Overview

HP rp3000 Point of Sale (POS) System

1.	Hood	6.	Optical drive LED
2.	Power button	7.	Hard drive LEDs
3.	Optical drive bay	8.	Power LEDs (dual color, red for error codes, green for normal)
4.	Optical drive eject	9.	Lock for bezel door with key
5.	Bezel door	10.	Chassis base
NOTE: The HP rp3000 should not be oriented in a towered position.


1.	COM3 port (optional)	12.	Optional powered USB module (shown)
2.	COM4 port (optional)	13.	12V powered USB
3.	Optional serial port card (shown)	14.	24V powered USB
4.	Screws to remove hood	15.	USB 2.0 ports (6)
5.	Optional modem (RJ-11) (shown)	16.	PS/2 mouse port
6.	COM2 port	17.	PS/2 keyboard port
7.	COM1 port	18.	VGA port
8.	Pad lock loop	19.	Audio line out
9.	RJ-45 10/100/1000 LAN jack	20.	Audio line in
10.	Noble lock hole	21.	150W power supply
11.	Kensington lock hole	22.	PCI slot or optional PCIe x1 slot (some models)


HP rp3000 Point of Sale (POS) System shown with optional Integration Tray*


Optional Integration Tray* shown with hand scanner mount


Integration Tray* (Overhead view)
1.	Removeable cable cover integrated into the tray	4.	Dual pencil trays
2.	Repositionable and interchangeable pole display and hand scanner mounts	5.	Keyboard tray
3.	Elevated rp3000 platform to facilitate air intake and cable management

* Availability of Integration Tray varies by region. Please check with your retailer.

Dimensions (HxWxD)	With cable cover: 5.10 x 16.14 x 20.93 in (12.95 x 41.0 x 53.16 cm) Without cable cover: 5.10 x 16.14 x 16.93 in (12.95 x 41.0 x 43.0 cm)
Weight	With cable cover: 4.85 lb (2.2 kg) Without cable cover: 3.97 lb (1.8 kg)

At A Glance

Intel® Atom™ 230 processor
Intel 945GC chipset with ICH7 and integrated Intel GMA 950 graphics
Dual Channel, PC2-3200, PC2-4200, PC2-5300, or PC2-6400 DDR2 system memory
Integrated Broadcom 5764M NIC 10/100/1000
SMART III serial ATA 3.0Gb/s Hard Drives
Manageability tools
Protected by HP Services, including a 3-3-3, standard warranty. Terms and conditions vary by country. Certain restrictions and exclusions apply.

NOTE: All models and features may not be available in all countries.

Standard and Configurable Components

Model Key and Example

NOTE: This diagram is an example that illustrates how to read the model number. It is not intended to give every available configuration choice specified in the body of this document and may include references to modules that are out of date and no longer available.

Operating System – One of the following.	Genuine Windows Vista Business 32* Genuine Windows Vista Business with downgrade to Windows XP Professional custom installed *+ Genuine Microsoft Windows Embedded POSReady 2009 FreeDOS
	* Certain Windows Vista product features require advanced or additional hardware. See: www.microsoft.com/windowsvista/getready/hardwarereqs.mspx and www.microsoft.com/windowsvista/getready/capable.mspx for details. WindowsVista Upgrade Advisor can help you determine which features of Windows Vista will run on your computer. To download the tool, visit: www.windowsvista.com/upgradeadvisor. + Windows Vista Business disk may be included for future upgrade if desired. To qualify for this downgrade an end user must be a business (including governmental or educational institutions) and is expected to order at least 25 customer systems with the same custom image.

Value-added Software (not included with FreeDOS) Not all software included with all models.	HP Client Management Solutions (visit http://www.hp.com/go/easydeploy) HP Backup and Recovery Manager HP Insight Diagnostics McAfee Total Protection Anti-Virus* Microsoft Internet Explorer	Microsoft Office 2007 Basic* Microsoft Office 2007 Professional* HP Open View Management Agent Roxio Creator Business (included with DVD drives) Sun Java Runtime Environment Vista Easy Setup
	* 60 day trial period for McAfee Total Protection for Small Business software. Internet access required to receive updates. First update included. Subscription required for updates thereafter.

Value-added Services and Features	Business-to-Business Portals Factory Express Deployment and Lifecycle Services (sold separately)

Service and Support	On-site Warranty and Service^{NOTE 1}This three-year, limited warranty and service offering delivers three years of on-site, next business-day^{NOTE 2}service for parts and labor and includes free telephone support^{NOTE 3} 24 x 7. Global coverage^{NOTE 3} ensures that any product purchased in one country and transferred to another non-restricted country will remain fully covered under the original warranty and service offering. The rp3000 may not be available in all regions.
	NOTE 1: Terms and conditions may vary by country. Certain restrictions and exclusions apply.
	NOTE 2: On-site service may be provided pursuant to a service contract between HP and an authorized HP third-party provider, and is not available in certain countries. Global service response times are based on commercially reasonable best effort and may vary by country.
	NOTE 3: Technical telephone support applies only to HP-configured, HP and HP-qualified, third-party hardware and software. Toll-free calling and 24 x 7 support may not be available in some countries.

Dimensions and Weight	Chassis Dimensions (HxWxD)	3.35 x 15.17 x 9.70 in (8.5 x 38.5 x 24.6 cm)
	System weight*	17.9 lb (8.1 kg)
	System volume	7.48 liters
	Shipping weight*	20.15 lb (9.14 kg)
	Shipping box dimensions	19.55 x 15.55 x 9.60 in (49.65 x 39.49 x 24.38 cm)
	Monitor weight supported	77 lb (35 kg) maximum
	* Configured with 1 hard drive, 1 optical drive, no diskette drive, USB and COM cards.

Power Supply	150W – Active PFC Power Supply. No line switching required.

Ports	USB	6 USB 2.0 Plus 2 additional USB+POWER on some models; 1 @ 12V, 1 @ 24V
	Serial	2 RS232 individually configurable to power 5V & 12 V. Plus 2 additional RS232 on some models via PCI card. Individually configurable to power 5V and 12V
	Integrated modem	RJ-11 (select models)
	PS/2	2
	Video	1
	Audio	2, line in and line out
	NIC	RJ-45

Chipset	Intel 945GC with ICH7

Processor and Speed*	Intel Atom 230 (1.6 GHz, 512KB L2 cache, 533 MHz FSB)
* Processor is part of the system board and is not upgradeable.

Memory	DDR2 SYNCH DRAM NON-ECC MEMORY Memory upgrades are accomplished by adding single or multiple DIMMs of the same or varied sizes. This chart does not represent all possible memory configurations. The Intel 945GC chipset also supports non-ECC DDR2 PC2-5300 (667 MHz) memory, as well as PC2-3200 and PC2-4200. If speeds are mixed, speed will default to the slowest DIMM.
	512-MB DDR2 Synch DRAM PC2-6400 (800 MHz)* Non ECC (1 x 512 MB)
	1-GB DDR2 Synch DRAM PC2-6400 (800 MHz)* Non ECC (1 x 1 GB)
	1-GB DDR2 Synch DRAM PC2-6400 (800 MHz)* Non ECC (2 x 512 MB)
	2-GB DDR2 Synch DRAM PC2-6400 (800 MHz)* Non ECC (1 x 2 GB)
	2-GB DDR2 Synch DRAM PC2-6400 (800 MHz)* Non ECC (2 x 1 GB)
	* PC2-6400 800 MHz memory will run at rp3000 maximum memory speed of 533 MHz.

Maximum Memory	Supports up to 4 GB of DDR2 Synch DRAM.

Slots	PCI	Full-height, half-length PCI slot or support for (1) optional PCIe x1 slot (full-height, half-length) NOTE: Either the PCI riser or PCIe x1 riser can be installed (not both at the same time) NOTE: Maximum length supported for PCI or PCIe x1 cards is 6.6 in. (16.76 cm)

Storage	Internal bays	(1) 3.5-inch ATA hard drive
	External bay	(1) 5.25-inch optical drive
	Hard Drive Interfaces Supported	(2) Serial ATA interfaces
	Hard Drive Controller Supported	SATA 3.0 Gb/s and 1.5 Gb/s
	Serial-ATA connectors	2
	Hard Drive – One of the following	160-GB, 250-GB SATA 3.0 Gb/s, 7200 rpm
	Removable Storage – One of the following	16X/48X SATA DVD-ROM 16X SATA SuperMulti LightScribe Drive

Front View	Quantity Supported	Position	Controller
Diskette Drives	0	0	N/A
3.5-inch Serial ATA Hard Drive	1	1	SATA
Optical Drive Bay or Carrier for Hard Drive	1	2	SATA

Security	HP Desktop Security Lock Kit (lock and cable) (sold separately)
	Security cable with Kensington lock (sold separately)
	Lockable front door covers access to optical drive and power button
	Computrace agent for tracking and tracing
	Security loop hole diameter	0.276 inch (0.700 cm)

NIC	Broadcom 5764M 10/100/1000 NIC

Communications	HP Wireless A+G PCI Adapter Card (optional)
	HP Wireless 802.11 b/g/n PCIe Card (optional)
	2006 LSI PCIe x1 56K International SoftModem (optional)
	LSI MDC modem*
	* MDC modem is integrated in select models and will not occupy a slot

Graphics	Integrated Intel Graphics Media Accelerator 950.

Audio	Intel integrated high-definition audio with 2-channel Realtek ALC 662 codec

Input/Output Devices	Keyboard – One of the following	PS/2 keyboard USB BG1650 keyboard (EMEA) USB keyboard No keyboard optional
Input/Output Devices	Mouse – One of the following	PS/2 scroll mouse USB scroll mouse Optical scroll mouse No mouse optional

After-Market Options (availability may vary by region)

Communications	HP Wireless A+G PCI Adapter (Americas)	EA118AA
	HP Wireless A+G PCI Adapter (EMEA)	PZ928AA
	HP Wireless 802.11 b/g/n PCIe Card	FH971AA
	Modem RJ11 Telecoms Adapter Kit	DC131C
	2006 Agere PCI 56K International SoftModem	EK694AA
	LSI MDC Modem Kit with RJ11 Cable	AN606AV

Graphics	NVIDIA GeForce 8400 GS 256MB DH PCIe x1, Graphics Card	GJ120AA
	NVIDIA Quadro NVS 290 DH PCIe x1, Graphics Card	KN586AA
	DVI to DVI Cable	DC198A

Hard Drives	HP 80-GB SATA 3.0 Gb/s	PY276AA
	HP 160-GB SATA 3.0 Gb/s	PY277AA
	HP 250-GB SATA 3.0 Gb/s	PY278AA

Optical Drives	16X SATA SuperMulti LightScribe Drive	GF343AA
	16X/48X SATA DVD-ROM	AH047AA

Input/Output Devices	HP PS/2 Keyboard	DT527A
	HP USB Standard Keyboard	DT528A
	HP USB Smartcard Keyboard	ED707AA
	HP PS/2 2-Button Optical Scroll Mouse	EY703AA
	HP USB 2- Button Optical Scroll Mouse	DC172B
	HP USB 2-Button Laser Mouse	GW405AA

POS Model Options	HP Cash Drawer	FK182AA
	HP USB Barcode Scanner	EY022AA
	HP USB POS Keyboard	FK221AA
	HP POS Magnetic Strip Reader Keyboard	FK218AA
	HP USB Single Station Thermal Receipt Printer	FK224AA
	HP USB Multifunction Thermal Receipt Printer with MICR	FK184AA
	HP USB Multifunction Thermal Receipt Printer with MICR and Imaging	FK185AA
	HP Pole Display	FK225AA
	HP Touch Panel Display	RB146AA
	HP rp3000 Integration Tray	FZ569AA

Flash Modules	HP 1GB Flash Module for Windows ReadyBoost (direct attach)	FY318AA

Multimedia	HP Thin USB Powered Speakers	KK912AA

Memory (DIMMs)	HP 512 MB PC2-6400 (DDR2 800 MHz)*	AH056AA
	HP 1 GB PC2-6400 (DDR2 800 MHz)*	AH058AA
	HP 2 GB PC2-6400 (DDR2 800 MHz)*	AH060AA
	* Runs at maximum speed of 533 MHz in rp3000.

Security	Kensington Security Lock Kit	PC766A
	HP Business PC Security Lock Kit	PV606AA

Miscellaneous	HP 2-Port Powered Serial Port Card	KH887AA
	HP 2-port Powered USB Card (rp3000 only)	AQ691AA
	HP PCIe x1 Riser Card (rp3000 only)	FZ435AA
	Belkin USB to Serial Adapter	EM449AA
	HP FireWire (IEEE 1394) PCI Card	PA997A
	HP rp3000 Solution-in-a-box	NA386AA
	Service Preconfig 2x PWRD RS232 5V/12V	GH655AV
	Service Preconfig 4x PWRD RS232 5V/12V	GH656AV
	* For more detail on these preconfiguration options, see the section below on Serial/COM Ports.

Technical Specifications

Unit Environment and Operating Conditions
General Unit Operating Guidelines Keep the computer away from excessive moisture, direct moisture and the extremes of heat and cold, to ensure that unit is operated within the specified operating range. Leave a 20 mm clearance on front side and a 50 mm clearance on the rear side of the computer to permit the required airflow. If within an enclosure, the front side should be 100% open. The clearance between the system and rear of the cabinet must be at least 50 mm with power supply venting area 100% open. Never restrict airflow into the computer by blocking any vents or air intakes. Do not stack computers on top of each other or place computers so near each other that they are subject to each other's re-circulated or preheated air. Occasionally clean the air vents on the front, back, and any other vented side of the computer. Lint, dust and other foreign matter can block the vents and limit the airflow. The HP rp3000 should not be oriented in a towered position.
Temperature Range	Operating: 50° to 104 F (10° to 40° C)* Non-operating: -22° to 140° F(-30° to 60° C)
Relative Humidity	Operating: 20% to 85% (non-condensing at ambient) Non-operating: 5% to 90% (non-condensing at ambient)
Maximum Altitude (unpressurized)	Operating: 10,000 ft (3048 m) Non-operating: 30,000 ft (9144 m)
* Operating temperature is de-rated 1.0 deg C per 300 m (1000 ft) to 3000 m (10,000 ft) above sea level, no direct sustained sunlight. Maximum rate of change is 10 deg C/Hr. The upper limit may be limited by the type and number of options installed.

Power Supply	150-watt -power supply - Active PFC
Operating Voltage Range	90 to 264 VAC
Rated Voltage Range	100 to 240VAC
Rated Line Frequency	50/60 Hz
Operating Line Frequency Range	47 – 63 Hz
Rated Input Current	3 A @ 90 VAC
Heat Dissipation	Typical 150 btu/hr Maximum 785 btu/hr
Power Supply Fan	50 mm two ball bearing fan
ENERGY STAR Compliant	No
FEMP Standby Power Compliant (<2W in S5 – Power Off)*	Yes
Power Consumption in ES Mode – Suspend to RAM (S3) (Instantly Available PC)	< 3 W
Processor/Cache Memory Power -Down (S3)	< 1.84 W
Optical Drive Spins Down When Not In Use	Yes
* Power consumption in the Off/Apparent Off mode is measured and reported with the network interface controller "Wake on LAN" feature disabled in F10 Setup (default is “enabled“).

ROM BIOS Information

Key features of the HP BIOS in the rp3000 include:

Deployment and manageability – HP BIOS provides several technologies that help integrate the HP Business desktop computer into the enterprise, such as PXE, remote configuration, remote control, and F10 Setup support for 12 languages.
Stability – HP BIOS supports the HP stable product roadmap by releasing only critical BIOS changes to the factory and advanced change notification.
Security – HP BIOS offers a robust and flexible set of security features to help the system administrator secure their systems from removal of sensitive data, and help prevent access by unauthorized users, subversion of OS security policies, removal of hardware, flash of rogue BIOS images, and attacks on BIOS settings.
Thermal and power management – The HP BIOS provides and enables thermal and power management technologies to assist in operating the HP Business Desktop computer in any enterprise environment.
Serviceability – HP BIOS provides diagnostic and detailed service information.
Upgrades and recovery – HP BIOS provides numerous ways to upgrade HP Business Desktop computers, including BIOS updates from within DOS (Flashlite), BIOS updates from within Windows (HPQFlash, SSM), HP Client Manager, and fail-safe recovery. In addition, the HP Business Desktop BIOS Utilities tool enables replicated BIOS setup throughout the Enterprise; it is available from within the BIOS software and from the support website.
Computrace agent – For tracking and tracing services available in select countries; separate software and subscription purchase is required.
Acoustic performance – Industry leading acoustic emissions across the range of operating conditions.

Additional HP BIOS Features:

Administrator password – Also known as the setup password, this helps prevent unauthorized changes to the system configuration. If the administrator password is not known, the BIOS version cannot be changed and changes cannot be made to BIOS settings using F10 setup or under the OS.
Advanced Configuration and Power Interface (ACPI) – Represents a significant innovation in power and configuration management, allowing operating systems and applications to manage power based on activity and usage. Provides power conservation features under Windows XP.
Power on Password – Helps prevent an unauthorized user from powering on the system.

Other Features	Description
ACPI-Ready Hardware	Advanced Configuration and Power Management Interface (ACPI). Allows the system to wake from a low power mode. Controls system power consumption, making it possible to place individual cards and peripherals in a low-power or powered-off state without affecting other elements of the system.
SMBIOS Ver. 2.4	System Management BIOS, previously known as DMI BIOS, for system management information
Wired for Management Support	Intel-driven, industry-wide initiative to make Intel architecture-based PCs, servers and mobile computers more inherently manageable right out of the box and over the network
Dual-State Power Button	Power button acts as both an on/off button and suspend-to-sleep button

Serviceability Features of System
Dual Color Power LED on Front of Computer (Indicates Normal Operations and Fault Conditions)
“How To” label on inside of hood illustrates common user upgradeable features; shows how to set the jumpers for the power configurable serial port
Diagnostic LED Explanation Table	Number of 1-second red LED blinks followed by 2-second pause, then repeats: 2-processor thermal protection activated 4-power supply failure 5-memory error 6-video error 7-PCA failure (ROM detected failure prior to video) 8-invalid ROM, bootblock recover mode
System/Emergency ROM	Flash ROM	CMOS Battery Holder for easy Replacement
Flash Recovery with Video	Aux Power LED on System PCA	Over-Temp Warning on Screen (Requires IM Agents)
Clear Password Jumper	DIMM Connectors for easy Upgrade	Restore CD
Clear CMOS Jumper	NIC LEDs (integrated) (Green & Amber)

Serviceability Features of Chassis
D“ Dual Color Power LED – To indicate normal operations and fault conditions	C“ Color coordinated cables and connectors	“How To” label on inside of hood illustrates common user upgradeable features and how to set jumpers for power configurable serial ports
Front power switch	System memory can be upgraded without removing any internal components

Feature	Description
ASF 2.0 support (Alert Standard Format)	Industry-standard specification for network alerting and remote control in operating system-absent environments
Drive Self Tests (DPS)	Drive Protection System A diagnostic hard drive self test. It scans critical physical components and every sector of the hard drive for physical faults and then reports any faults to the user. Running independently of the operating system, it can be accessed through a Windows-based diagnostics utility or through the computer's setup procedure. It produces an evaluation on whether the hard drive is the source of the problem and needs to be replaced. The system expands on the Self-Monitoring, Analysis, and Reporting Technology (SMART), a continuously running systems diagnostic that alerts the user to certain types of failures.
DPS Access through F10 Setup during Boot
SMART Technology (Self-Monitoring, Analysis and Reporting Technology)	Allows hard drives to monitor their own health and to raise flags if imminent failures were predicted Predicts failures before they occur. Tracks fault prediction and failure indication parameters such as re-allocated sector count, spin retry count, calibration retry count By avoiding actual hard drive failures, SMART hard drives act as “insurance” against unplanned user downtime and potential data loss from hard drive failure
SMART I – Drive Failure Prediction
SMART II – Off-Line Data Collection
SMART III – Off-Line Read Scanning with Defect Reallocation

Technical Specifications - Audio

High Definition Audio	Type	Integrated
	High Definition Stereo Codec	Yes – Realtek ALC662 codec
	Audio Jacks	Line-In (47-K ohm Input Impedance)
	Audio Jacks	Line-Out * (200 ohms Output Impedance, expects at least a 10-K ohm load)
	Sampling	8 kHz – 192 kHz
	Wavetable Syntheses (software)	Yes – Uses OS soft wavetable
	Analog Audio	Yes
	Number of Channels on Line-Out (mono/stereo)	Stereo (Left & Right channels)
	Internal Speaker	No
	External Speaker Jack (Line-Out)	Yes

Technical Specifications - Communications

Serial/COM Ports	Each serial/communication port on the rp3000 can be configured as a standard 9-pin serial port or configured to deliver power on pins 1 and 9, respectively, of the serial port.



	Item	Serial/COM port	Associated Header/Jumper	Header/Jumper Location	Power Support
	1	COM1	P16	rp3000 motherboard	normal, +5V, +12V
	2	COM2	P17	rp3000 motherboard	normal, +5V, +12V
	3	COM3	J4	Optional Powered Serial Card	normal, +5V, +12V
	4	COM4	J5	Optional Powered Serial Card	normal, +5V, +12V

	Serial/COM port configuration chart:

	Serial/COM Port Preconfiguration Options:
	Two preconfigured serial port jumper configurations are available by selecting one of the following two part numbers when you order the rp3000.
	Service Preconfig 2x PWRD RS232 5V/12V	GH655AV
	Service Preconfig 4x PWRD RS232 5V/12V	GH656AV

	When you order either option, the serial port jumpers will be preconfigured so that 12V will on the DSUB pin 1 and 5V will be on the DSUB pin 9. If you order GH655AV, the TWO serial ports on rp3000 will be configured for power. If you order GH656AV, FOUR serial ports will be configured for power. However, you must first order the HP 2-Port Powered Serial Port Card, option part number KH887AA, since there are only two serial ports on the rp3000. Adding the powered serial card option provides a total of four serial ports.

	Below is a diagram showing the jumper settings for each of these optional preconfigured serial/COM port options.

Integrated Broadcom 5764M Gigabit Ethernet	Connector	RJ-45
	Controller	Broadcom 5764M PCI-Express LAN Controller
	Memory	Integrated 8KB transmit and 48KB receive on chip buffer memory
	Data rates supported	10/100/1000 Mbps
	Compliance	IEEE 802.1P, 802.1Q, 802.2, 802.3, 802.3AB and 802.3u compliant
	Bus architecture	PCI-E v 1.1 compliant
	Data path width	Single channel, PCI-E
	Data transfer mode	Bus-master DMA
	Hardware certifications	FCC, B, CE, TUV- cTUVus Mark Canada and United States, TUV- GS Mark for European Union
	Power requirement	0.85 watts @ +3.3V AUX supply
	Boot ROM support	Yes
	Network transfer mode	Full-duplex Half-duplex (not available for the 1000BASE-T transceiver)
	Network transfer rate	10BASE-T (half-duplex) 10 Mbps
		10BASE-T (full-duplex) 20 Mbps
		100BASE-TX (half-duplex) 100 Mbps
		100BASE-TX (full-duplex) 200 Mbps
		1000BASE-T (full-duplex) 2000 Mbps
	Environmental	Operating temperature	32° to 158°F (0° to 70° C)
		Operating humidity	85% at 131° F (55° C)
	Management capabilities	ASF 2.0, ACPI, WOL, PXE 2.0, Broadcom mgmt utility
	Alerting	ASF 2.0

HP Wireless 802.11b/g/n PCIe	Dimensions (LxH)	3.3 x 4.7 inches (8.5 x 12 cm)
	Weight	0.08 pounds (40 g)
	Controller	Ralink RT2790
	System interface	PCIExpress x1
	Network standard	802.11 b/g/n
	Frequency band	2.400 - 2.497 GHz
	Operating temperature	14° to 149°F, operating (-10° to 65°C, operating)
	Storage temperature	-40° to 176°F, non-operating (-40° to 80°C, non-operating)
	Humidity	10-90% operating 5-95% non-operating
	Operating voltage	3.3V +/- 9% 12V +/- 8%
	Power consumption	Platform/WLAN Mode	Power Consumption
		Maximum Power Consumption	10 Watts
		Transmit Only	4 Watts maximum averaged power over 1 second
		Transmit Packet or Active Scanning	1000 mA peak current for 100 microseconds or longer
		Receive Only Mode or Idle without IEEE PSP mode enabled	3 Watts maximum averaged over 1 second
		Idle, with IEEE PSP mode enabled	1.0 Watts maximum averaged over 1 second
		Transmit Disabled (turned off in software)	50 mW maximum, averaged over 1 second
		Platform in S3 or S4 (power removed from Low Profile PCI Express Card)	5 mW maximum, averaged over 1 second
	Output power (approximately)	802.11b modes	802.11g modes	EWC modes
		+19 dBm +/- 1.0 dB maximum	+17 dBm +/- 1.0 dB maximum	+17 dBm +/- 1.0 dB maximum (total power in all transmit chains)
	Receive sensitivity	Mode	Data rate	Sensitivity
		802.11b	1 Mbps	-94 dBm
		802.11b	11 Mbps	-85 dBm
		802.11g	6 Mbps	-91 dBm
		802.11g	18 Mbps	-85 dBm
		802.11g	48 Mbps	-75 dBm
		802.11g	54 Mbps	-72 dBm
		EWC (2.4 GHz)	6.5 Mbps	-87 dBm
		EWC (2.4 GHz)	54 Mbps	-82 dBm
		EWC (2.4 GHz)	81 Mbps	-78 dBm
		EWC (2.4 GHz)	162 Mbps	-74 dBm
		EWC (2.4 GHz)	270 Mbps	-68 dBm
		EWC (2.4 GHz)	300 Mbps	-64 dBm
	Data transfer rate	Data Rate (MCS)	Minimum Throughput
		1 Mbps (802.11 b)	700 kbps
		2 Mbps (802.11 b)	1.4 Mbps
		5.5 Mbps (802.11 b)	3.5 Mbps
		11 Mbps (802.11 b)	5.9 Mbps
		12 Mbps (802.11 g)	6 Mbps
		18 Mbps (802.11 g)	9 Mbps
		24 Mbps (802.11 g)	12 Mbps
		36 Mbps (802.11 g)	18 Mbps
		48 Mbps (802.11 g)	21 Mbps
		54 Mbps (802.11 g)	22.5 Mbps
		6.5 Mbps (20 MHz EWC)	4.5 Mbps
		13 Mbps (20 MHz EWC)	9 Mbps
		19.5 Mbps (20 MHz EWC)	13.5 Mbps
		26 Mbps (20 MHz EWC)	18 Mbps
		39 Mbps (20 MHz EWC)	27 Mbps
		52 Mbps (20 MHz EWC)	36 Mbps
		58.5 Mbps (20 MHz EWC)	40 Mbps
		65 Mbps (20 MHz EWC)	45 Mbps
		78 Mbps (20 MHz EWC)	54 Mbps
		104 Mbps (20 MHz EWC)	72 Mbps
		117 Mbps (20 MHz EWC)	81 Mbps
		130 Mbps (20 MHz EWC)	91 Mbps
		13.5 Mbps (40 MHz EWC)	8 Mbps
		27 Mbps (40 MHz EWC)	16 Mbps
		40.5 Mbps (40 MHz EWC)	24 Mbps
		54 Mbps (40 MHz EWC)	32 Mbps
		81 Mbps (40 MHz EWC)	48 Mbps
		108 Mbps (40 MHz EWC)	64 Mbps
		121.5 Mbps (40 MHz EWC)	72 Mbps
		135 Mbps (40 MHz EWC)	81 Mbps
Security	IEEE and WiFi compliant 64 / 128 bit WEP encryption AES: CCM 802.1x authentication WPA: 802.1x. WPA-PSK and TKIP WPA2 certification IEEE 802.11i Cisco Certified Extensions, all versions through V5
Antenna	HP part number 497792-001
Certifications	Wi-Fi certified
Certifications for use by country	United States, Canada, Peru, Taiwan

LSI PCIe x1 Hi-Speed 56K International SoftModem	Data Transmission	Technology speeds: 56,000 Kbps maximum downstream data, controllerless
	Data Transmission	NOTE: 56 Kbps technology refers to download speeds only and requires compatible modems at server sites. Other conditions may limit modem speed. FCC limitations allow a maximum of 53 Kbps during download transmissions.
	Data Speeds	(Upload only) 33,600/31,200/28,800/26,400/21,600/19,200/ 16,800/14,400/12,000/9,600/7,200/4,800/2,400/1,200/300
	Data Standards	ITU-T V.90, ITU-T, ITU-T V.34, V.44, V.42, V.42bis21, V.32bis, Bell 212A, and Bell 103
	Fax Speeds	14,400/12,000/9,600/7,200/4,800/2,400/1,200/300 b/s
	Fax Mode Capabilities	ITU-T T.31 class 1 FAX, V. 17, V.29, V.27ter, and V.21 Channel 2
	Error Correction and Data Compression	V.44, 42bis, V.42 and MNP2-5
	Power Management	PCI Bus Power Management Interface Specification (PCI-PM) Revision 1.2, Appendix A. D0, D3hot, and D3cold. Wake on Ring state when in D3cold. If the power management event (PME) feature is enabled in D3cold, a modem can wake the system via WAKE# (WAKEN) or beacon. Meets PCI Express 1.1 standard.
	Upgradeability	Driver upgradeable for future enhancements
	Video	ITU-T V.80 video ready interface
	Other	TIA/EIA 602 standard AT command set
		Integrated DTE interface with speeds of up to 115.2 Kbps, parallel 16550a UART-compatible interface
		Optional ring wakeup signal
	Operating Temperature	32° to 158° F (0° to 70° C)
	Operating Humidity	20% to 90%, non-condensing
	Power	Requires a 3.3-V auxiliary power rail on PCI express bus
	Power	Uses only one PCI express load (i.e., one grant/request pair), one shared IRQ, one electrical load
	Chipset	LSI SV92EX - Integrated PCI interface with 3.3-V tolerant buffers and CardBus support
	Dimensions (L X H)	Complies with PCI express low profile specifications-6.7 x 2.3 in (17.0 x 5.8 cm) and supports high- and low-profile brackets
	Connection	Single RJ-11 connector
	Other Features	Digital line protection, call progress monitoring via on-board piezo device, support for high profile and low profile brackets, PnP ID support
	Safety	UL recognized to UL 1950, 3rd edition (U.S. and Canada); IEC 950 (TUV, NEMKO, DEMKO, SEMKO); CE Mark, EC 950 (TUV, NEMKO, DEMKO, SEMKO, CE mark
	EMC	FCC Part 15, IC ES003, EN 55022, 3rd edition, EN 55024, annex A, EN 61000-4-6, EN 61000-4-8
	Telecom	FCC Part 68, IC-CS-03 (Canada); Worldwide PTT approvals Not available in Korea or the Republic of South Africa.
	Other	The SV92EX device is packaged in a 32-pin micro leadless chip carrier (MLCC). The SV92EX is fully compliant with the PCI Express revision 1.1 specification. WHQL approved; ASPM compliant.

LSI MDC Hi-Speed 56K International SoftModem	Data Transmission	Technology speeds: 56,000 Kbps maximum downstream data, controllerless
	Data Transmission	NOTE: 56 Kbps technology refers to download speeds only and requires compatible modems at server sites. Other conditions may limit modem speed. FCC limitations allow a maximum of 53 Kbps during download transmissions.
	Data Speeds	(Upload only) 33,600/31,200/28,800/26,400/21,600/19,200/ 16,800/14,400/12,000/9,600/7,200/4,800/2,400/1,200/300
	Data Standards	ITU-T V.90, ITU-T, ITU-T V.34, V.44, V.42, V.42bis21, V.32bis, Bell 212A, and Bell 103
	Fax Speeds	14,400/12,000/9,600/7,200/4,800/2,400/1,200/300 b/s
	Fax Mode Capabilities	ITU-T T.31 class 1 FAX, V. 17, V.29, V.27ter, and V.21 Channel 2
	Error Correction and Data Compression	V.44, 42bis, V.42 and MNP2-5
	Power Management	HDA Bus Power Management Interface Specification 2.3 D0, D3hot, and D3cold. Meets AC97' 2.3 specification.
	Upgradeability	Driver upgradeable for future enhancements
	Video	ITU-T V.80 video ready interface
	Other	TIA/EIA 602 standard AT command set
	Other	Integrated DTE interface with speeds of up to 115.2 Kbps, parallel 16550a UART-compatible interface
	Operating Temperature	32° to 158° F (0° to 70° C)
	Operating Humidity	20% to 90%, non-condensing
	Power	HDA bus interface:– Compliant with the Intel High Definition Audio Specification Revision 1.0.– SV92A35 supports 1.5 V and 3.3 V signaling (SV92A3 supports 3.3 V only).AC'97 bus interface:– Compliant with the Audio Codec '97 Specification Revision 2.3. The Delphi modem offer the ability to disable modem in BIOS.
	Power	The SV92A3 and SV92A35V2 devices automatically detect the type of bus connected to the modem and initialize the devices for the correct interface. The automatic bus interface detection feature of the SV92A35V2H device is disabled, and the ASEL pin level of the device is used to determine the bus interface. The SV92A3/SV92A35 device family is packaged in a 16-pin TSSOP (thin shrink small-outline package).
	Chipset	LSI SV92A35V2 – HDA/AC97 integrated modem digital chip using the MDC 1.5 specification and a DAA CSP1040 V2.
	Dimensions (L X H)	Complies with MDC 1.5 specification. The modem measures 27mm X 35mm and.3 mated height single sided board.
	Connection	RJ11 connect via a 2 pin fly-wire from modem to RJ11 connector
	Other Features	Digital line protection, call progress monitoring via on-board piezo device.
	Safety	UL recognized to UL 1950, 3rd edition (U.S. and Canada); IEC 950 (TUV, NEMKO, DEMKO, SEMKO); CE Mark, EC 950 (TUV, NEMKO, DEMKO, SEMKO, CE mark
	EMC	FCC Part 15, IC ES003, EN 55022, 3rd edition, EN 55024, annex A, EN 61000-4-6, EN 61000-4-8
	Telecom	FCC Part 68, IC-CS-03 (Canada); Worldwide PTT approvals Not available in Korea or the Republic of South Africa.
	Other	Two-chip, soft-modem solution with multiplexed High-Definition Audio (HDA) and Audio Codec '97 (AC'97) interfaces:– SV92A3/SV92A35 host interface in a 16-pin TSSOP.– CSP1040 data access arrangement (DAA) in a 20-pin ETSSOP. Both parts are RoHS compliant.

Technical Specifications - Graphics

Integrated Graphics Media Accelerator 950

Graphic Controller

Integrated GMA 950

Bus type

Integrated

RAMDAC

Single 400 MHz integrated

Memory

UMA with DVMT 4.0 support for frame buffer sizes 8-256 MB

Controller clock speed

400 MHz

Overlay planes

One 16-bit video overlay plane

Maximum Color Depth

24 bpp

Maximum vertical refresh rate

85 Hz

Graphics/Video API Support

DirectX 9.0/SM2.0, OpenGL1.4, DXVA1.0, Microsoft Vista

Resolutions Supported¹

Resolution	Maximum Refresh Rate (Hz)
	Analog Connection	Digital Connection
640 x 480	85	60
800 x 600	85	60
1024 x 768	85	60
1280 x 1024	85	60
1600 x 1200	85	60
1920 x 1080	85	60-R²
1920 x 1200	85	60-R²
1920 x 1440	85	N/A
2048 x 1536	75	N/A

NOTES:
¹ Modes listed are supported with a single active display. The supported mode list for multiple active displays is a subset of this list. Not all modes will support video playback and some supported modes may use software MC (motion compensation) rather than hardware MC. Not all modes will support 3D acceleration depending on the system configuration (e.g., resolution selected, size of frame buffer, number of installed memory modules, etc.).
² -R denotes reduced blanking timings (some digital monitors may not support reduced blanking timings).
Other resolutions and refresh rates may be selectable but are not recommended.

Technical Specifications - Powered USB Ports

PoweredUSB Ports	There is support for 2 PoweredUSB ports on the rp3000. The PoweredUSB ports are located on the optional HP designed PoweredUSB add-in card that can install into the rp3000. The +24V PoweredUSB port (red) and the +12V PoweredUSB port (teal) are keyed differentl so that a +12V POS peripheral cannot accidentally be plugged into the +24V port and vice-versa:

	Item	Ports	Rating
	1	+24V	3A
	2	+12V	2.5A

Technical Specifications - Hard Drives

Serial ATA 1.5-Gb/s Hard Drives (7200 rpm)	250 GB	Capacity	250,059,350,016 bytes
		Height	1 in (2.6 cm)
		Width	Media diameter: 3.5 in (8.9 cm) Physical size: 4 in (10.2 cm)
		Interface	Serial ATA (3.0 Gb/s)
		Synchronous Transfer Rate (Maximum)	Up to 3 Gb/s
		Buffer	8 MB
		Seek Time (typical reads, includes controller overhead, including settling)	Single Track	1.0 ms
			Average	8.5 ms
			Full-Stroke	18 ms
		Rotational Speed	7,200 rpm
		Logical Blocks	488,397,168
		Operating Temperature	41° to 131°F (5° to 55°C)

	160-GB	Capacity	163,928,604,672 bytes
		Height	1 in (2.54 cm)
		Width	Media diameter: 3.5 in (8.9.x cm)
			Physical size: 4 in (10.2 cm)
		Interface	Serial ATA (3.0 Gb/s)
		Synchronous Transfer Rate (Maximum)	Up to 3 Gb/s
		Buffer	8 MB
		Seek Time (typical reads, includes controller overhead, including settling)	Single Track	0.9 ms
			Average	9.3 ms
			Full-Stroke	18 ms
		Rotational Speed	7,200 rpm
		Logical Blocks	320,173,056
		Operating Temperature	41° to 131°F (5° to 55°C)

Technical Specifications - Input/Output Devices

USB Keyboard	Physical characteristics	Keys	104, 105, 106, 107, 109 layout (depending upon country)
		Dimensions (L x W x H)	18.0 x 6.4 x 0.98 in (45.8 x 16.3 x 2.5 cm)
		Weight	2 lb (0.9 kg) minimum
	Electrical	Operating voltage	+ 5VDC ± 5%
		Power consumption	50-mA maximum (with three LEDs ON)
		System interface	USB Type A plug connector
		ESD	CE level 4, 15-kV air discharge
		EMI – RFI	Conforms to FCC rules for a Class B computing device
		Microsoft PC 99 – 2001	Functionally compliant
	Mechanical	Languages	38 available
		Keycaps	Low-profile design
		Switch actuation	55-g nominal peak force with tactile feedback
		Switch life	20 million keystrokes (using Hasco modified tester)
		Switch type	Contamination-resistant switch membrane
		Key-leveling mechanisms	For all double-wide and greater-length keys
		Cable length	6 ft (1.8 m)
		Microsoft PC 99 – 2001	Mechanically compliant
		Acoustics	43-dBA maximum sound pressure level
	Environmental	Operating temperature	50° to 122° F (10° to 50° C)
		Non-operating temperature	–22° to 140° F (–30° to 60° C)
		Operating humidity	10% to 90% (non-condensing at ambient)
		Non-operating humidity	20% to 80% (non-condensing at ambient)
		Operating shock	40 g, six surfaces
		Non-operating shock	80 g, six surfaces
		Operating vibration	2-g peak acceleration
		Non-operating vibration	4-g peak acceleration
		Drop (out of box)	26 in (66 cm) on carpet, six-drop sequence
		Drop (in box)	42 in (107 cm) on concrete, 16-drop sequence
	Approvals	UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC
	Ergonomic compliance	ANSI HFS 100, ISO 9241-4, and TUVGS

PS/2 Keyboard	Physical characteristics	Keys	104, 105, 106, 107, 109 layout (depending upon country)
		Dimensions (L x W x H)	18.0 x 6.4 x 0.98 in (45.8 x 16.3 x 2.5 cm)
		Weight	2 lb (0.9 kg) minimum
	Electrical	Operating voltage	+ 5VDC ± 5%
		Power consumption	50-mA maximum (with three LEDs ON)
		System interface	PS/2 6-pin mini din connector
		ESD	CE level 4, 15-kV air discharge
		EMI – RFI	Conforms to FCC rules for a Class B computing device
		Microsoft PC 99 – 2001	Functionally compliant
	Mechanical	Languages	38 available
		Keycaps	Low-profile design
		Switch actuation	55-g nominal peak force with tactile feedback
		Switch life	20 million keystrokes (using Hasco modified tester)
		Switch type	Contamination-resistant switch membrane
		Key-leveling mechanisms	For all double-wide and greater-length keys
		Cable length	6 ft (1.8 m)
		Microsoft PC 99 – 2001	Mechanically compliant
		Acoustics	43-dBA maximum sound pressure level
	Environmental	Operating temperature	50° to 122° F (10° to 50° C)
		Non-operating temperature	–22° to 140° F (–30° to 60° C)
		Operating humidity	10% to 90% (non-condensing at ambient)
		Non-operating humidity	20% to 80% (non-condensing at ambient)
		Operating shock	40 g, six surfaces
		Non-operating shock	80 g, six surfaces
		Operating vibration	2-g peak acceleration
		Non-operating vibration	4-g peak acceleration
		Drop (out of box)	26 in (66 cm) on carpet, six-drop sequence
		Drop (in box)	42 in (107 cm) on concrete, 16-drop sequence
	Approvals	UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC
	Ergonomic compliance	ANSI HFS 100, ISO 9241-4, and TUVGS

USB Standard BG1650 Keyboard (gray)	Physical characteristics	Keys	104, 105, 106, 107, 109 layout (depending upon country)
		Dimensions (L x W x H)	18.0 x 6.4 x 0.98 in (45.8 x 16.3 x 2.5 cm)
		Weight	2 lb (0.9 kg) minimum
	Electrical	Operating voltage	+ 5VDC ± 5%
		Power consumption	50-mA maximum (with three LEDs ON)
		System interface	USB Type A plug connector
		ESD	CE level 4, 15-kV air discharge
		EMI – RFI	Conforms to FCC rules for a Class B computing device
		Microsoft PC 99 – 2001	Functionally compliant
	Mechanical	Languages	38 available
		Keycaps	Low-profile design
		Switch actuation	55-g nominal peak force with tactile feedback
		Switch life	20 million keystrokes (using Hasco modified tester)
		Switch type	Contamination-resistant switch membrane
		Key-leveling mechanisms	For all double-wide and greater-length keys
		Cable length	6 ft (1.8 m)
		Microsoft PC 99 – 2001	Mechanically compliant
		Acoustics	43-dBA maximum sound pressure level
	Environmental	Operating temperature	50° to 122° F (10° to 50° C)
		Non-operating temperature	–22° to 140° F (–30° to 60° C)
		Operating humidity	10% to 90% (non-condensing at ambient)
		Non-operating humidity	20% to 80% (non-condensing at ambient)
		Operating shock	40 g, six surfaces
		Non-operating shock	80 g, six surfaces
		Operating vibration	2-g peak acceleration
		Non-operating vibration	4-g peak acceleration
		Drop (out of box)	26 in (66 cm) on carpet, six-drop sequence
		Drop (in box)	42 in (107 cm) on concrete, 16-drop sequence
	Approvals	UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC, BG Prufzert Mark
	Ergonomic compliance	ANSI HFS 100, ISO 9241-4, and TUVGS

HP PS/2 Scroll Mouse	Dimensions	1.5 x 2.5 x 4.6 in (3.8 x 6.3 x 11.6 cm)
	Weight	4.44 oz (126 g)
	Environmental	Operating temperature	50° to 122° F (10° to 50° C)
		Non-operating temperature	–22° to 140° F (–30° to 60° C)
		Operating humidity	10% to 90% (non-condensing at ambient)
		Non-operating humidity	20% to 80% (non-condensing at ambient)
		Operating shock	40 g, 6 surfaces
		Non-operating shock	80 g, 6 surfaces
		Operating vibration	2 g peak acceleration
		Non-operating vibration	4 g peak acceleration
		Drop (out-of-box)	26 in (66 cm) on carpet, 6-drop sequence
		Drop (out-of-box)	1 m on asphalt tile over concrete, 6-drop sequence
	Electrical	Operating voltage	5 VDC ± 10%
		Power consumption	15 mA
		System consumption	PS/2 mini-din connector
		ESD	CE level 4, 15 kV air discharge
		EMI-RFI	Conforms to FCC rules for a Class B computing device
		Microsoft PC99 – 2001	Functionally compliant
	Mechanical	Resolution	400 ± 20% DPI
		Tracking speed	10 in/s (25.4 cm/s) maximum
		Acceleration	100 in/s/s (2.54 m/s/s)
		Switch actuation	65 g nominal peak force
		Switch life	1,000,000 operations (using Hasco modified tester)
		Switch type	Low force micro-switches
		Tracking mechanism life	155 mi (250 km) at average speed of 10 in/s
		Cable length	6 ft (1.8 m)
		Microsoft PC99 – 2001	Mechanically compliant
	Scroll wheel	Width	8 mm
		Diameter	0.99 in (25.2 mm)
		Maximum rotation speed	30 mm/s
		Switch type	Light force micro-switch
		Switch life	1 million operations
		Mechanical life	Minimum 200,000 revolutions
	Regulatory approvals	Compliant	UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC

USB Scroll Mouse	Environmental	Operating temperature	50° to 122° F (10° to 50° C)
		Non-operating temperature	-22° to 140° F (-30° to 60° C)
		Operating humidity	10% to 90% (non-condensing at ambient)
		Non-operating humidity	20% to 80% (non-condensing at ambient)
		Operating shock	40 g, 6 surfaces
		Non-operating shock	80 g, 6 surfaces
		Operating vibration	2 g peak acceleration
		Non-operating vibration	4 g peak acceleration
		Drop (out-of-box)	26 in (66 cm) on carpet, 6-drop sequence
		Drop (out-of-box)	1 m on asphalt tile over concrete, 6-drop sequence
	Electrical	Operating voltage	5 VDC ± 10%
		Power consumption	15 mA
		System consumption	USB Type-A plug connector
		ESD	CE level 4, 15 kV air discharge
		EMI-RFI	Conforms to FCC rules for a Class B computing device
		Microsoft PC99 – 2001	Functionally compliant
	Mechanical	Resolution	400 ± 20% DPI
		Tracking speed	10 in/s maximum
		Acceleration	100 in/s
		Switch actuation	65 g nominal peak force
		Switch life	1,000,000 operations (using Hasco modified tester)
		Switch type	Low force micro-switches
		Tracking mechanism life	155 mi (250 km) at average speed of 10 in/s
		Cable length	6 ft (1.8 m)
		Microsoft PC99 – 2001	Mechanically compliant
	Scroll wheel	Width	8 mm
		Diameter	0.99 in (25.2 mm)
		Maximum rotation speed	30 mm/s
		Switch type	Light force micro-switch
		Switch life	1 million operations
		Mechanical life	Minimum 200,000 revolutions
	Regulatory approvals	Compliant	UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC

USB Optical Scroll Mouse	Dimensions (H x L x W)	1.5 x 4.5 x 2.5 in (3.8 x 11.6 x 6.3 cm)
	Weight	0.27 lb (0.12 kg)
	Cable length	72.8 in (185 cm)

Technical Specifications - Optical Storage

SATA DVD+/-RW LightScribe Drive	Height	5.25-inch, half-height, tray-load
	Orientation	Either horizontal or vertical
	Interface type	SATA/ATAPI
	Disc capacity	8.5 GB DL or 4.7 GB standard
	Dimensions (HxWxD)	5.9 x 1.7 x 8.0 in (15.0 x 4.4 x 20.3 cm)
	Weight (maximum)	2.6 lb (1.2 kg)
	Write speeds	DVD+R	Up to 16X
		DVD+RW	Up to 8X
		DVD+R DL	Up to 8X
		DVD-R DL	Up to 4X
		DVD-R	Up to 16X
		DVD-RW	Up to 6X
		CD-R	Up to 48X
		CD-RW	Up to 32X
	Read speeds	DVD-RAM	Up to 4X
		DVD+RW, DVD-RW, DVD+R DL, DVD-R DL	Up to 8X
		DVD-ROM, DVD+R, DVD-R	Up to 16X
		CD-ROM, CD-R	Up to 48X
		CD-RW	Up to 32X
	Access time (typical reads, including settling)	Random	DVD: < 130 ms (typical), CD: < 120 ms (typical)
	Access time (typical reads, including settling)	Full Stroke	DVD: < 240 ms (seek), CD: < 200 ms (seek)
	Power	Source	SATA DC power receptacle
		DC Power Requirement	5 VDC ± 5%-100 mV ripple p-p
		DC Power Requirement	12 VDC ± 5%-200 mV ripple p-p
		DC Current	5 VDC (< 1000 mA typical, < 1600 mA maximum)
		DC Current	12 VDC (< 600 mA typical, < 1400 mA maximum)
	Environmental conditions (operating - non-condensing)	Temperature	41° to 122° F (5° to 50° C)
		Relative humidity	10% to 90%
		Maximum wet bulb temperature	86° F (30° C)

SATA DVD-ROM Drive	Height	5.25-inch, half-height, tray-load
	Orientation	Either horizontal or vertical
	Interface type	SATA/ATAPI
	Disc capacity	Single layer: Up to 4.7 GB (6 times capacity of CD-ROM) Double layer: Up to 8.5 GB (12 times capacity of CD-ROM)
	Dimensions (W x H x D)	5.9 x 1.7 x 8.0 in (15.0 x 4.4 x 20.3 cm)
	Weight (max)	2.6 lb (1.2 kg)
	Read speeds	DVD+R/-R/+RW/ -RW/+R DL /-R DL	Up to 8X
		DVD-ROM	Up to 16X
		DVD-RAM	Up to 4X
		CD-ROM, CD-R	Up to 48X
		CD-RW	Up to 32X
	Removable Storage – Media Compatibility – DVD-ROM	Media (READ ONLY – drive is not write capable)
		CD-ROM CD-R CD-RW DVD-ROM DVD-ROM DL DVD-RAM DVD+R DVD+R DL DVD+RW DVD-R DVD-RW DVD-R DL
	Access times (typical reads, including setting)	Random	DVD: < 140 ms (typical), CD: < 125 ms (typical)
		Full Stroke	DVD: < 250 ms (seek), CD: < 210 ms (seek)
		Cache Buffer	2 MB (minimum)
		Data Transfer Modes	ATA PIO mode 4 (16.7 MB/s); ATA Multi-word DMA mode 2 (16.7 MB/s); ATA UltraDMA Mode 3 (44.4 MB/s -default)
	Power	Source	SATA DC power receptacle
		DC Power Requirement	5 VDC ± 5%-100 mV ripple p-p
			12 VDC ± 5%-200 mV ripple p-p
		DC Current	5 VDC (< 1000 mA typical, < 1600 mA maximum)
			12 VDC (< 600 mA typical, < 1400 mA maximum)
	Environmental (all conditions non-condensing)	Temperature	41° to 122° F (5° to 50° C)
		Relative Humidity	10% to 90%
		Maximum Wet Bulb Temperature	86° F (30° C)

Technical Specifications - Environmental Data

Eco Data	Eco-Label Certifications & declarations	This product has received or is in the process of being certified to the following approvals and may be labeled with one or more of these marks: IT ECO declaration
	System Configuration	The configuration used for the Energy Consumption and Declared Noise Emissions data for the Ultra-slim Desktop model is based on a typically configured product.
	Energy Consumption	115 VAC	230 VAC	100 VAC
	Normal Operation	37.917W	35.592W	37.124W
	Sleep	1.421W	1.692W	1.400W
	Off	0.893W	1.147W	0.868W

	Heat Dissipation*	115 VAC	230 VAC	100 VAC
	Normal Operation	130 BTU/hr	122 BTU/hr	127 BTU/hr
	Sleep	5 BTU/hr	6 BTU/hr	5 BTU/hr
	Off	3 BTU/hr	4 BTU/hr	3 BTU/hr
		* Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour. This product is in compliance with US executive order 13221, WOL (wake on LAN) disabled.

Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296)
System Fan Off	Sound Power (LWAd, bels)	Sound Pressure (LpAm, decibels)
Idle	3.6	25
Fixed Disk (random writes)	3.6	25
Longevity and Upgrading	This product can be upgraded, possibly extending its useful life by several years. Upgradeable features and/or components contained in the product may include: 6 standard PC USB ports 2 optional Powered USB ports 2 power configurable serial ports Optional 2 power configurable serial port add-in card (for a total of 4 power configurable serial ports) 1 empty PCI slot standard (or one optional PCIe x1 slot in lieu of the PCI slot) 1 internal drive bay (3.5”) 1 external drive bay (5.25”) 2 memory slots (single channel) Optional Integrated LSI modem Optional Ready Boost module (direct attach). NOTE: Ready Boost module and Powered USB card cannot be installed at the same time, only one or the other. Spare parts are available throughout the warranty period and or for up to 5 years after the end of production.
Batteries	This product complies with ISO standards: EU Directive 91/ 157/ EEC EU Directive 93/ 86/ EEC EU Directive 98/ 101/ EEC Batteries used in the product do not contain: Mercury greater the 5ppm by weight Cadmium greater than 10ppm by weight Lead greater than 4000 ppm by weight. Battery size: CR2032 (coin cell) Battery type: Lithium
Additional information:	This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive – 2002/95/EC. This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive – 2002/96/EC. This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water and Toxic Enforcement Act of 1986). Plastics parts weighing over 25 grams used in the product are marked per ISO 11469 and ISO1043. This product contains 0% recycled materials (by wt.) This product is 93.9% recyclable when properly disposed of at end of life. Packaging Materials External: Wood (Pallet) 14,500 g Polyethylene low density foam 4,578 g Corrugated carton 26,618 g Internal: Corrugated 5,018 g The Wood (Pallet) packaging material is made from 0% recycled content. The Polyethylene low density foam packaging material contains 0% recycled content. The Corrugated carton packaging material is made from 25% recycled content. The Corrugated packaging material contains 25% recycled content.
RoHS Compliance	Hewlett-Packard is committed to compliance with all applicable environmental laws and regulations, including the European Union Restriction of Hazardous Substances (RoHS) Directive. HP's goal is to exceed compliance obligations by meeting the requirements of the RoHS Directive on a worldwide basis. By July 1, 2006, RoHS substances will be virtually eliminated (virtually = to levels below legal limits) for all HP electronic products subject to the RoHS Directive, except where it is widely recognized that there is no technically feasible alternative (as indicated by an exemption under the EU RoHS Directive).
Material Usage	This product does not contain any of the following substances in excess of regulatory limits (refer to the HP General Specification for the Environment at http://www.hp.com/hpinfo/globalcitizenship/environment/ supplychain/gen_specifications.html): Asbestos Certain Azo Colorants Certain Brominated Flame Retardants – may not be used as flame retardants in plastics Cadmium Chlorinated Hydrocarbons Chlorinated Paraffins Formaldehyde Halogenated Diphenyl Methanes Lead carbonates and sulfates Lead and Lead compounds Mercuric Oxide Batteries Nickel – finishes must not be used on the external surface designed to be frequently handled or carried by the user. Ozone Depleting Substances Polybrominated Biphenyls (PBBs) Polybrominated Biphenyl Ethers (PBBEs) Polybrominated Biphenyl Oxides (PBBOs) Polychlorinated Biphenyl (PCB) Polychlorinated Terphenyls (PCT) Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been voluntarily removed from most applications. Radioactive Substances Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Packaging	HP follows these guidelines to decrease the environmental impact of product packaging: Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging materials. Eliminate the use of ozone-depleting substances (ODS) in packaging materials. Design packaging materials for ease of disassembly. Maximize the use of post-consumer recycled content materials in packaging materials. Use readily recyclable packaging materials such as paper and corrugated materials. Reduce size and weight of packages to improve transportation fuel efficiency. Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.
End-of-life Management and Recycling	Hewlett-Packard offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner. The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for each product type for use by treatment facilities. This information (product disassembly instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM customers who integrate and re-sell HP equipment.
Hewlett-Packard Corporate Environmental Information	For more information about HP's commitment to the environment: Global Citizenship Report http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html Eco-label certifications http://www.hp.com/hpinfo/globalcitizenship/environment/ productdesign/ecolabels.html ISO 14001 certificates: http://www.hp.com/hpinfo/globalcitizenship/environment/ operations/envmanagement.html

Certain Windows Vista product features require advanced or additional hardware. Windows Vista Upgrade Advisor can help you determine which features of Windows Vista will run on your computer. To download the tool, visit: http://www.windowsvista.com/upgradeadvisor. For Windows Vista system requirements, visit: http://www.windowsvista.com/systemrequirements.

Intel and Pentium are U.S. registered trademarks of Intel Corporation. Microsoft and Windows are U. S. registered trademarks of Microsoft Corporation. Windows Vista is either a registered trademark or trademark of Microsoft Corporation in the United States and/or other countries. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.

DA-13113 6 - Version 6 - April 28, 2009