contents
 Overview      Standard Features and Configurable Components      System Details      After-Market Options      Memory      Storage      Technical Specifications - Audio      Technical Specifications - Communications      Technical Specifications - Graphics      Technical Specifications - Input/Output Devices      Technical Specifications - Hard Drives      Technical Specifications - Optical Storage      Technical Specifications - Removable Storage      Technical Specifications - Environmental Data line.gif (50 bytes)

Overview

HP Compaq dx2250 Microtower Business PC

HP recommends
Windows Vista® Business
 
Microtower
1.
Monitor (sold separately)
6.
(2) full-height PCI 2.3 slots, (1) PCI-E x1 slot,
(1) PCI-E x16 slot
2.
PS/2 Scroll Mouse
7.
(4) USB 2.0 ports, (1) serial port, (1) parallel port, (2) PS/2, (1) RJ-45, (1) VGA, (1) audio in – (1) audio out – (1) MIC
3.
HP Standard Keyboard
8.
250-watt max power supply
4.
(2) USB 2.0 ports, audio ports
9.
(2) external 5.25" drive bays for optional optical drives; (1) external 3.5" drive bay for optional media reader or diskette drive
5.
(2) internal 3.5" drive bays   
At A Glance
  • AMD Athlon™ 64 X2 Dual-Core, Athlon 64, and Sempron™ processors with HyperTransport™ technology
  • ATI Radeon Xpress 1150 chipset featuring integrated ATI graphics
  • PCI Express I/O bus
  • Integrated SATA 3.0-Gb/s controller
  • Integrated Realtek RTL8139/810x Family Fast Ethernet (10/100) Network Connection
  • Choice of hard drives and optical drives
  • DDR2 SDRAM system memory
  • Protected by HP Services. Terms and conditions vary by country. Certain restrictions and exclusions apply.

NOTE: All models and features may not be available in all countries.

contents
 Overview      Standard Features and Configurable Components      System Details      After-Market Options      Memory      Storage      Technical Specifications - Audio      Technical Specifications - Communications      Technical Specifications - Graphics      Technical Specifications - Input/Output Devices      Technical Specifications - Hard Drives      Technical Specifications - Optical Storage      Technical Specifications - Removable Storage      Technical Specifications - Environmental Data line.gif (50 bytes)

Standard Features and Configurable Components

Processor and Speed
One of the following
AMD Sempron Processors with HyperTransport Technology:
AMD Sempron 3000+ Processor (1.6-GHz, 256K L2 cache, 1600-MHz FSB)
AMD Sempron 3200+ Processor (1.8-GHz, 128K L2 cache, 1600-MHz FSB)
AMD Sempron 3400+ Processor (1.8-GHz, 256K L2 cache, 1600-MHz FSB)
AMD Sempron 3500+ Processor (2.0-GHz, 128K L2 cache, 1600-MHz FSB)
AMD Sempron 3600+ Processor (2.0-GHz, 256K L2 cache, 1600-MHz FSB)
AMD Sempron 3800+ Processor (2.2-GHz, 256K L2 cache, 1600-MHz FSB)
AMD Sempron LE-1200 Processor (2.1-GHz, 512K L2 cache, 800-MHz FSB)
AMD Sempron LE-1250 Processor (2.2-GHz, 512K L2 cache, 800-MHz FSB)
AMD Athlon 64 Processors with HyperTransport Technology:
Athlon 64 3500+ Processor (2.2-GHz, 512K L2 cache, 2000-MHz FSB)
Athlon 64 3800+ Processor (2.4-GHz, 512K L2 cache, 2000-MHz FSB)
Athlon 64 4000+ Processor (2.6-GHz, 512K L2 cache, 2000-MHz FSB)
AMD Athlon X2 Dual-Core Processors with HyperTransport Technology:
Athlon X2 BE-2300 Processor (1.9-GHz, 2x512K L2 cache, 2000-MHz FSB)
Athlon X2 BE-2350 Processor (2.1-GHz, 2x512K L2 cache, 2000-MHz FSB)
Athlon X2 BE-2400 Processor (2.3-GHz, 2x512K L2 cache, 2000-MHz FSB)
AMD Athlon 64 X2 Dual-Core Processors with HyperTransport Technology:
Athlon 64 X2 Dual-Core 3800+ Processor (2.0-GHz, 2x512K L2 cache, 2000-MHz FSB)
Athlon 64 X2 Dual-Core 4000+ Processor (2.1-GHz, 2x512K L2 cache, 2000-MHz FSB)
Athlon 64 X2 Dual-Core 4200+ Processor (2.2-GHz, 2x512K L2 cache, 2000-MHz FSB)
Athlon 64 X2 Dual-Core 4400+ Processor (2.3-GHz, 2x512K L2 cache, 2000-MHz FSB)
Athlon 64 X2 Dual-Core 4600+ Processor (2.4-GHz, 2x512K L2 cache, 2000-MHz FSB)
Athlon 64 X2 Dual-Core 4800+ Processor (2.5-GHz, 2x512K L2 cache, 2000-MHz FSB)
Athlon 64 X2 Dual-Core 5000+ Processor (2.6-GHz, 2x512K L2 cache, 2000-MHz FSB)
Athlon 64 X2 Dual-Core 5200+ Processor (2.6-GHz, 2x1MB L2 cache, 2000-MHz FSB)
Athlon 64 X2 Dual-Core 5400+ Processor (2.8-GHz, 2x512K L2 cache, 2000-MHz FSB)
Athlon 64 X2 Dual-Core 5600+ Processor (2.8-GHz, 2x1MB L2 cache, 2000-MHz FSB)
Athlon 64 X2 Dual-Core 6000+ Processor (3.0-GHz, 2x1MB L2 cache, 2000-MHz FSB)

Operating System
One of the following
Preinstalled Genuine Windows Vista Business 32*
Genuine Windows XP Professional SP2
Genuine Windows XP Home SP2
Red Flag Linux (China Only)
Free DOS (not available in China)
* Certain Windows Vista product features require advanced or additional hardware. See http://www.microsoft.com/windowsvista/getready/hardwarereqs.mspx and http://www.microsoft.com/windowsvista/getready/capable.mspx for details. Windows Vista Upgrade Advisor can help you determine which features of Windows Vista will run on your computer. To download the tool, visit http://www.windowsvista.com/upgradeadvisor.
NOTE: Drivers for Windows Vista are continually being made available for download from http://www.hp.com. Windows Vista support for all hardware and software features of this product is planned by April 1, 2007.

Application Software
(availability varies by region)
Microsoft Office 2003 Basic
Microsoft Office 2003 Small Business
Microsoft Office 2003 Professional
Microsoft Office 2007 Basic
Microsoft Office 2007 SBE
Microsoft Office 2007 Professional
Microsoft Works
HP Backup and Recovery Manager
Roxio DigitalMedia Plus (by SONIC)*
Intervideo WinDVD*
Symantec Antivirus 2005 with 60 day Live Update Subscription (availability varies by region)
Sun Java Runtime Environment
Google Toolbar
* Supporting software available with certain optical drive configurations

Hard Drives 80-GB Serial ATA 3.0-Gb/s Hard Drive (7200 rpm)
160-GB Serial ATA 3.0-Gb/s Hard Drive (7200 rpm)
250-GB Serial ATA 3.0-Gb/s Hard Drive (7200 rpm)

System Memory 256-MB DDR2 Synch DRAM PC2-5300 (667-MHz) Non-ECC (1 x 256-MB)
512-MB DDR2 Synch DRAM PC2-5300 (667-MHz) Non-ECC (1 x 512-MB)
512-MB DDR2 Synch DRAM PC2-5300 (667-MHz) Non-ECC (2 x 256-MB)
1-GB DDR2 Synch DRAM PC2-5300 (667-MHz) Non-ECC (1 x 1-GB)
1-GB DDR2 Synch DRAM PC2-5300 (667-MHz) Non-ECC (2 x 512-MB)
2-GB DDR2 Synch DRAM PC2-5300 (667-MHz) Non-ECC (2 x 1-GB)

Storage
One or more of the following (see Storage section below)
Diskette Drive
1.44-MB Diskette Drive
Media Reader
HP 16-in-1 Media Reader and additional USB 2.0 port
Optical Drives (Serial ATA)
SATA CD-ROM drive (available in APJ only; not supported by Windows Vista)
SATA DVD-ROM Drive
SATA CD-RW/DVD-ROM Combo Drive (not supported by Windows Vista)
SATA DVD+/-RW (DL/DF) LightScribe Drive

Keyboard -
One of the following
HP PS/2 Standard Keyboard
HP USB Standard Keyboard

Mouse -
One of the following
PS/2 2-Button Scroll Mouse
PS/2 2-Button Optical Scroll Mouse
USB 2-Button Optical Scroll Mouse
USB 2-Button Scroll Mouse

Audio Realtek High Definition audio codec
Internal PC speaker

Communication Integrated Realtek RTL8139/810x Family Fast Ethernet (10/100) Network Connection
Intel PRO/1000 PT PCIe Gigabit Ethernet NIC
Agere 56K PCI Modem

GraphicsIntegrated ATI graphics processor (provided by the Radeon Xpress 1150 chipset)
ATI RADEON X1300 (256MB DH) PCIe Graphics Card
ATI RADEON X1300 (256MB SH) PCIe Graphics Card

Miscellaneous HP Firewire / IEEE 1394 PCI Card (full height)
contents
 Overview      Standard Features and Configurable Components      System Details      After-Market Options      Memory      Storage      Technical Specifications - Audio      Technical Specifications - Communications      Technical Specifications - Graphics      Technical Specifications - Input/Output Devices      Technical Specifications - Hard Drives      Technical Specifications - Optical Storage      Technical Specifications - Removable Storage      Technical Specifications - Environmental Data line.gif (50 bytes)

System Details

Base Unit
  • Micro ATX microtower chassis, including power supply and front bezel
  • Five (5) drive bays and four expansion slots
  • Microsoft operating system CD
  • Active type heatsink
  • 92 x 92 x 25 mm chassis fan
  • System board with ATI Radeon Xpress 1150 chipset, integrated Realtek RTL8139/810x Family Fast Ethernet (10/100) Network Connection, integrated graphics and audio, 2 PCI slots, 1 PCI Express x1 slot, 1 PCI Express x16 slot, 2 DDR2 DIMM memory slots
  • (4) Serial ATA data connectors
  • (2) Serial ATA data cables
  • (1) Parallel ATA data connector (no PATA data cables are included)
  • Product documentation on CD
  • Power cord

Slots PCI Two (2) full-height PCI 2.3 slots on PCA
One (1) full-height PCI Express x1 slot on PCA
One (1) full-height PCI Express x16 slot on PCA (for graphic cards)
Memory Expansion Two (2) DIMM slots (2 GB maximum memory support)

Bays Internal Two (2) 3.50"
External Two (2) 5.25”
One (1) 3.50”

USB SupportEHCI high-speed USB 2.0 controller
Two (2) front ports; Four (4) rear ports, Two (2) internal ports on motherboard

Interfaces (Legacy) One (1) parallel port
One (1) serial port
One (1) PS/2 keyboard port
One (1) PS/2 mouse port
One (1) analog VGA video port
One (1) line in; one (1) line out; one (1) mic in
One (1) RJ45 network port

Weight and Dimensions Chassis Dimensions
(H x W x D)
13.90 x 6.89 x 16.38 in (353 x 175 x 416 mm)
Packaged Dimensions
(L x W x H)
22.25 x 19.63 x 16.31 in (565.15 x 498.5 x 414.3 mm) (NA)
21.10 x 19.53 x 15.008 in (536.0 x 496.0 x 383.0 mm) (EMEA)
System Weight 21.16 lb (9.6 kg)
Shipping Weight 30.86 lb (14.0 kg)

Technology and Features Memory Type
  • PC2-5300 DDR2 SDRAM (667-MHz) non-ECC
  • 2 GB maximum system memory
Hard Drive Interfaces Supported
  • Serial ATA 3.0-Gb/s hard drives are supported

Chassis Front Panel
  • Power button
  • Power On LED
  • HDD Activity LED
Cooling Solutions Supported
  • Power Supply Fan (variable speed)
  • Aluminum active heatsink (variable speed)
  • Chassis fan (variable speed)
Slots Supported Four (4) full-height expansion slots
Front I/O Two (2) USB 2.0 ports
Rear I/O Standard Micro ATX I/O connectors, including four (4) USB 2.0 ports
Drive Bays
  • Two (2) 5-1/4” external
  • One (1) 3-1/2” external
  • Two (2) 3-1/2” internal
Internal Speaker Standard
Security Padlock loop
Power Supply 250-watt ATX Power Supply – PFC/non-PFC with a 115v/230v line switch (varies by country/region)

Unit Environment and Operating ConditionsGeneral Unit Operating Guidelines
  • Keep the computer away from excessive moisture, direct moisture and the extremes of heat and cold, to ensure that unit is operated within the specified operating range.
  • Leave a 4 in (10.2 cm) clearance on all vented sides of the computer to permit the required airflow.
  • Never restrict airflow into the computer by blocking any vents or air intakes.
  • Do not stack computers on top of each other or place computers so near each other that they are subject to each other's re-circulated or preheated air.
  • Occasionally clean the air vents on the front, back, and any other vented side of the computer. Lint, dust and other foreign matter can block the vents and limit the airflow.
  • If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must be provided on the enclosure, and the same operating guidelines listed above will still apply.
Temperature Range
  • Operating: 50° to 95° F (10° to 35° C)
  • Non-operating: –22° to 140° F (–30° to 60° C)
Relative Humidity
  • Operating: 10% to 90% (non-condensing at ambient)
  • Non-operating: 5% to 95% (non-condensing at ambient)
Maximum Altitude
(unpressurized)
  • Operating: 10,000 ft (3048 m)
  • Non-operating: 30,000 ft (9000 m)
NOTE: Operating temperature is de-rated 1.0 deg C per 1000 ft (300 m) to 10,000 ft (3000 m) above sea level, no direct sustained sunlight. Maximum rate of change is 10 deg C/Hr. The upper limit may be limited by the type and number of options installed.

System BoardProcessor
  • Socket AM2 industry standard Micro ATX form factor
  • Support single AMD Athlon 64 X2 Dual-Core, Athlon 64, or Sempron processor
PWM
  • Intersil 6566 VRM 10.1
Chipset
  • ATI Radeon Xpress 1150
  • ATI RS485 (Northbridge), ATI SB600 (Southbridge)
Super I/O
  • W83627EHG
Front Side Bus Frequency
  • 533/800 MHz
Memory
  • DDR2 SDRAM
  • 2 x DIMM slots
Clock Generator
  • ICS 951412GLFT
Integrated Graphics
  • Built-in ATI graphics processor
    provided by the ATI Radeon Xpress 1150 chipset
Audio
  • Realtek High Definition (HD) audio codec
LOM
  • Realtek RTL8139/810x Family Fast Ethernet (10/100)
IDE
  • Support all PIO modes
  • 1 x IDE ports support up to 2 devices
  • Support Ultra ATA 33/66/100
Serial
  • Four Serial ATA interfaces support data transfer rates up to 3.0 Gb/s
Expansion Slots
  • 2 x PCI 2.3 slots
  • 1 x PCI Express x1 slot
  • 1 x PCI Express x16 slot
BIOS
  • LPC EEPROM
Industrial Standard
  • PCI 2.3 compliant
  • USB 2.0
Rear Side I/O Ports
  • 1 x PS/2 keyboard port
  • 1 x PS/2 mouse port
  • 4 x USB 2.0 ports
  • 1 x RJ-45 10/100 port
  • 1 x serial port
  • 1 x parallel port
  • 1 x DB 15 pin analog VGA port
  • 3 x audio ports
On Board I/O Interfaces
  • 1 x ATX power connector
  • 1 x +12V power connector
  • 1 x Floppy connector
  • 1 x Front panel connector, Switch, LED (ON/Flash/OFF)
  • 2 x Fan headers for CPU, chassis, with voltage/fan speed control
  • 1 x ATAPI headers-CD IN
  • 1 x header to support 2 USB 2.0 ports at front side
  • 1 x header to support USB media reader
Board Size
  • Micro-ATX, PCB Size: 9.6 x 9.0 in (24.38 x 22.86 cm)
  • 4-layer PCB with green color
Additional Features
  • Bootable without keyboard, mouse or monitor
  • Keyboard/mouse/USB wake up
  • Support S3, S4 and S5
  • ACPI status
  • Hardware monitor capability
  • CPU fan speed control

Network Interface  Integrated Realtek RTL8139/810x Fast Ethernet Network Controller
Hardware Highlights
  • PCI interfaces
Features
  • 10-Mbps and 100-Mbps operation
Intel PRO/1000 PT PCIe Gigabit NIC
Hardware Highlights
  • PCI interfaces
Features
  • 10-Mbps, 100-Mbps and 1000-Mbps operation

WirelessWireless A+G PCI Card (full height bracket)

Power Supply
  • ATX Power Supply – Passive PFC/non-PFC with a 115v/230v line switch
  • Passive Power Factor Correction (PFC) – with line switch set to 230V – No PFC in 115V line switch position
  • 90 to 140VAC, or 180 to 264VAC operating voltage range
  • 100 to 127VAC, or 200 to 240VAC rated voltage range
  • 50–60 Hz rated line frequency
  • 47–63 Hz operating line frequency range
  • 250 watt maximum rated power
  • 80-mm power supply fan – variable speed for optimum acoustics
  • (2) PATA device power connectors
  • (4) SATA device power connectors

Power Conservation ‘Energy Saver‘
  • APM 1.2 support
  • Screen blanking
  • Hard drive 'Idle' mode
  • System Idle mode
  • ~2 watt power consumption in ES mode – suspend to RAM (S3) (instantly available PC)
  • Processor/Cache memory power-down (S3)

System Environmental Specs
  • Values are subject to change without notification and are for reference only.
  • Performance of system, options, and ancillary equipment will vary depending on the system configuration.
  • Levels presented do not account for non-HP/Compaq installed hardware.
Ambient Air TemperatureOperating50° to 95°F (10° to 35°C) at sea level with an altitude de-rating of 1.0°C per every 1000 ft (300 m) above sea level to a maximum of 8000 ft (2500 m), no direct sustained sunlight. Maximum rate of change is 77°F/Hr (25°C/Hr). The upper limit may be limited by the type and number of options installed.
Storage–22° to 140°F (–30° to 60°C) –
Maximum rate of change: 410°F/Hr (210°C/Hr).
HumidityOperating10% to 90% relative humidity (Rh), 86°F (30°C) maximum wet bulb temperature, non-condensing
Storage10% to 95% relative humidity (Rh), 101.66°F (38.7°C) maximum wet bulb temperature, non-condensing
AltitudeOperating0 to 10,000 feet (0 to 3048 meters) – This value may be limited by the type and number of options installed. Maximum allowable altitude change rate is 1,000 ft/min (304.8 m/min).
Non-Operating0 to 30,000 feet (0 to 9,144 meters) – Maximum allowable altitude change rate is 1200 ft/min (365.76 m/min).
ShockListed are the levels of shock the product can withstand with NO damage being incurred. The values represent peak input acceleration during an 2~3 ms half-sine shock pulse, 11 ms trapezoidal shock pulse.
Non-Operating40 g (Half-sine Shock)
40 g (Trapezoidal Shock)
VibrationListed are the levels of vibration the product can withstand with NO damage being incurred. The values represent a flat random vibration input acceleration profile across the given frequency range.
OperatingRandom vibration at 5Hz@0.00025G²/Hz, 10Hz@0.01G²/Hz, 100Hz@0.01G²/Hz, 300Hz@0.00001G²/Hz
5Hz to 300Hz, (0.25G's nominal).
Non-OperatingRandom vibration at 0.008G²/Hz,
10Hz to 500Hz, (2 Grms nominal).

Service and Support

On-site WarrantyNote 1: One-year (1-1-1) limited warranty delivers one year of on-site, next business-dayNote 2 service for parts and labor and includes free telephone supportNote 3 24 x 7. Global coverageNote 2 ensures that any product purchased in one country and transferred to another non-restricted country will remain fully covered under the original warranty and service offering. One-year onsite and labor are not available in all countries.

NOTE 1: Terms and conditions may vary by country. Certain restrictions and exclusions apply. Other warranty variations may be offered in your region.
NOTE 2: On-site service may be provided pursuant to a service contract between HP and an authorized HP third-party provider, and is not available in certain countries. Global service response times are based on commercially reasonable best effort and may vary by country.
NOTE 3: Technical telephone support applies only to HP-configured Compaq and third-party HP-qualified hardware and software. Toll-free calling and 24 x 7 support may not be available in some countries.
contents
 Overview      Standard Features and Configurable Components      System Details      After-Market Options      Memory      Storage      Technical Specifications - Audio      Technical Specifications - Communications      Technical Specifications - Graphics      Technical Specifications - Input/Output Devices      Technical Specifications - Hard Drives      Technical Specifications - Optical Storage      Technical Specifications - Removable Storage      Technical Specifications - Environmental Data line.gif (50 bytes)

After-Market Options

Communications NICs  
Intel PRO/1000 PT PCIe Gigabit NIC Card
EH352AA
Wireless LAN  
HP Wireless A+G PCI Card (North America only)
EA118AA
HP Wireless A+G PCI Card (WW except North America)
PZ928AA
Modems  
Agere 2006 PCI High-Speed 56K International SoftModem
EK694AA

Hard Disk Drives HP 250-GB SATA 3.0-Gb/s Hard Drive
PY278AA
HP 160-GB SATA 3.0-Gb/s Hard Drive
PY277AA
HP 80-GB SATA 3.0-Gb/s Hard Drive
PY276AA

Removable Storage Devices Diskette Drive  
HP 1.44-MB Internal Diskette Drive
AG295AA
HP 1.44-MB USB Diskette Drive – External
DC141B
16-in-1 Media Reader
EM718AA
USB Drive Key  
HP 1-GB Drive Key II Flash Drive
AG382AA
HP (APJ) 512-MB Drive Key II Flash Drive
ED516AA

Input Devices Keyboards  
HP PS/2 Standard Keyboard
DT527A
HP USB Standard Keyboard
DT528A
Mice
HP PS/2 2-Button Scroll Mouse
DD440B
HP PS/2 2-Button Optical Scroll Mouse
EY703AA
HP USB 2-Button Scroll Mouse
DD441B
HP USB 2-Button Optical Scroll Mouse
DC172B

MemoryHP 1-GB PC2-5300 (DDR2-667 MHz) DIMM
PX976AA
HP 512-MB PC2-5300 (DDR2-667 MHz) DIMM
PX975AA
HP 256-MB PC2-5300 (DDR2-667 MHz) DIMM
PX974AA
NOTE: The HP Compaq dx2200 Microtower memory frequency is clocked at 630 MHz.

Audio HP Satellite Speakers
ZD929AA

GraphicsATI RADEON X1300 (256MB DH) PCIe Graphics Card
AH050AA
ATI RADEON X1300 (256MB SH) PCIe Graphics Card
AG392AA

Optical Drives HP SATA CD-ROM Drive (available in Asia Pacific and Japan only)
AH045AA
HP SATA CD-RW/DVD-ROM Combo Drive
AH046AA
HP SATA DVD-ROM Drive
AH047AA
HP SATA DVD+/-RW (DL/DF) LightScribe Drive
AH048AA

Security HP Business PC Security Lock Kit
PV606AA

Miscellaneous Accessories HP Firewire / IEEE 1394 PCI Card
PA997A

Monitors CRTs
HP s7540 17" (16.0" vis) CRT Monitor
PF997AA#XXX
HP v7650 17" (16.0" vis) Flat-face CRT Monitor
PF996AA#XXX
TFTs
HP L1506 15" TFT Flat Panel Monitor – Analog only
PX848AA#XXX
HP L1706 17" TFT Flat Panel Monitor – Analog only
PX849AA#XXX
HP L1740 17" TFT Flat Panel Display – Analog/Digital
PL766AA#XXX
HP L1755 17" TFT Flat Panel Display – Analog/Digital
PL777AA#XXX
HP L1906 19" TFT Flat Panel Display – Analog only
PX850AA#XXX
HP L1940T 19" TFT Flat Panel Display – Analog/Digital
EM869AA#XXX
HP L1955 19" TFT Flat Panel Display – Analog/Digital
PD974AA#XXX
HP L2065 20" TFT Flat Panel Display – Analog/Digital
EF227A4#XXX
HP LP2465 24" TFT Widescreen Flat Panel Display – Analog/Digital
EF224A4#XXX
GSA Monitors
HP L717g 17" GSA Flat Panel Monitor
EE191AA#XXX
HP L919g 19" GSA Flat Panel Monitor
EE192AA#XXX
Options
HP Flat Panel Speaker Bar
EE418AA
HP CRT Monitor Multimedia Base
PM552AA
contents
 Overview      Standard Features and Configurable Components      System Details      After-Market Options      Memory      Storage      Technical Specifications - Audio      Technical Specifications - Communications      Technical Specifications - Graphics      Technical Specifications - Input/Output Devices      Technical Specifications - Hard Drives      Technical Specifications - Optical Storage      Technical Specifications - Removable Storage      Technical Specifications - Environmental Data line.gif (50 bytes)

Memory

DDR SYNCH DRAM NON-ECC MEMORY
The ATI Radeon Xpress 1150 chipset supports non-ECC DDR2 memory up to PC2-5300 (667-MHz). Memory upgrades are accomplished by adding single or multiple DIMMs of the same or varied sizes. This chart does not represent all possible memory configurations.

 
MAXIMUM MEMORY
Supports up to 2-GB of DDR2 SYNCH DRAM. Not all memory configurations possible are represented below.
 
DIMM Size
Slot 1
Slot 2
256-MB
256-MB
 
512-MB
512-MB
 
512-MB
256-MB
256-MB
1-GB
1-GB
 
1-GB
512-MB
512-MB
2-GB
1-GB
1-GB
contents
 Overview      Standard Features and Configurable Components      System Details      After-Market Options      Memory      Storage      Technical Specifications - Audio      Technical Specifications - Communications      Technical Specifications - Graphics      Technical Specifications - Input/Output Devices      Technical Specifications - Hard Drives      Technical Specifications - Optical Storage      Technical Specifications - Removable Storage      Technical Specifications - Environmental Data line.gif (50 bytes)

Storage

 
HP Compaq dx2250 Microtower Business PC

Maximum Quantity Supported
Position Supported
Controller
Drive Support
Diskette Drives
1
3
SIO
Media Reader
1
3
Internal USB 2.0 port
CD-ROM Drives
2
1, 2
IDE ATAPI
DVD-ROM Drives
2
1, 2
IDE ATAPI
CD-RW/Combo Drives
2
1, 2
IDE ATAPI
DVD+/-RW Drives
2
1, 2
IDE ATAPI
3.5” Serial ATA Hard Drives
2
4,5
SATA
contents
 Overview      Standard Features and Configurable Components      System Details      After-Market Options      Memory      Storage      Technical Specifications - Audio      Technical Specifications - Communications      Technical Specifications - Graphics      Technical Specifications - Input/Output Devices      Technical Specifications - Hard Drives      Technical Specifications - Optical Storage      Technical Specifications - Removable Storage      Technical Specifications - Environmental Data line.gif (50 bytes)

Technical Specifications - Audio

Integrated Realtek High Definition (HD) Audio Type Integrated  
HD Audio compatible codec Yes  
Audio Jacks Mic-In
Line-In
Line-Out / Headphone Out
Power Support Digital: 3.3V  
  Analog: 5V  
Other Meets performance requirements for audio on PC99/2001 systems
High quality differential CD input
contents
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Technical Specifications - Communications

Intel PRO/1000 PT PCIe Gigabit NIC Connector RJ-45
Controller Intel 82572EI Gigabit Ethernet Controller
Memory Integrated Dual 48K configurable transmit receive FIFO Buffers
Data rates supported 10/100/1000 Mbps
Compliance IEEE 802.1P, 802,1Q, 802.2, 802.3, 802.3AB and 802.3u compliant, 802.3x flow control
Bus architecture PCI-E 1.0a
Data transfer mode Bus-master DMA
Hardware certifications FCC, B, CE, TUV- cTUVus Mark Canada and United States, TUV- GS Mark for European Union
Power requirement Aux 3.3V, 3.0 Watts in 1000base-T and 2.0 Watts in 100Base-T
Boot ROM support Yes
Network transfer rate 10BASE-T (half-duplex) 10 Mbps
10BASE-T (full-duplex) 20 Mbps
100BASE-TX (half-duplex) 100 Mbps
100BASE-TX (full-duplex) 200 Mbps
1000BASE-T (full-duplex) 2000 Mbps (actual rate limited by PCI Bus)
Environmental Operating temperature 32° to 131°F (0° to 55° C)
Operating humidity 85% at 131° F (55° C)
Dimensions 6.4 x 2.6 x 0.8 in (16.3 x 6.6 x 1.9 cm)
Management capabilities ASF, WOL, PXE, DMI, WFM 2.0.

HP Wireless A+G PCIDimensions4.99 x 2.54 x 0.71 in (126.8 x 64.4 x 18.0 mm)
Weight0.268 lb (65 g)
Controller
system interface
Atheros AR5414X chipset
PCI Spec 2.2
Network standardIEEE 802.11a/b/g
Frequency band5.1500 to 5.8500 GHz
2.4000 to 2.4835 GHz
2.4465 to 2.4835 GHz (Europe, Middle East, Asia and Asia Pacific – excluding Japan)
2.4000 to 2.4697 GHz (Japan)
Operating temperature32° to 140° F (0° to 60° C), operating
Storage temperature-4° to 176° F (-20° to 80° C), non-operating
Humidity10% to 85% non-condensing
Operating voltage5V ± 5%
Power consumptionTx/Rx peak 560/250mA @ 3.3V (max.)
Output power (approximately)15 dBM ±2dB
Receive sensitivity-90dBm at 11 Mbps (typical)
Data transfer rateStandard rates of 1, 2, 5.5, 11, 6, 9, 12, 18, 24, 48, 54 and Super AG Mode108-Mbps
SpreadingDSSS (Direct Sequence Spread Spectrum)
Security64(40h) bit, 128(104h) bit, WPA, IEEE802.1X, AES-OCB, AES-CCM, Microsoft PEAP,TKIP, WEP
AntennaExternal 5dBi antenna
Throughput108 Mbps (only with Belkin 54G or above router that supports 108 Mbps speed)200 ft (60.96 m) – Indoor
54 Mbps200 ft (60.96 m) – Indoor
11 Mbps200 ft (60.96 m) – Indoor
CertificationsWi-Fi certified
Certifications for use by countryNorth America: United States, Canada
Europe: Austria, Belgium, Cyprus, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Liechtenstein, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland, United Kingdom
Australia
New Zealand

Agere 56K PCI Modem Data Transmission 56,000 Kbps maximum downstream data
NOTE: 56 Kbps technology refers to download speeds only and requires compatible modems at server sites. Other conditions may limit modem speed. FCC limitations allow a maximum of 53 Kbps during download transmissions.
Data Speeds (Upload only) 33,600/31,200/28,800/26,400/21,600/19,200/16,800/14,400/
12,000/9,600/7,200/4,800/2,400/1,200/300
Data Standards ITU-T V.90, ITU-T, ITU-T V.34, V.44, V.42, V.42bis21, V.32bis, Bell 212A, and Bell 103
Fax Speeds 14,400/12,000/9,600/7,200/4,800/2,400/300 b/s
Fax Mode Capabilities ITU-T T.31 class 1 FAX, V. 17, V.29, V.27ter, and V.21 Channel 2
Error Correction and Data Compression V.44, 42bis, V.42 and MNP2-5
Power Management ACPI; PPMI 1.1 and wake support with PME and Vaux; meets PCI 2.3 requirements and PC 2001 requirements
Upgradeability Driver upgradeable for future enhancements
Video ITU-T V.80 video ready interface
Other TIA/EIA 602 standard AT command set
Integrated DTE interface with speeds of up to 115.2 Kbps, parallel 16550a UART-compatible interface
Optional ring wakeup signal
Operating Temperature 32° to 158° F (0° to 70° C)
Operating Humidity 20% to 90%, non-condensing
Power Requires a 3.3-V auxiliary power rail on PCI bus
Uses only one PCI load (i.e., one grant/request pair), one shared IRQ, one electrical load
Chipset Agere Systems SV92PL – Integrated PCI interface with 5-V tolerant buffers and CardBus support
Dimensions (L X H) Complies with PCI low profile specifications-6.7 x 2.3 in (17.0 x 5.8 cm) and supports high- and low-profile brackets
Connection Single RJ-11 connector
Other Features Digital line protection, call progress monitoring via on-board piezo device, support for high profile and low profile brackets, PnP ID support
Safety UL recognized to UL 1950, 3rd edition (U.S. and Canada); IEC 950 (TUV, NEMKO, DEMKO, SEMKO); CE Mark, EC 950 (TUV, NEMKO, DEMKO, SEMKO, CE mark
EMC FCC Part 15, IC ES003, EN 55022, 3rd edition, EN 55024, annex A, EN 61000-4-6, EN 61000-4-8
Telecom FCC Part 68, IC-CS-03 (Canada); Worldwide PTT approvals
Not available in Korea or the Republic of South Africa.
Health Bare PCB material compliant to 94V-0 or better (marked as such)
Other PC 2001 compliant, PCI version 2.3, WHQL approved; ACPI compliant
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Technical Specifications - Graphics

Integrated ATI graphics provided by the Radeon Xpress 1150 chipset 3D/2D Controller

Full Microsoft DirectX® 9 based with Shader 2.0 support, full precision floating point pixel pipeline, 2x, 4x, or 6x Anti-Aliasing, hidden surface removal using 16, 24, or 32-bit Z-Buffering, and support for 12-bit per pixel formats. Support for Microsoft's DirectDraw, Double Buffering, Virtual Sprites, Transparent Blit, and Masked Blit.

VGA/DVI ControllerIntegrated
Bus TypePCI Express™ x16 for optional graphics upgrade
RAMDACIntegrated
MemoryHYPERMEMORY™ technology offers optional dedicated Local Frame Buffer configuration for a 32-bit or 64-bit interface and up to 128MB of memory. UMA mode operation uses from 32MB up to 256MB of shared system memory.
Controller Clock Speed400 MHz
Overlay PlanesBack end overlay supporting Motion Adaptive De-Interlacing
Maximum Color Depth32 bits/pixel
Maximum Vertical Refresh RateSupports resolutions up to 2045x1536 @ 32bpp
Multi-display SupportSURROUNDVIEW™ support for up to three monitors with an ATI discrete graphics card. One display is supported via the integrated VGA connector. An additional 2 displays can be supported via the ATI discrete graphics card. Dual independent display modes are supported.
Graphics/Video API SupportMicrosoft DirectX 9, DirectXVA®, VMR7, VMR9, GDI/GDI+; OpenGL® 1.4.

ATI RADEON X1300 PCIe Graphics Card
(256 MB)
Bus typePCI Express (x16 lanes)
Maximum vertical refresh rate85 Hz
Display supportIntegrated 400 MHz RAMDAC
Display max resolution2048 x 1536
Board display optionsDVI-I + TV
DVI-I supports analog CRT or flat panel or digital flat panel (using DVI-A, DVI-D or DVI-I connector)
DVI-I supports analog CRT or flat panel (with VGA connector and DVI-I to VGA dongle)
TV connector is a 4-pin mini-DIN S-video connector
Board configuration
SpecificationDescription
Graphics ChipRV515
Core clock450 MHz
Memory clock250 MHz
Frame buffer256 MB DDR2
Languages supported24 languages: English, Arabic, Chinese Simplified, Chinese Traditional, Czechoslovakian, Danish, Dutch, Finnish, French, German, Greek, Hebrew, Hungarian, Italian, Japanese, Korean, Norwegian, Polish, Portuguese, Russian, Spanish, Swedish, Thai, Turkish
Core power25 W (Max board power)
Option kit contents
  • ATI RADEON X1300 PCIe graphics card with full height bracket attached
  • Low profile bracket
  • DVI-to-VGA Adapter
  • Software CD with graphics drivers
  • Warranty documentation
Compliance standardsEMC Emissions:
a) FCC Part 15, Subpart B – Unintentional Radiators, Class B Computing Devices for Home & Office Use
b) CISPR22: 1997/EN 55022:1998 – Class B – Limits and methods of measurement of radio disturbance characteristics of Information Technology Equipment
c) Canadian Standard ICES-003 is equivalent to CISPR22
d) Taiwanese Standard BSMI
e) Japanese VCCI
f) Australian C-Tick

EMC Immunity:
CISPR 24:1997/EN 55024:1998 – Information Technology Equipment – Immunity Characteristics – Limits and Methods of Measurement.

Safety:
UL 60950 (USA) & EN 60950 (EU): Safety of Information Technology Equipment, Including Electrical Business Equipment. All boards meet UL PCB flammability requirements.

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Technical Specifications - Input/Output Devices

HP PS/2 or USB Standard Keyboard Physical
characteristics
Keys 104, 105, 106, 107, 109 layout (depending upon country)
Dimensions (L x W x H) 18.0 x 6.4 x 0.98 in (45.8 x 16.3 x 2.5 cm)
Weight 2 lb (0.9 kg) minimum
Electrical Operating voltage + 5VDC ± 5%
Power consumption 50-mA maximum (with three LEDs ON)
ESD CE level 4, 15-kV air discharge
EMI – RFI Conforms to FCC rules for a Class B computing device
MicrosoftPC 99 – 2001 Functionally compliant
Mechanical Languages 38 available
Keycaps Low-profile design
Switch actuation 55-g nominal peak force with tactile feedback
Switch life 20 million keystrokes (using Hasco modified tester)
Switch type Contamination-resistant switch membrane
Key-leveling mechanisms For all double-wide and greater-length keys
Cable length 6 ft (1.8 m)
Microsoft PC 99 – 2001 Mechanically compliant
Acoustics 43-dBA maximum sound pressure level
Environmental Operating temperature 50° to 122° F (10° to 50° C)
Non-operating temperature -22° to 140° F (-30° to 60° C)
Operating humidity 10% to 90% (non-condensing at ambient)
Non-operating humidity 20% to 80% (non-condensing at ambient)
Operating shock 40 g, six surfaces
Non-operating shock 80 g, six surfaces
Operating vibration 2-g peak acceleration
Non-operating vibration 4-g peak acceleration
Drop (out of box) 26 in (66 cm) on carpet, six-drop sequence
Drop (in box) 42 in (107 cm) on concrete, 16-drop sequence
Approvals UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC
Ergonomic compliance ANSI HFS 100, ISO 9241-4, and TUVGS

HP 2-Button Scroll Mouse (PS/2 or USB) Scroll Wheel8 mm
Maximum Rotation Speed30 mm/s
Switch TypeLight force micro-switch
Switch Life1 million operations
Mechanical LifeMinimum 200,000 revolutions
EnvironmentalOperating Temperature50° to 122° F (10° to 50° C)
Non-operating Temperature-22° to 140° F (-30° to 60° C)
Operating Humidity10% to 90% (non condensing at ambient)
Non-operating Humidity20% to 80% (non condensing at ambient)
Operating Shock40 g, 6 surfaces
Non-operating Shock80 g, 6 surfaces
Operating Vibration2 g peak acceleration
Non-operating Vibration4 g peak acceleration
ElectricalOperating Voltage+ 5VDC ± 10%
Power Consumption15mA
System ConsumptionPS/2 mini-din connector
ESDCE level 4, 15 kV air discharge
EMI-RFIConforms to FCC rules for a Class B computing device
PC98Functionally compliant
MechanicalResolution400 ± 20% DPI
Tracking Speed10 in/s maximum
Acceleration100 in/s
Switch Actuation85 g nominal peak force
Switch Life1,000,000 operations (using Hasco modified tester)
Cable Length2 m
PC98-99Mechanically compliant
Regulatory ApprovalsUL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BCIQ, C-Tick
contents
 Overview      Standard Features and Configurable Components      System Details      After-Market Options      Memory      Storage      Technical Specifications - Audio      Technical Specifications - Communications      Technical Specifications - Graphics      Technical Specifications - Input/Output Devices      Technical Specifications - Hard Drives      Technical Specifications - Optical Storage      Technical Specifications - Removable Storage      Technical Specifications - Environmental Data line.gif (50 bytes)

Technical Specifications - Hard Drives

Serial ATA Hard Drives (7200 rpm) 80 GB Capacity 80,026,361,856 bytes
Height 1 in (2.6 cm)
Width Media diameter: 3.5 in (8.9 cm)
Physical size: 4 in (10.2 cm)
Interface Serial ATA
Synchronous Transfer Rate (Maximum) 3.0 Gb/s
Buffer 8 MB
Seek Time (typical reads, includes controller overhead, including settling) Single Track 1.0 ms
Average 8.5 ms
Full-Stroke 18 ms
Rotational Speed 7,200 rpm
Logical Blocks 156,301,488
Operating Temperature 32° to 140° F (0° to 60° C)
     
160 GB Capacity 160,041,885,696 bytes
Height 1 in (2.6 cm)
Width Media diameter: 3.5 in (8.9 cm)
Physical size: 4 in (10.2 cm)
Interface Serial ATA
Synchronous Transfer Rate (Maximum) 3.0 Gb/s
Buffer 8 MB
Seek Time (typical reads, includes controller overhead, including settling) Single Track 1.0 ms
Average 8.5 ms
Full-Stroke 18 ms
Rotational Speed 7,200 rpm
Logical Blocks 312,581,808
Operating Temperature 32° to 140° F (0° to 60° C)
       
  250 GB Capacity 250,059,350,016 bytes
  Height 1 in (2.6 cm)
  Width Media diameter: 3.5 in (8.9 cm)
Physical size: 4 in (10.2 cm)
  Interface Serial ATA
  Synchronous Transfer Rate (Maximum) 3.0 Gb/s
  Buffer 8 MB
  Seek Time (typical reads, includes controller overhead, including settling) Single Track 0.8 ms
  Average <9.0 ms
  Full-Stroke ≤17 ms
  Rotational Speed 7,200 rpm
  Logical Blocks 488,397,168
  Operating Temperature 41° to 131° F (5° to 55° C)
contents
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Technical Specifications - Optical Storage

SATA DVD-ROM Drive Height 5.25-inch, half-height, tray-load
Orientation Either horizontal or vertical
Interface type SATA/ATAPI
Disc capacity Single layer: Up to 4.7 GB (6 times capacity of CD-ROM)
Double layer: Up to 8.5 GB (12 times capacity of CD-ROM)
Dimensions (W x H x D) 5.9 x 1.7 x 8.0 in (15.0 x 4.4 x 20.3 cm)
Weight (max) 2.6 lb (1.2 kg)
Read speeds DVD+R/-R/+RW/
-RW/+R DL /-R DL
Up to 8X
DVD-ROM Up to 16X
DVD-RAM Up to 4X
CD-ROM, CD-R Up to 48X
CD-RW Up to 32X
Removable Storage - Media Compatibility - DVD-ROM Media Read Write
CD-ROM Yes No
CD-R Yes No
CD-RW Yes No
DVD-ROM Yes No
DVD-ROM DL Yes No
DVD-RAM Yes No
DVD+R Yes No
DVD+R DL Yes No
DVD+RW Yes No
DVD-R Yes No
DVD-RW Yes No
DVD-R DL Yes No
Access times
(typical reads, including setting)
Random DVD: < 140 ms (typical), CD: < 125 ms (typical)
Full Stroke DVD: < 250 ms (seek), CD: < 210 ms (seek)
Cache Buffer 2 MB (minimum)
Data Transfer Modes ATA PIO mode 4 (16.7 MB/s); ATA Multi-word DMA mode 2 (16.7 MB/s); ATA UltraDMA Mode 3 (44.4 MB/s -default)
Power Source SATA DC power receptacle
DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p
12 VDC ± 5%-200 mV ripple p-p
DC Current 5 VDC - <1000 mA typical, < 1600 mA maximum
12 VDC -< 600 mA typical, < 1400 mA maximum
Environmental
(all conditions
non-condensing)
Temperature 41° to 122° F (5° to 50° C)
Relative Humidity 10% to 90%
Maximum Wet Bulb Temperature 86° F (30° C)

SATA CD-RW/DVD-ROM Combo Drive Height 5.25-inch, half-height, tray-load
Orientation Either horizontal or vertical
Interface type SATA/ATAPI
Disc capacity Single layer: Up to 4.7 GB (6 times capacity of CD-ROM)
Double layer: Up to 8.5 GB (12 times capacity of CD-ROM)
Dimensions (W x H x D) 5.9 x 1.7 x 8.0 in (15.0 x 4.4 x 20.3 cm)
Weight (max) 2.6 lb (1.2 kg)
Write speeds CD-R Up to 48X
CD-RW Up to 32X
Read speeds DVD+R/-R/+RW/
-RW/+R DL /-R DL
Up to 8X
DVD-ROM Up to 16X
CD-ROM, CD-R Up to 48X
CD-RW Up to 32X
Access times
(typical reads, including setting)
Random DVD: < 140 ms (typical), CD: < 125 ms (typical)
Full Stroke DVD: < 250 ms (typical), CD: < 210 ms (typical)
Power Source SATA DC power receptacle
DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p
12 VDC ± 5%-200 mV ripple p-p
DC Current 5 VDC - <1000 mA typical, < 1600 mA maximum
12 VDC -< 600 mA typical, < 1400 mA maximum
Environmental
(all conditions
non-condensing)
Temperature 41° to 122° F (5° to 50° C)
Relative Humidity 10% to 90%
Maximum Wet Bulb Temperature 86° F (30° C)

SATA DVD+/-RW LightScribe Drive Height 5.25-inch, half-height, tray-load
Orientation Either horizontal or vertical
Interface type SATA/ATAPI
Disc capacity Single layer: Up to 4.7 GB (6 times capacity of CD-ROM)
Double layer: Up to 8.5 GB (12 times capacity of CD-ROM)
Dimensions (W x H x D) 5.9 x 1.7 x 8.0 in (15.0 x 4.4 x 20.3 cm)
Weight (max) 2.6 lb (1.2 kg)
Write speeds DVD+R Up to 16X
DVD+RW Up to 8X
DVD+R DL Up to 8X
DVD-R DL Up to 4X
DVD-R Up to 16X
DVD-RW Up to 6X
CD-R Up to 48X
CD-RW Up to 32X
Read speeds DVD-RAM Up to 4X
DVD+R/-R/+RW/
-RW/+R DL /-R DL
Up to 8X
DVD-ROM Up to 16X
CD-ROM, CD-R Up to 48X
CD-RW Up to 32X
Access times
(typical reads, including setting)
Random DVD: < 130 ms (typical), CD: < 120 ms (typical)
Full Stroke DVD: < 240 ms (seek), CD: < 200 ms (seek)
Power Source SATA DC power receptacle
DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p
12 VDC ± 5%-200 mV ripple p-p
DC Current 5 VDC - <1000 mA typical, < 1600 mA maximum
12 VDC -< 600 mA typical, < 1400 mA maximum
Environmental
(all conditions
non-condensing)
Temperature 41° to 122° F (5° to 50° C)
Relative Humidity 10% to 90%
Maximum Wet Bulb Temperature 86° F (30° C)
contents
 Overview      Standard Features and Configurable Components      System Details      After-Market Options      Memory      Storage      Technical Specifications - Audio      Technical Specifications - Communications      Technical Specifications - Graphics      Technical Specifications - Input/Output Devices      Technical Specifications - Hard Drives      Technical Specifications - Optical Storage      Technical Specifications - Removable Storage      Technical Specifications - Environmental Data line.gif (50 bytes)

Technical Specifications - Removable Storage

HP 1.44-MB Diskette Drive Size 3.5 in (8.89 cm)  
LED Indicators (front panel) Green  
Read/Write Capacity per Diskette (high/low) 1.44 MB/720 KB  
Drive Height One-third  
Drive Rotation 300 rpm  
Transfer Rate (high/low) 500/250 KB/s  
Bytes/Sector 512  
Sectors/Track (high/low) 18/9  
Tracks/Side (high/low) 80/80  
Access Times Track-to-Track (high/low) 3/6 ms
Average (high/low) 94/173 ms
Settling Time 15 ms
Latency Average 100 ms
Cylinders (high/low) 80/80  
Read/Write Heads Two  

HP 16-in-1 Media Card ReaderUSB interfaceUSB 2.0 High-speed device via PCI card or pass -through via internal USB port of system board
Advance protocol support
  • Supports hardware ECC (Error Correction Code) function
  • Supports hardware CRC (Cyclic Redundancy Check) function
  • Supports MS 4-bit parallel transfer mode
  • Supports MS-PRO 4-bit parallel transfer mode
  • Supports SD 4-bit parallel transfer mode
  • Supports high-speed 50 MHz SD 4-bit card (version 1.1)
  • Support high-speed 52 MHz MMC 8-bit card (version 4.x)
Supported media types
  • Supports CompactFlash Card Type I (CF I), CompactFlash Card Type II (CF II),MicroDrive (MD)
  • Supports 3.3V SmartMedia Card (SM), SmartMedia ROM (SM ROM), xD-Picture Card (xD)
  • Supports Secure Digital Card (SD), Secure Digital ROM Card (SD ROM), miniSD, MultiMediaCard (MMC), Secure MultiMediaCard (Secure MMC), ROM Type MultiMediaCard (MMC ROM), Reduced Size MultiMediaCard (RS MMC), MultiMediaCard 4.0 (MMC Plus), Reduced Size MultiMediaCard 4.0 (MMC Mobile)
  • Support Memory Stick (MS), Memory Stick ROM (MS ROM), MagicGate Memory Stick (MG), Memory Stick Select, Memory Stick Duo (MS Duo), Memory Stick PRO (MS-PRO), Memory Stick PRO Duo (MS PRO Duo)
MechanicalLength (3.5")124.7 cm
Width (3.5")101.6 cm
Height (3.5")25.4 cm
Length (5.25")171.6 cm
Width (5.25")148.9 cm
Height (5.25")42.7 cm
EnvironmentalOperational environmental extremesTest Parameters/Conditions - Power applied, unit operating on system ±5%
nominal supply voltage.
10°C 10% R.H. ≥ 24 hours
10°C 90% R.H. ≥ 24 hours
20°C 90% R.H. ≥ 24 hours
30°C 90% R.H. ≥ 24 hours
40°C 90% R.H. ≥ 24 hours
50°C 90% R.H. ≥ 24 hours
50°C 10% R.H. ≥ 24 hours
Storage environmental extremesTest Parameters/Conditions
60°C @ 80% R.H. for 96 hours
-30°C @ 20% R.H. for 48 hours
No power applied
Delta °C < 1.0°C/min
Delta % R.H. < 1.5% R.H./min
ApprovalsUSB-IF, WHQL, Compliant with USB Mass Storage Class Bulk only Transport Specification Rev. 1.0, Compliant Intel Front Panel I/O Connectivity Design Guide V. 1.2
FCC, CE, BSMI, C-Tick, VCCI, MIC, cUL, TUV-T
contents
 Overview      Standard Features and Configurable Components      System Details      After-Market Options      Memory      Storage      Technical Specifications - Audio      Technical Specifications - Communications      Technical Specifications - Graphics      Technical Specifications - Input/Output Devices      Technical Specifications - Hard Drives      Technical Specifications - Optical Storage      Technical Specifications - Removable Storage      Technical Specifications - Environmental Data line.gif (50 bytes)

Technical Specifications - Environmental Data

Environmental DataEco-Label Certifications & declarations

This product has received or is in the process of being certified to the following approvals and may be labeled with one or more of these marks:

  • US Federal Energy Management Program (FEMP)
  • Taiwan Green Mark
  • IT ECO declaration
System Configuration

The configuration used for the Energy Consumption and Declared Noise Emissions data for the Microtower Desktop model included:

ProcessorAMD Sempron 3600+
Memory512-MB DDR2 Synch DRAM (2 x 256-MB)
Hard Drive80-GB SATA (7200 rpm)
Optical DriveHP DVD ROM
Other Storage 16-in-1 Media Reader
CommunicationsIntegrated Realtek 8100C Fast Ethernet Network Connection, Agere 56K PCI Modem
 
Microtower
Energy Consumption
115VDC
230VDC
100VDC
Normal Operation
61.1 W
61.0 W
60.3 W
Sleep
2.88 W
2.9 W
2.75 W
Off
1.63 W
1.68 W
1.51 W
Heat Dissipation*
115VDC
230VDC
100VDC
Normal Operation
208.53 BTU/hr
208.19 BTU/hr
205.80 BTU/hr
Sleep
9.83 BTU/hr
9.9 BTU/hr
9.37 BTU/hr
Off
5.56 BTU/hr
5.73 BTU/hr
5.15 BTU/hr
*NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour.
Declared Noise Emissions
(in accordance with
ISO 7779 and ISO 9296)
Sound Power
(LWad, bels)
Deskside
Sound Pressure
(LpAm, decibels)
Idle
4.18
31.4
Fixed Disk
(random writes)
4.21
35.9
Optical Drive
(sequential reads)
5.2
46
Longevity and Upgrading

This product is designed to be upgraded, possibly extending its useful life by several years. Spare parts are available throughout the warranty period and for up to 15 months after the end of production. Upgradeability features contained in the product include:

  • 6 USB ports
  • 2 external 5.25" drive bays
  • 2 internal 3.5" drive bays
  • 1 external 3.5" drive bay
  • 2 empty standard PCI slots
  • 1 empty standard PCI-EX1 slot
  • 1 empty standard PCI-EX 16 slot
  • 2 memory slots
  • 1 Serial port
  • 1 Parallel port
Batteries

This product complies with ISO standards:

  • EU Directive 91/ 157/ EEC
  • EU Directive 93/ 86/ EEC
  • EU Directive 98/ 101/ EEC

Batteries used in the product do not contain:

  • Mercury greater the 5ppm by weight
  • Cadmium greater than 10ppm by weight
  • Lead greater than 4000ppm by weight.

Battery size: CR2032 (coin cell)
Battery type: Lithium

Additional Information

This product is in compliance with the IEEE 1680 (EPEAT) standard at the SILVER level, see http://www.epeat.net.

This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive – 2002/95/EC.

This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive – 2002/96/EC.

Plastics parts weighing over 25 grams used in the product are marked per ISO 11469 and ISO1043.

This product contains 70.6% recycled materials (by wt.)

This product is 70.6% recycle-able when properly disposed of at end of life.

Packaging Materials

  • External:
    • Corrugated Paper 1840 g
  • Internal:
    • LDPE Foam 280 g
    • LDPE Bag 50 g
Material Usage

This product does not contain any of the following substances in excess of regulatory limits (refer to the HP General Specification for the Environment at: http://www.hp.com/hpinfo/globalcitizenship/environment/
supplychain/gen_specifications.html
):

  • Asbestos
  • Certain Azo Colorants
  • Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
  • Cadmium
  • Chlorinated Hydrocarbons
  • Chlorinated Paraffins
  • Formaldehyde
  • Halogenated Diphenyl Methanes
  • Lead carbonates and sulfates
  • Lead and Lead compounds
  • Mercuric Oxide Batteries
  • Nickel – finishes must not be used on the external surface designed to be frequently handled or carried by the user.
  • Ozone Depleting Substances
  • Polybrominated Biphenyls (PBBs)
  • Polybrominated Biphenyl Ethers (PBBEs)
  • Polybrominated Biphenyl Oxides (PBBOs)
  • Polychlorinated Biphenyl (PCB)
  • Polychlorinated Terphenyls (PCT)
  • Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been voluntarily removed from most applications.
  • Radioactive Substances
  • Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Packaging

HP follows these guidelines to decrease the environmental impact of product packaging:

  • Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging materials.
  • Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
  • Design packaging materials for ease of disassembly.
  • Maximize the use of post-consumer recycled content materials in packaging materials.
  • Use readily recyclable packaging materials such as paper and corrugated materials.
  • Reduce size and weight of packages to improve transportation fuel efficiency.
  • Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.
End-of-life Management and RecyclingHewlett-Packard offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner.
Hewlett-Packard Corporate Environmental InformationFor more information about HP's commitment to the environment:

Global Citizenship Report:
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications:
http://www.hp.com/hpinfo/globalcitizenship/environment/
productdesign/ecolabels.html

ISO 14001 certificates:
http://www.hp.com/hpinfo/globalcitizenship/environment/
operations/envmanagement.html

© Copyright 2008 Hewlett-Packard Development Company, L.P.
All rights reserved.

The information contained herein is subject to change without notice.

Athlon and Sempron are registered trademarks or trademarks of AMD Corporation in the U.S. an/or other countries. Microsoft and Windows are U.S. registered trademarks of Microsoft Corporation. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.


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