DDR2 SYNCH DRAM NON-ECC MEMORY
non-ECC DDR2 PC2-5300 (667-MHz) memory

CAUTION: You must shut down the computer and disconnect the power cord before adding or removing memory modules. Regardless of the power-on state, voltage is always supplied to the memory modules as long as the computer is plugged in to an active AC outlet. Adding or removing memory modules while voltage is present may cause irreparable damage to the memory modules or system board.

512-MB DDR2 Synch Dram PC2-5300 (667-MHz) Non ECC (1 x 512)

HP dc73 Blade Workstation Client

General Unit Operating Guidelines

• Keep the computer away from excessive moisture, direct moisture and the extremes of heat and cold, to ensure that unit is operated within the specified operating range.
• Leave a 10.2 cm (4 in) clearance on all vented sides of the computer to permit the required airflow.
• Never restrict airflow into the computer by blocking any vents or air intakes.
• Do not stack computers on top of each other or place computers so near each other that they are subject to each other's re-circulated or preheated air.
• Occasionally clean the air vents on the front, back, and any other vented side of the computer. Lint, dust and other foreign matter can block the vents and limit the airflow.
• If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must be provided on the enclosure, and the same operating guidelines listed above will still apply.

Key features of the HP BIOS in the HP dc73 Blade Workstation Client include:

• Deployment and manageability – HP BIOS provides technologies that help integrate the HP Business desktop computer into the enterprise, such as PXE and F10 Setup support for 12 languages.
• Stability – HP BIOS supports the HP stable product roadmap by releasing only critical BIOS changes to the factory and advanced change notification.
• Thermal and power management – The HP BIOS provides and enables thermal and power management technologies so component temperatures are managed for high reliability and to assist in operating the HP Business Desktop computer in any enterprise environment.
• Acoustic performance – Industry leading acoustic emissions across the range of operating conditions.
• Serviceability – HP BIOS provides diagnostic and detailed service information.

Additional HP BIOS Features

• Power-On password – Helps prevent an unauthorized user from powering on the system.
• Administrator password – Also known as the setup password, this helps prevent unauthorized changes to the system configuration. If the administrator password is not known, the BIOS version cannot be changed and changes cannot be made to BIOS settings using F10 setup or under the OS.

• System/Emergency ROM

• Flash ROM

• CMOS Battery Holder for easy Replacement

• 5 Aux Power LED on System PCA

• Processor ZIF Socket for easy Upgrade

• Clear Password Jumper

• DIMM Connectors for easy Upgrade

• Clear CMOS Button

• NIC LEDs (integrated) (Green & Amber)

• Dual Color Power and HD LED - To Indicate Normal Operations and Fault Conditions

• Color coordinated cables and connectors

• Tool-less Hood Removal

• Front power switch

• Green Pull Tabs, and Quick Release Latches for easy Identification

Product can be oriented as a tower (in addition to desktop orientation)

This product has received or is in the process of being certified to the following approvals and may be labeled with one or more of these marks:

• US Federal Energy Management Program (FEMP)
• Taiwan Green Mark
• China Energy Conservation Program
• ECO declaration
• EPEAT Silver Rated
• Korea Eco-label
• Japan PC Green label**

** This product conforms to the examination standards (2003 version) under JEITA's 'PC Green Label System.'

* Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour.

This product is in compliance with US executive order 13221, WOL (wake on LAN) disabled.

This product complies with ISO standards:

• EU Directive 91/ 157/ EEC
• EU Directive 93/ 86/ EEC
• EU Directive 98/ 101/ EEC

Batteries used in the product do not contain:

• Mercury greater the 5ppm by weight
• Cadmium greater than 10ppm by weight
• Lead greater than 4000ppm by weight.

Battery size: CR2032 (coin cell)
Battery type: Lithium

• This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive – 2002/95/EC.
  
• This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water and Toxic Enforcement Act of 1986).
  
• This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive – 2002/96/EC.
  
• This product is in compliance with the IEEE 1680 (EPEAT) standard at the Silver level (see http://www.epeat.net)
  
• Plastics parts weighing over 25 grams used in the product are marked per ISO 11469 and ISO1043.
  
• This product contains 0% recycled materials (by wt.)
  
• This product is >91% recyclable when properly disposed of at end of life.

• The EPE foam packaging material is made from 30 to 40% industrial recycled content.
• The corrugated paper packaging materials contain at least 25% post consumer recycled content.

This product does not contain any of the following substances in excess of regulatory limits (refer to the HP General Specification for the
Environment at http://www.hp.com/hpinfo/globalcitizenship/environment/
supplychain/gen_specifications.html):

• Asbestos
  
• Certain Azo Colorants
  
• Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
  
• Cadmium
  
• Chlorinated Hydrocarbons
  
• Chlorinated Paraffins
  
• Formaldehyde
  
• Halogenated Diphenyl Methanes
  
• Lead carbonates and sulfates
  
• Lead and Lead compounds
  
• Mercuric Oxide Batteries
  
• Nickel – finishes must not be used on the external surface designed to be frequently handled or carried by the user.
  
• Ozone Depleting Substances
  
• Polybrominated Biphenyls (PBBs)
  
• Polybrominated Biphenyl Ethers (PBBEs)
  
• Polybrominated Biphenyl Oxides (PBBOs)
  
• Polychlorinated Biphenyl (PCB)
  
• Polychlorinated Terphenyls (PCT)
  
• Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been voluntarily removed from most applications.
  
• Radioactive Substances
  
• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

HP follows these guidelines to decrease the environmental impact of product packaging:

• Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging materials.
  
• Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
  
• Design packaging materials for ease of disassembly.
  
• Maximize the use of post-consumer recycled content materials in packaging materials.
  
• Use readily recyclable packaging materials such as paper and corrugated materials.
  
• Reduce size and weight of packages to improve transportation fuel efficiency.
  
• Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.

Hewlett-Packard offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner.

The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for each product type for use by treatment facilities. This information (product disassembly instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM customers who integrate and re-sell HP equipment.