's goal is to exceed compliance obligations by meeting the requirements of the RoHS Directive on a worldwide basis. From July 1, 2006, RoHS substances will be virtually eliminated (virtually = to levels below legal limits) for all HP electronic products subject to the RoHS Directive, except where it is widely recognized that there is no technically feasible alternative (as indicated by an exemption under the EU RoHS Directive).
Material Usage

This product does not contain any of the following substances in excess of regulatory limits (refer to the HP General Specification for the
Environment at http://www.hp.com/hpinfo/globalcitizenship/environment/
supplychain/gen_specifications.html
):

  • Asbestos
  • Certain Azo Colorants
  • Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
  • Cadmium
  • Chlorinated Hydrocarbons
  • Chlorinated Paraffins
  • Formaldehyde
  • Halogenated Diphenyl Methanes
  • Lead carbonates and sulfates
  • Lead and Lead compounds
  • Mercuric Oxide Batteries
  • Nickel – finishes must not be used on the external surface designed to be frequently handled or carried by the user.
  • Ozone Depleting Substances
  • Polybrominated Biphenyls (PBBs)
  • Polybrominated Biphenyl Ethers (PBBEs)
  • Polybrominated Biphenyl Oxides (PBBOs)
  • Polychlorinated Biphenyl (PCB)
  • Polychlorinated Terphenyls (PCT)
  • Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been voluntarily removed from most applications.
  • Radioactive Substances
  • Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Packaging

HP follows these guidelines to decrease the environmental impact of product packaging:

  • Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging materials.
  • Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
  • Design packaging materials for ease of disassembly.
  • Maximize the use of post-consumer recycled content materials in packaging materials.
  • Use readily recyclable packaging materials such as paper and corrugated materials.
  • Reduce size and weight of packages to improve transportation fuel efficiency.
  • Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.
End-of-life Management and Recycling Hewlett-Packard offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner.

The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for each product type for use by treatment facilities. This information (product disassembly instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM customers who integrate and re-sell HP equipment.
Hewlett-Packard Corporate Environmental Information For more information about HP's commitment to the environment:
[link to new HP white paper now in progress]
Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www.hp.com/hpinfo/globalcitizenship/environment/productdesign/ecolabels.html
ISO 14001 certificates:
http://www.hp.com/hpinfo/globalcitizenship/environment/operations/envmanagement.html

© Copyright 2008 Hewlett-Packard Development Company, L.P.
The information contained herein is subject to change without notice.

Athlon and Sempron are registered trademarks or trademarks of AMD Corporation in the U.S. and/or other countries.. Microsoft and Windows are U.S. registered trademarks of Microsoft Corporation. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.


   DA-12546 38 - Version 38 - October 29, 2008